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Method for cladding copper on surface of infiltration sintered tungsten-copper composite material

A composite material, tungsten-copper technology, applied in the field of preparation of tungsten-copper composite materials, can solve the problem that the infiltration density cannot reach more than 98%

Inactive Publication Date: 2014-12-17
ZHEJIANG LIGHT TOUGH COMPOSITE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to overcome the defect that the infiltration density of the existing tungsten-copper alloy cannot reach more than 98%, the present invention provides a method for coating copper on the surface of the infiltrated sintered tungsten-copper composite material. The method of cladding copper increases the infiltration density of tungsten-copper composite materials to more than 99%, which fully meets the requirements of some special equipment components (such as rocket nozzles or aircraft throat linings), and greatly prolongs the service life of these special equipment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for coating copper on the surface of infiltrated sintered tungsten-copper composite materials, comprising the following process steps:

[0026] Step 1, prepare the mixture of tungsten powder and copper powder

[0027] Mixing tungsten powder and copper powder, in the mixture obtained, in weight percentage, the content of tungsten powder is 65%, and the content of copper powder is 35%;

[0028] Step 2, preparing tungsten skeleton compact

[0029] Add the mixture prepared in step 1 to the forming agent, spray dry and granulate it, and press it in a mold with a pressing pressure of 320 MPa to obtain a tungsten skeleton compact;

[0030] Step 3, preparing sintering infiltration agent

[0031] Stamping oxygen-free copper into copper bars as sintering infiltration agent;

[0032] Step four, sintering

[0033] The sintered infiltration agent is stacked on the tungsten skeleton compact and put into a graphite mold, and then sintered in a vacuum furnace to obtain a t...

Embodiment 2

[0038] A method for coating copper on the surface of infiltrated sintered tungsten-copper composite materials, comprising the following process steps:

[0039] Step 1, prepare the mixture of tungsten powder and copper powder

[0040] Mixing tungsten powder and copper powder, in the obtained mixture, in weight percentage, the content of tungsten powder is 70%, and the content of copper powder is 30%;

[0041] Step 2, preparing tungsten skeleton compact

[0042] Add the mixture prepared in step 1 to the forming agent, spray dry and granulate it, then press it in the mold with a pressing pressure of 150 MPa to obtain a tungsten skeleton compact;

[0043] Step 3, preparing sintering infiltration agent

[0044] Stamping oxygen-free copper into copper bars as sintering infiltration agent;

[0045] Step four, sintering

[0046] The sintered infiltration agent is stacked on the tungsten skeleton compact and put into a graphite mold, and then sintered in a vacuum furnace to obtain ...

Embodiment 3

[0051] A method for coating copper on the surface of infiltrated sintered tungsten-copper composite materials, comprising the following process steps:

[0052] Step 1, prepare the mixture of tungsten powder and copper powder

[0053] Mixing tungsten powder and copper powder, in the mixture obtained, the content of tungsten powder is 75% and the content of copper powder is 25% by weight percentage;

[0054] Step 2, preparing tungsten skeleton compact

[0055] Add the mixture prepared in step 1 to a forming agent, spray dry and granulate it, and press it in a mold with a pressing pressure of 400 MPa to obtain a tungsten skeleton compact;

[0056] Step 3, preparing sintering infiltration agent

[0057] Stamping oxygen-free copper into copper bars as sintering infiltration agent;

[0058] Step four, sintering

[0059] The sintered infiltration agent is stacked on the tungsten skeleton compact and put into a graphite mold, and then sintered in a vacuum furnace to obtain a tungste...

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Abstract

The invention discloses a method for cladding copper on a surface of an infiltration sintered tungsten-copper composite material. The method comprises the following steps: a mixture of tungsten powder and copper powder is prepared, wherein the content of the tungsten powder is 65-85 weight%, and the content of the copper powder is 15-35 weight%; after the prepared mixture is added to forming agent, and is dried for pelletizing through spraying, the prepared mixture is compressed for forming in a mold to obtain a tungsten skeleton pressing blank, wherein the pressing pressure is 150-400 MPa; oxygen-free copper is pressed into a copper bar serving as sintering infiltration agent; the sintering infiltration agent is stacked on the tungsten skeleton pressing blank, then the sintering infiltration agent and the tungsten skeleton pressing blank are put in a graphite mold, and are sintered in a vacuum furnace to obtain the tungsten-copper composite material; the tungsten-copper composite material consists of a tungsten-copper alloy layer and a copper layer; and the copper layer covers the surface of the tungsten-copper alloy. The infiltration density of the tungsten-copper composite material is raised to more than 99% to totally satisfy the requirements of some special equipment parts, so that the service life of the special equipment is greatly prolonged.

Description

technical field [0001] The invention relates to a preparation method of a tungsten-copper composite material, in particular to a method for producing a tungsten-copper composite material through an infiltration sintering method. Background technique [0002] Tungsten-copper powder metallurgy composite material is a pseudo-alloy composed of high-melting point, high-hardness tungsten and high-conductivity, high-thermal-conductivity copper, because of its good arc erosion resistance, fusion welding resistance, high strength and high hardness And other advantages, is currently widely used as electrical contact materials, resistance welding, EDM and plasma electrode materials, electrothermal alloys and high-density alloys, special-purpose military materials (such as rocket nozzles, aircraft throat linings), and computer central Processing systems, lead frames of large-scale integrated circuits, heat sink substrates of electronic devices such as solid-state microwave tubes. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C27/04C22C1/04B22F3/10B22F7/02
Inventor 方宁象张国军
Owner ZHEJIANG LIGHT TOUGH COMPOSITE MATERIALS
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