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Photo-thermal dual-curing anisotropic conductive adhesive film and preparation method thereof

An anisotropic, dual-curing technology, used in conductive adhesives, adhesives, epoxy resins, etc., can solve the problems of low conductivity, long curing time and incomplete curing of conductive adhesive films, and achieve a simple preparation method. , Excellent anti-aging performance, and the effect of improving bond strength

Active Publication Date: 2015-06-03
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a photothermal dual curing anisotropic conductive adhesive film and its preparation method. It solves the problems of high curing temperature, long curing time, low conductivity and large resistance of the conductive adhesive film in the simple thermal curing process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Each component is weighed according to the following proportions, bisphenol A type epoxy resin (E51) 40%, bisacrylic resin 15%, diluent (trimethylolpropane triacrylate) 5.5%, crosslinking agent (methanol) Glycidyl acrylate) 5%, photoinitiator (1-hydroxycyclohexyl phenylacetone) 1%, thermal curing agent (2-methylimidazole) 3%, accelerator (triethanolamine) 6%, silane coupling Agent (3-(methacryloyloxy)propyltrimethoxysilane) 1.5%, conductive balls (silver-coated polystyrene balls) 23%. The preparation method is as follows:

[0032] (1) photoinitiator is joined in diluent to dissolve, then get epoxy resin, the diluent that has dissolved photoinitiator is joined in epoxy resin, stir;

[0033] (2) Add thermosetting agent and accelerator to acrylic resin and stir;

[0034] (3) Mix the products obtained in steps (1) and (2), add conductive pellets and crosslinking agent, then add silane coupling agent, stir under low temperature (ice water bath) and dark conditions; then us...

Embodiment 2

[0038]Bisphenol A type epoxy resin (E51) 40%, bisacrylic resin 10%, diluent (trimethylolpropane triacrylate) 4%, crosslinking agent (glycidyl methacrylate) 5%, light Initiator (1-hydroxycyclohexyl phenylacetone) 0.8%, thermal curing agent (2-methylimidazole) 3%, accelerator (triethanolamine) 5.7%, silane coupling agent (3-aminopropylmethyl di Ethoxysilane) 1.5%, conductive balls (silver-coated polystyrene balls) 30%. The preparation method is the same as in Example 1. Among them, the light curing time is 5s, and the heat curing time is 8s. The peel strength of the final photothermal dual curing anisotropic conductive adhesive film is 1.2K Nm -1 , shear strength 40.4Mpa, contact resistance 1.5Ω.

Embodiment 3

[0040] Bisphenol F type epoxy resin 40%, bis-propylene resin 15%, diluent (tripropylene glycol diacrylate) 5.5%, crosslinking agent (glycidyl methacrylate) 5%, photoinitiator (2,4 , 6-trimethylbenzoyl-diphenylphosphine oxide) 1%, thermal curing agent (2-ethyl-4-methylimidazole) 3%, accelerator (triethanolamine) 6%, silane coupling agent (3-(methacryloyloxy)propyltrimethoxysilane) 1.5%, conductive balls (silver-coated polystyrene balls) 23%. The preparation method is the same as in Example 1. Among them, the light curing time is 15s, and the heat curing time is 15s. The peel strength of the final photothermal dual curing anisotropic conductive adhesive film is 1.5K Nm -1 , shear strength 34.7Mpa, contact resistance 2.0Ω.

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Abstract

The invention relates to a photo-thermal dual-curing anisotropic conductive adhesive film and a preparation method thereof. The anisotropic conductive adhesive film is prepared from raw materials in percentage by mass as follows: 35%-45% of epoxy resin, 10%-25% of acrylic resin, 5%-10% of a cross-linking agent, 2%-7% of a diluent, 0.6%-1% of a photoinitiator, 2.5%- 4% of a thermal curing agent, 5%-10% of an accelerant, 0.5%-2% of a silane coupling agent and 20%-35% of conductive balls. The preparation method comprises steps as follows: the raw materials are blended, subjected to rotary coating and then subjected to ultraviolet exposure processing, and the anisotropic conductive adhesive film is prepared. The anisotropic conductive adhesive film has good conductive performance, excellent weather fastness, low curing temperature, long storage time, high curing degree and high bonding strength; the preparation process is simple, the cost is low, and the application prospect is broad.

Description

technical field [0001] The invention belongs to the field of anisotropic conductive adhesive film, and in particular relates to a photothermal dual curing anisotropic conductive adhesive film and a preparation method thereof. Background technique [0002] Today in the 21st century, with the rapid changes in science and technology, electronic devices are also constantly updated and improved, and gradually develop in the direction of portability, lightness, high speed, and high performance. Various electronic devices such as mobile phones, tablet computers, global positioning systems, etc. Gradually achieve the goal of lighter, thinner and smaller. As a traditional soldering material, tin-lead metals occupy a pivotal position in the field of electronic packaging, but their environmental pollution limits their wide application. Conductive adhesives based on polymers are relatively green and environmentally friendly materials that can well solve the problem of fine-pitch connec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J9/02C09J163/00C09J163/10C09J11/04C09J11/06C08J5/18C08J3/28C08J3/24
Inventor 张清华齐亚龙徐婷赵昕
Owner DONGHUA UNIV
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