Copper matrix surface laser cladding technology

Abstract

The invention relates to a metal surface treatment technology, in particular to a copper matrix surface laser cladding technology. The purpose is to provide a cladding technology, and a specific cladding material and specific laser parameters are adopted, so that the cladding layer formed on the copper matrix surface is compact in tissue and free from cracks and pores and forms good metallurgical bonding with the copper matrix surface. The copper matrix surface laser cladding technology includes the steps of polishing, decontaminating, laser cladding and cooling. The anti-abrasion and anti-high-temperature alloy material adopted in the laser cladding step is prepared from 20-29% of Ni, 18-28% of Fe, 6-10% of C, 10-23% of Co, 2.5-4.5% of B and 3.0-5.0% of Si. According to the technological parameters of a pulse Nd:YAG laser device, the focal length of a focus lens is 200-250 mm, the cladding power P is 800-1000 W, the diameter of a light spot is 2.5-4.0 mm, and the cladding scanning speed V is 20-45 mm / s; the overlap rate is 50%.

Description

Technical field [0001] The invention relates to a metal treatment material and treatment process. Background technique [0002] Laser cladding technology is one of the main methods to modify the surface of materials. It uses high-energy density laser beams to quickly melt alloys with different compositions and properties on the surface of the substrate. The formation on the surface of the substrate has a completely different composition and composition from the substrate. The rapid solidification process of the high-performance alloy layer. [0003] The copper alloy laser cladding technology has the following difficulties: ①The copper alloy has good thermal conductivity, small specific heat capacity, poor wettability, hard oxide film on the surface, and high reflectivity to the light spot, which makes the heat generated by the laser in its The surface is not easy to stay, high power density is not easy to form, and the molten pool cannot be formed; ②The performance of the copper a...

AI Technical Summary

Problems solved by technology

[0005] like figure 1 As shown, the cladding layer obtained by carbon dioxide laser cladding technology has a high dilution rate with the substrate, and the heat-affected zone is large, resulting in a decrease in the physical properties of the cladding layer, a high heat deformation rate of the substrate, and micro-trachoma and pores.

[0006] like figure 2 As shown, although the cladding layer and substrate dilution rate obtained by semiconductor laser cladding technology is lower than that of carbon dioxide laser cladding layer, the heat-affected zone is still large, resulting in a large thermal deformation of the substrate.

[0007] In short, there are still many problems in the current technology for cladding the surface of copper substrates, which cannot meet the needs of industrial production well.

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