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LED supersonic packaging method

A packaging method and ultrasonic technology, applied in non-electric welding equipment, electrical components, circuits, etc., can solve the problems of large internal stress, easy aging, poor heat resistance, etc., to improve welding efficiency, ensure welding quality, and shorten welding time. Effect

Active Publication Date: 2016-01-27
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional LED packaging materials are organic materials, such as epoxy resin, which have defects such as hygroscopicity, easy aging, poor heat resistance, easy discoloration under high temperature and short-wave light, and large internal stress during curing, so they are not suitable for UV LED packaging.

Method used

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  • LED supersonic packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] In this example, see Figure 1~5 , an LED ultrasonic packaging method, the steps are as follows:

[0029] a. Process the raw material substrate 3, expanded metal plate 2, and glass cover plate 1 for packaging. The expanded metal plate 2 is provided with a hollow LED light-emitting window 5. The light-emitting window 5 is a gap processed according to the packaging structure and size of the LED chip 4. , the glass cover plate 1 is made of quartz glass or borosilicate glass, the expanded metal plate 2 is made of Kovar alloy, the substrate 3 is made of ceramic substrate or aluminum substrate, and the substrate 3 has a groove for welding the LED chip 4, and the processed substrate 3 The peripheral dimension is 5×5×2mm, the peripheral dimension of the processed expanded metal plate 2 is 52×44×0.2mm, and the size of each notch for cutting the light-emitting window 5 inside the processed expanded metal plate 2 is 4×4×0.2mm , the number of rows and columns of the array of ligh...

Embodiment 2

[0038] This embodiment is basically the same as Embodiment 1, especially in that:

[0039] In this example, see Figure 6-8 , an LED ultrasonic packaging method, the steps are as follows:

[0040] a. Process the raw material substrate 3, expanded metal plate 2, and glass cover plate 1 for packaging. The expanded metal plate 2 is provided with a hollow LED light-emitting window 5. The light-emitting window 5 is a gap processed according to the packaging structure and size of the LED chip 4. , the glass cover plate 1 is made of quartz glass or borosilicate glass, the expanded metal plate 2 is made of Kovar alloy, the substrate 3 is made of ceramic substrate or aluminum substrate, and the substrate 3 has a groove for welding the LED chip 4, and the processed substrate 3 The peripheral dimension is 5×5×2mm, the peripheral dimension of the processed expanded metal plate 2 is 55.5×46.5×0.4mm, and the upper stepped surface of each upper step-shaped notch part of the cutout is proce...

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Abstract

The invention discloses an LED supersonic packaging method including the steps that a substrate, an expansion metal plate, and a glass cover plate are processed and cleaned at first, and the substrate and the glass cover plate are plated with a metal film, an LED chip is welded on the substrate, the glass cover plate plated with the metal film and the expansion metal plate are arranged in a supersonic device and are subjected to pressure, and the glass cover plate and the expansion metal plate are welded by means of supersonic wave. The welded glass cover plate plated with the metal film and the expansion metal plate are integrally cut into blocks based on the size required by an LED. The substrate plated with the metal plate is arranged in the supersonic device and is subjected to pressure, the glass cover plate plated with the metal film and the expansion metal plate and the substrate plated with the metal film are welded by means of supersonic wave, and the supersonic device stops after the welding is completed. The inorganic packaging manner is adopted, the batched packaging of the expansion metal plate and the glass cover plate is realized, the packaging efficiency is improved, and the stability and the reliability of the inorganic hermetic packaging are guaranteed.

Description

technical field [0001] The invention relates to a microelectronic device packaging method, in particular to an LED packaging method, which is applied in the technical field of semiconductor lighting product preparation. Background technique [0002] UVLED is an ultraviolet light-emitting diode, which is a kind of LED with a wavelength range of 10-400nm. UVLED luminescence mechanism: The terminal voltage of the PN junction forms a certain potential barrier. When the forward bias voltage is applied, the potential barrier decreases, and the majority carriers in the P region and the N region diffuse to each other. Since the mobility of electrons is much greater than that of holes, a large number of electrons will diffuse to the P region, which constitutes the injection of minority carriers into the P region. These electrons recombine with holes on the valence band, and the energy obtained during recombination is released in the form of light energy. This is the principle of PN...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/52B23K20/10
CPCB23K20/10H01L33/52
Inventor 阙秀福刘亚男杨连乔殷录桥张建华
Owner SHANGHAI UNIV
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