Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chemical nickel plating solution for flexible printed circuit board and plating construction method thereof

A flexible circuit board, chemical nickel plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve serious alloy coating cracks, affect the ductility and corrosion resistance of the coating, nickel-phosphorus alloy coating Problems such as cracks are prone to occur, and the effect of improving bending resistance and corrosion resistance is achieved.

Active Publication Date: 2015-11-04
珠海斯美特电子材料有限公司
View PDF6 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the nickel-phosphorus alloy coatings obtained by these methods are prone to cracks.
Especially after the chemical gold solution treatment in the post-process, the cracks of the alloy coating will be more serious, which will directly affect the ductility and corrosion resistance of the coating.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chemical nickel plating solution for flexible printed circuit board and plating construction method thereof
  • Chemical nickel plating solution for flexible printed circuit board and plating construction method thereof
  • Chemical nickel plating solution for flexible printed circuit board and plating construction method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A solution for electroless nickel plating on flexible circuit boards, the formula is:

[0049] Nickel sulfate 22.5 g / l,

[0050] Sodium hypophosphite 30.0 g / l,

[0051] Lactic acid (88%) 15.0 g / l,

[0052] Malic acid 12.0 g / l,

[0053] Sodium acetate 8.0 g / l,

[0054] Ethylenediamine 5.0 g / l,

[0055] Thiodiacetic acid 2.0ppm;

[0056] The method for applying plating on the surface of a flexible printed circuit board using the above-mentioned nickel plating solution comprises the following steps:

[0057] (1) Grinding plate sandblasting; after grinding the plate, remove the residue on the copper surface, and sandblasting to make the copper surface uniform;

[0058] (2) Degreasing: Degrease the circuit board with an acid degreaser or alkaline degreaser to remove organic matter and oxides on the copper surface. The degreasing time is 5 minutes, and wash with water after completion;

[0059](3) Microetching: immerse the circuit board treated in step (2) in the mixtu...

Embodiment 2

[0069] A solution for electroless nickel plating on flexible circuit boards, the formula is:

[0070] Nickel sulfate 22.5 g / l,

[0071] Sodium hypophosphite 30.0 g / l,

[0072] Lactic acid (88%) 15.0 g / l,

[0073] Malic acid 12.0 g / l,

[0074] Sodium acetate 8.0 g / l,

[0075] Triethylenetetramine 5.0 g / l,

[0076] Allylthiourea 2.0ppm,

[0077] The pH value of the solution was controlled at 4.6, and the temperature was controlled at 85°C.

[0078] The method for applying plating on the surface of a flexible printed circuit board using the above-mentioned nickel plating solution, the steps are the same as in Example 1.

[0079] Dip the circuit board in gold-removing water containing 100 g / L NaCN for 10 seconds, wash it with water, dry the surface, bend it 180 degrees, observe the side of the nickel alloy layer with a scanning electron microscope, the nickel alloy layer has a columnar structure, and the nickel layer has no fracture ;

[0080] Observing the surface of the ...

Embodiment 3

[0082] A solution for electroless nickel plating on flexible circuit boards, the formula is:

[0083] Nickel sulfate 30 g / l,

[0084] Sodium hypophosphite 40 g / l,

[0085] Lactic acid (88%) 10 g / l,

[0086] Malic acid 20 g / l,

[0087] Sodium acetate 15 g / l,

[0088] Hexamethylenetetramine 0.5 g / l,

[0089] 2-aminothiazole 2.0 ppm;

[0090] The pH value of the solution was controlled at 4.6, and the temperature was controlled at 85°C.

[0091] The method for applying plating on the surface of a flexible printed circuit board using the above-mentioned nickel plating solution, the steps are the same as in Example 1.

[0092] Immerse the circuit board in gold-removing water containing 70 g / L NaCN for 15 seconds, wash it with water, dry the surface, and bend it 180 degrees. Observe the side of the nickel alloy layer with a scanning electron microscope. The nickel alloy layer has a columnar structure, and the nickel layer has no fracture;

[0093] Observing the surface of th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a chemical nickel plating solution for a flexible printed circuit board and a plating construction method thereof. The chemical nickel plating solution for the flexible printed circuit board is characterized in that according to the formula of the nickel plating solution, each liter of the nickel plating solution comprises 20-30 grams of soluble nickel salt, 20-40 grams of a reducing agent, 20-50 grams of fatty carboxylic acid and / or a substituted derivative, 5-15 grams of a buffering agent and 0.5-10.0 grams of ethanediamine and / or a condensation compound thereof, and contains 0.01-10.0 ppm of a sulfocompound. A cylindrical nickel additive and an accelerator are added into the chemical nickel plating solution, the chemical nickel plating solution is plated on the surface of the FPC, a gold layer is deposited by a chemical gold plating solution in a follow-up procedure, after gold in the gold layer is removed by a gold removing agent, a nickel alloy layer is free of cracks under the observation of an electronic microscope, and a flexible nickel alloy layer is obtained. The nickel plating solution provided by the invention improves the flexibility and the corrosion resistance of the nickel alloy layer.

Description

technical field [0001] The invention relates to the technical field of electroless nickel plating, in particular to a solution for electroless nickel plating on a flexible circuit board and a plating method thereof. Background technique [0002] Flexible printed circuit board (FPC) has been widely used in the current developed communication industry. With the advancement of technology, higher requirements are put forward for FPC production. The traditional surface treatment chemical nickel gold process, because the obtained nickel alloy coating has a layered structure, the deflected part is prone to breakage during the surface mounting process, resulting in the scrapping of the product. The columnar chemical nickel has good ductility and can solve this problem. Columnar chemical nickel is to add columnar growth additives to ordinary chemical nickel solution, so that the nickel alloy coating grows columnar on the copper substrate. [0003] JANSSEN BORIS ALEXANDER of Atotech...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C18/34C23C18/36C23C18/42
Inventor 吴仕祥简发明
Owner 珠海斯美特电子材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com