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Ceramic composite material substrate and manufacturing technology thereof

A technology for preparing composite materials and substrates, which is applied in the field of metal-containing ceramic substrates and its preparation technology, can solve the problems of electronic chip mismatch and low thermal conductivity, and achieve improved chip heat dissipation, easy impregnation of metals, and convenient and efficient preparation Effect

Active Publication Date: 2014-09-24
SHANTOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention is aimed at the relatively low thermal conductivity of ceramics and the mismatch between the linear expansion coefficient of metal materials and electronic chips, and prepares porous ceramics with evenly distributed open pores and perpendicular to the surface of the ceramic substrate by a flow-casting freeze-drying method. A metal-ceramic composite substrate in which the metal phase is uniformly distributed and vertically penetrates the ceramic is prepared by combining with the method, so as to meet the requirements of some electronic devices for high thermal conductivity substrates

Method used

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  • Ceramic composite material substrate and manufacturing technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] see figure 1 flow chart. Take 650 g of SiC powder with an average particle size of 3 μm, add 150 g of water, 150 g of styrene-acrylic emulsion binder, 40 g of glycerin plasticizer, and 10 g of triolein dispersant, and perform ball milling and mixing for 12 hours to prepare a cast slurry. The obtained slurry is cast on a tape casting machine, and the slurry passes through the casting freeze-drying zone, directional condensed, and forms vertically penetrating and uniformly distributed columnar icicles in the semi-finished raw tape, and then condenses to form uniformly distributed columnar icicles The semi-finished raw tape was freeze-dried at -20°C for 4 hours to form a porous ceramic green tape with evenly distributed open pores and perpendicular to the surface of the ceramic green tape. The ceramic raw tape is heated to remove the glue, and the temperature is raised to 500° C., and kept for 3 hours. After the glue is removed, a porous ceramic green sheet with open po...

Embodiment 2

[0031] Take 680g of AlN powder with an average particle size of 1 μm, add 140g of water, 130g of styrene-acrylic emulsion binder, 40g of glycerin plasticizer, and 10g of triolein dispersant, and carry out ball milling and mixing for 12 hours to prepare the casting slurry. The obtained slurry is cast on a tape casting machine, and the slurry passes through the casting freeze-drying zone, directional condensed, and forms vertically penetrating and uniformly distributed columnar icicles in the semi-finished raw tape, and then condenses to form uniformly distributed columnar ice The semi-finished green tape of the column is freeze-dried at -30°C for 3 hours to form a porous ceramic green tape with evenly distributed open pores and perpendicular to the surface of the ceramic green tape. The ceramic raw tape is heated to remove the glue, and the temperature is raised to 700° C., and kept for 1 hour. After the glue is removed, a porous ceramic green sheet with open pores evenly distr...

Embodiment 3

[0033] Take Al with an average particle size of 1 μm 2 o 3 Powder 500g and low melting point glass additive powder 200g, add water 150g, styrene-acrylic emulsion binder 150g, glycerin plasticizer 40g, triolein dispersant 10g, carry out ball milling and mix for 12 hours, prepare the fluid Extension slurry. The obtained slurry is cast on a tape casting machine, the slurry passes through the casting freeze-drying zone, the slurry passes through the casting freeze-drying zone, directional condensation forms vertically penetrating and evenly distributed columnar icicles in the raw tape semi-finished product, Then, freeze-dry the green tape semi-finished product that condenses to form evenly distributed columnar icicles at a temperature of -40°C for 2 hours to form a porous ceramic green tape with evenly distributed open pores and perpendicular to the surface of the ceramic green tape. The ceramic raw tape is heated to remove the glue, and the temperature is raised to 600° C., and...

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Abstract

The invention provides a cermet composite material substrate which comprises a ceramic base body and a metal heat-conduction-enhancing body. The metal heat-conduction-enhancing body is distributed uniformly and vertically penetrates the ceramic base body. The invention also provides a manufacturing technology of the cermet composite material substrate. The manufacturing technology includes: 1) preparing a water-based tape-casting slurry material; 2) carrying a tape casting process to the slurry material; 3) performing directed condensation; 4) performing a freeze-drying process; 5) performing a ceramic green body sintering process; and 6) preparing a cermet substrate in a manner of metal liquid-phase infiltration. Through combination of tape-casting freeze-drying moulding and liquid-phase infiltration, the cermet composite material substrate can be manufactured conveniently and efficiently so that requirements of some electronic devices on high-heat-conductivity substrates are satisfied.

Description

technical field [0001] The invention belongs to the field of LED ceramic substrates, in particular to a metal-containing ceramic substrate and a preparation process thereof. Background technique [0002] Ceramic materials have stable chemical properties, good electrical insulation, and a linear expansion coefficient very similar to that of electronic components. They are one of the commonly used substrate materials in electronic components. However, the thermal conductivity of ceramic materials is relatively low, and it is difficult to meet the heat dissipation requirements of high-power integrated circuits or high-power LEDs. [0003] Because of the advantages of high thermal conductivity, mechanical strength and good processing performance, metal materials are still one of the main materials that people continue to develop and promote. However, the linear expansion coefficient of the metal material does not match that of the microelectronic chip, which will cause thermal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/76C04B35/622
Inventor 王双喜刘高山晏建宇叶家星张丹
Owner SHANTOU UNIV
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