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Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system

A fast-curing, engineering plastics technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of moisture sensitivity of polyurethane two-component structural adhesive, pungent taste of acrylic two-component adhesive, and bonding Poor strength stability and other problems, to improve the anti-peel strength, shorten the curing time, and reduce the effect of irritating odor

Inactive Publication Date: 2016-06-08
NANJING NUOBANG NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a fast-curing epoxy system for bonding engineering plastics and its preparation method to solve the problem of the slow curing speed of conventional epoxy resin two-component structural adhesives and the pungent taste of acrylic two-component adhesives. , not suitable for large-scale assembly in clean rooms and polyurethane two-component structural adhesives are sensitive to moisture, resulting in poor bonding strength stability

Method used

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  • Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system
  • Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system
  • Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system

Examples

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Effect test

Embodiment 1

[0033] A fast-curing epoxy system for bonding engineering plastics, which includes component A and component B, and the mass ratio of component A to component B is 2:1;

[0034] Wherein the mass percentage content of each raw material in A component is:

[0035]

[0036] The mass percentage content of each raw material in component B is:

[0037]

[0038] A kind of above-mentioned preparation method for the fast curing epoxy system of bonding engineering plastics, comprises the following steps:

[0039] (a) Weigh according to the mass percentage content of epoxy resin, toughening agent, crosslinking agent, diluent, acrylic and polyurethane in component A, put it into a plastic tank, and stir evenly on a stirring defoaming machine;

[0040] (b) Add heavy calcium powder, stir and mix evenly, then add fumed silica, stir and mix evenly to obtain component A;

[0041] (c) According to the mass percentage of aliphatic amine polyamine in component B, after heating the weighed...

Embodiment 2

[0045] A fast-curing epoxy system for bonding engineering plastics, which includes component A and component B, and the mass ratio of component A to component B is 2:1;

[0046] Wherein the mass percentage content of each raw material in A component is:

[0047]

[0048] The mass percentage content of each raw material in component B is:

[0049]

[0050]

[0051] The preparation method of the above-mentioned fast-curing epoxy system for bonding engineering plastics is the same as that described in Example 1.

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Abstract

The invention relates to the technical field of high polymer material application, and discloses a fast setting epoxy system for bonding engineering plastic and a preparing method of the fast setting epoxy system. The fast setting epoxy system for bonding engineering plastic is prepared from monofunctional epoxy resin, multifunctional acrylic, polyamine-modified epoxy resin, fatty amine polyamine, a tertiary amine accelerator and non-chelation anion metal salt. All the components are optimized and combined so as to complement each other in performance and are in synergic cooperation to form the double-component epoxy resin system superior in comprehensive performance. The preparing method of the fast setting epoxy system comprises the steps that all the raw materials are mixed according to the corresponding mass percentage and heated to obtain a component A and a component B, and then the component A and the component B are smeared to engineering plastic for bonding according to the corresponding mass percentage. By means of the fast setting epoxy system for bonding engineering plastic and the preparing method of the fast setting epoxy system, the peel resistance strength of epoxy glue to engineering plastic is obviously improved, the setting time is shortened, the pungent odor of acrylic is reduced, and the bonding quality of engineering plastic is improved.

Description

technical field [0001] The invention relates to the technical field of application of polymer materials, in particular to a fast-curing epoxy system capable of fast curing and high bonding strength for bonding engineering plastics and a preparation method thereof. Background technique [0002] With the continuous development of the plastics industry, a variety of new engineering plastic materials are constantly emerging. The driving force is mainly from the automobile industry and consumer electronics industry, such as the frequent innovation of notebook computers, tablet computers, and smart phones. Therefore, how to effectively bond these engineering plastic materials during the assembly process to meet the needs of high-efficiency and high-output manufacturing processes has become a problem that should be solved at present. [0003] Two-component structural adhesives are widely used in bonding applications. It is a room temperature storage, solvent-free, easy-to-use syste...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J121/00C09J163/00C09J11/06C08G59/50
CPCC09J121/00C08G59/5013C08L2205/035C09J11/06C08L63/00C08L33/12C08L13/00C08K13/02C08K2003/265C08K3/36
Inventor 刘兵刘勇
Owner NANJING NUOBANG NEW MATERIAL CO LTD
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