Machining method of target surface

Abstract

The invention discloses a machining method of a target surface, which belongs to the technical field of the machining process of the target surface. The method utilizes mechanical grinding and polishing equipment to machine. The invention provides equipment conditions for machining a target. A parallel roller shaft with an adjustable opening width is used, and water sand paper or cloth with the granularity of 20-2000 meshes covers the roller shaft; the water sand paper which is from the rough to the fine is firstly utilized and then the cloth is used; and meanwhile, de-ionized water is used for lubricating to grind and polish a metal material. After the grinding and the polishing, the high-pressure de-ionized water is used for washing the surface. In the specific application, the metal material comprises one or more of nickel, copper, silver, titanium, aluminum and vanadium. The machining method has advantages of no requirements on the target surface, fast grinding and polishing speed, no need of using cutting liquid and lubricating liquid for mechanically machining, no chemical reaction on the surface, thin stress layer, high whole uniformity, and no deformation of the whole body. The machining method of the target surface is a simple, reliable, economical and efficient machining method which is adapted to the target with a large area, a great length and a large thickness ratio.

Description

technical field [0001] The invention belongs to the technical field of target surface processing methods, and relates to a target surface processing method. The method uses mechanical grinding and polishing equipment for surface processing, and the method can be used, for example, to prepare sputtering target materials (that is, physical vapor deposition targets materials, "physical vapor deposition" and "sputtering" are used interchangeably herein). In specific applications, the sputtering target material may include one or more of nickel, copper, silver, titanium, aluminum, and vanadium. The sputtering target material may hereinafter be referred to as "target material". Background technique [0002] Sputtered thin film materials are widely used in related industries such as electronic information, storage records, and displays. At the same time, with the development of these industries, the demand for sputtering targets is also increasing year by year. The quality of th...

AI Technical Summary

Problems solved by technology

[0012] Therefore, according to the above situation, it is necessary to develop a kind of equipment and method suitable for preparing a kind of target material whose grinding and polishing force should not be too large, and which is suitable for processing a target with a large ratio of length to thickness and a thin thickness, so as to solve the problem that traditional processing methods cannot The problem of processing such targets with a large ratio of length to thickness, thinner thickness, and sticky properties, and the surface should not produce chemical reactions