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Phosphorus-containing flame retardant low-dielectric resin composition and preparation method and application thereof

一种树脂组合物、阻燃剂的技术，应用在低介电树脂组合物及其制备领域，能够解决含磷阻燃剂阻燃性能不佳、含卤阻燃剂不环保等问题，达到低介电损耗、低基板热膨胀率、低介电特性的效果

Active Publication Date: 2016-03-30
ELITE ELECTRONICS MATERIAL ZHONGSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the disadvantages of using halogen-containing flame retardants in the prior art that are not environmentally friendly and the shortcomings of existing phosphorus-containing flame retardants, the primary purpose of the present invention is to provide a low-dielectric resin composition

Method used

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  • Phosphorus-containing flame retardant low-dielectric resin composition and preparation method and application thereof
  • Phosphorus-containing flame retardant low-dielectric resin composition and preparation method and application thereof
  • Phosphorus-containing flame retardant low-dielectric resin composition and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] Embodiment 1: Preparation of structural formula (three) phosphorus-containing flame retardant

[0087] Stir and mix 206 grams of DPPO (Diphenylphosphine Oxide, diphenylphosphine oxide), 90 grams of dichloro-p-xylene and 1,200 grams of 1,2-dichlorobenzene, and heat the reaction at 160°C for 12 to 24 hours in a nitrogen atmosphere. Cool to room temperature, filter, and vacuum-dry to obtain compound A shown in structural formula (3) as a white powder, wherein the phosphorus content in compound A is about 12%.

[0088] Analysis: TGA test Td value: 379 ° C (5% cracking, see the results figure 1 ); The melting point temperature measured by DSC is 334°C (results see figure 2), while the melting point of the currently used phosphazene compound (SPB-100) is 110°C, the melting point of condensed phosphoric acid ester (PX-200) is 105°C, phosphorus-containing phenolic resin, such as DOPO-bisphenol A phenolic resin, its It is a liquid resin at room temperature. It can be seen th...

Embodiment 2

[0095] Example 2: Preparation of low-dielectric resin composition containing phosphorus flame retardant

[0096] According to the formulations listed in Tables 3 to 8, the relevant components were fully mixed to obtain the resin varnish of the resin composition, wherein E represents the low-dielectric resin composition containing phosphorus flame retardant of the present invention, and C represents a comparative example.

[0097] Table 3 Formula table of low dielectric resin composition containing phosphorus flame retardant (unit: parts by weight)

[0098]

[0099] Table 4 Low-dielectric resin composition formula table containing phosphorus flame retardant (unit: parts by weight)

[0100]

[0101] Table 5 Formula table of low dielectric resin composition containing phosphorus flame retardant (unit: parts by weight)

[0102]

[0103] Table 6 Formula table of low dielectric resin composition containing phosphorus flame retardant (unit: parts by weight)

[0104]

[...

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Abstract

The present invention belongs to the technical field of low-dielectric resin compositions, and discloses a phosphorus-containing flame retardant low-dielectric resin composition and a prepreg, a resin film, a laminated board and a circuit board prepared on the basis of the phosphorus-containing flame retardant low-dielectric resin composition. The resin composition comprises the following components: (A) a phosphorus-containing flame retardant; and (B) a vinyl compound. The phosphorus-containing flame retardant has the structure shown in the formula (I). The phosphorus-containing flame retardant prepared by derivation of diphenylphosphine oxide has no reactive functional group, and has better dielectric properties and a high melting point, a substrate with low thermal expansion coefficient, high heat resistance, high glass transition temperature and low dielectric constant and dielectric loss is prepared from the resin composition prepared by collocation of the vinyl compound, under the premise of no use of a halogen flame retardant, UL94V-0 level flame retardant effect can be effectively achieved, and the resin composition can be used for making the prepreg, the resin film, a resin coated copper foil, a flexible resin coated copper foil, the laminated board and the circuit board.

Description

technical field [0001] The invention belongs to the technical field of low-dielectric resin compositions, and in particular relates to a low-dielectric resin composition containing a phosphorus flame retardant and a preparation method thereof and a method for preparing prepregs, resin films, adhesive-backed copper foils, and flexible adhesive-backed copper foils. Applications in foils, laminates and circuit boards. Background technique [0002] Low dielectric resin materials are the main direction for the development of substrates with high transmission rates today. Among them, low dielectric loss and low dielectric constant are the main evaluation indicators for low dielectric resin materials. However, the existing low dielectric resin materials have the ability to use Halogenated flame retardants are not environmentally friendly, and the use of general phosphorus-containing flame retardants has disadvantages such as poor flame retardancy, poor heat resistance of the substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L25/08C08L79/08C08K5/53C08K7/18C08K3/36C08K5/14
CPCH05K1/0373B32B5/00B32B5/02B32B15/00B32B15/08B32B15/14B32B15/20B32B27/00B32B27/12B32B27/20B32B27/302B32B27/32B32B2255/06B32B2255/26B32B2260/021B32B2260/046B32B2264/10B32B2274/00B32B2307/204B32B2307/30B32B2307/3065B32B2457/08C08K5/5313C08K5/5397C08K5/5406C08L1/00H05K1/024H05K1/0326H05K3/4688H05K2201/012H05K2201/0195
Inventor 李长元谢镇宇陈浩蔡联辉李湘南
Owner ELITE ELECTRONICS MATERIAL ZHONGSHAN
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