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Circuit board comprising blind hole and manufacturing method of circuit board

A manufacturing method and circuit board technology, which is applied to printed circuit components, electrical connection formation of printed components, electrical connection of printed components, etc., can solve problems such as inability to effectively polish resin, inability to complete grinding board, and substrate surface grinding. , to achieve the effect of tight filling, reduced production process, and no layering of resin

Inactive Publication Date: 2014-07-09
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the conventional technology, after the resin plugs the hole, it is necessary to remove the excess resin on the board surface through the grinding process. When using the PTFE high-frequency board, since the PTFE high-frequency board clearly prohibits mechanical grinding, the grinding board after the resin plugging hole cannot be completed ; When non-PTFE high-frequency boards are used, especially RO4450 prepregs, due to the influence of the residual copper in the inner layer and the soft material of the sub-board itself, severe unevenness will appear on the board surface after the use of overlay lamination, and ceramic wear after resin plugging The board cannot effectively polish the resin in the depression, which will easily cause the defect of the board surface to expose the base material, causing great troubles to production

Method used

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  • Circuit board comprising blind hole and manufacturing method of circuit board
  • Circuit board comprising blind hole and manufacturing method of circuit board
  • Circuit board comprising blind hole and manufacturing method of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A circuit board manufacturing method including blind holes, including pre-process, sub-board drilling, copper sinking, plate plating, plated holes, inner layer pattern making, browning, resin plugging holes, baking board, sub-board lamination, post-processing process, of which:

[0027] In the preceding process, including sub-board cutting, inner layer graphics transfer, inner layer etching, inner layer AOI, and sub-board lamination processes, the above-mentioned pre-processes are all produced according to conventional technology, and the sub-board is made of RO4350B plate, and combined Laminated with RO4450 prepreg.

[0028] The sub-board drilling, copper sinking, plate plating, plated hole, inner layer pattern making, browning process are also all made according to conventional technology, wherein, in the inner layer pattern making process, the method of positive etching can also be used. Pattern transfer is carried out by means of negative electroplating.

[0029] ...

Embodiment 2

[0037] The manufacturing method of the circuit board including blind holes in this embodiment is basically the same as the method in embodiment 1, except that in this embodiment, a PTFE plate is used as the substrate of the circuit board.

[0038] In the resin plugging process, the length of each side of the window opening area on the plugging aluminum sheet is 6 mil larger than the length of each side of the sub-board requiring resin plugging. Use SKY-2000 type resin, and use Nanda FL-6080PSR-TM semi-automatic plug hole screen printing machine or Dongyuan ATMAOE-67 semi-automatic plug hole screen printing machine, the inclination angle of the scraper is 5°, the swivel angle of the scraper is 3°, and the screen printing pressure is 6kg / cm 2 , The plugging speed is 14 Hz, the ink filling speed is 4 scales (1 scale = 10 Hz), the screen mesh is 36T, and the screen tension is 27N / cm 2 Under the conditions of the plug hole.

[0039] In the baking process, the temperature of the ...

Embodiment 3

[0042] The manufacturing method of the circuit board including blind holes in this embodiment is basically the same as the method in Embodiment 2, except that in this embodiment, the sub-board is made of RO4350B board and combined with RO4450 prepreg for pressing.

[0043] In the resin plugging process, the length of each side of the window opening area on the plugging aluminum sheet is 4 mil larger than the length of each side of the area requiring resin plugging holes on the sub-board. Using SKY-2000 resin, the inclination angle of the scraper is 4°, the swivel angle of the scraper is 0°, and the screen printing pressure is 5kg / cm 2 , The plugging speed is 8 Hz, the ink filling speed is 3 scales, the screen mesh is 36T, and the screen tension is 26N / cm 2 Under the conditions of the plug hole.

[0044] In the baking process, the temperature of the baking board is 100° C., and the drying time is 30 minutes.

[0045] Through the above method, the circuit board C is produced.

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Abstract

The invention discloses a circuit board comprising a blind hole and a manufacturing method of the circuit board and belongs to the technical field of printed circuit boards. The manufacturing method comprises the steps that the processes of daughter board hole drilling, electroless copper plating, board plating, hole plating, inner layer pattern manufacturing, brownification, resin hole blocking, board drying and daughter board lamination. In the resin hole blocking process, a pre-manufactured hole blocking aluminum piece is arranged on the surface of a daughter board in a covering mode, a window-opening zone corresponding to a zone which needs resin hole blocking on the daughter board is arranged on the hole blocking aluminum piece, and then resin hole blocking is carried out. Accordingly, the problem that a whole board face is full of resin is avoided, ceramic board grinding is of no need, and the problem that surplus resin stays in concave parts on the board face or base materials are exposed out of the board face is solved. The manufacturing method of a resin blocking hole is suitable for blind hole resin filling of various boards, and limitation on boards of the resin blocking hole is removed.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a circuit board containing blind holes and a manufacturing method thereof. Background technique [0002] At present, it is often encountered that PTFE (polytetrafluoroethylene) high-frequency boards or non-PTFE high-frequency boards and their prepregs (commonly such as RO4350B boards and RO4450 prepregs) are used to make buried blind via circuit boards. When there are special requirements for circuit boards or circuit board stack design, a single sheet of RO4450PP will appear. At this time, the blind hole glue filling process should take into account the influence of the thickness of the sub-board and the copper thickness of the sub-board. Usually, the thickness of the sub-board should be Less than 0.76mm, while the copper thickness of the sub-board is required to be less than or equal to 0.5oz (ounces), and materials such as RO4450FPP with better fluidity are used...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K3/40
Inventor 张勃王雪涛乔书晓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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