Method of preparing diamond-like membrane by film sputtering in SiNx middle layer
A technology of diamond-like film and magnetron sputtering, which is applied in the direction of sputtering coating, coating, metal material coating process, etc., can solve the problem of high energy consumption not suitable for industrial production, large residual stress of diamond-like film, and limited film layer Problems such as deposition thickness, to achieve low internal stress, uniform and dense film, and reduce internal stress
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Embodiment 1
[0020] Example 1SiN X Preparation of diamond-like carbon film by interlayer magnetron sputtering
[0021] (1) Cleaning of Si (100)
[0022] Using the Si(100) substrate as the substrate, the Si(100) was first cleaned with acetone in an ultrasonic cleaner for 20 minutes at room temperature and pressure, and then cleaned with alcohol in an ultrasonic cleaner for 20 minutes. 2 Blow dry, bombard with Ar ions for 20 min before deposition, and put into sputtering chamber.
[0023] (2) Buffer layer SiN X growth
[0024] The process was completed in an ultra-high vacuum multifunctional magnetron sputtering system with a background vacuum of 4.0×10 -5 Pa, target material is Si (purity 99.999%), N 2 The flow rate of Ar gas and Ar gas are 3.2, 35.2 sccm respectively, where N 2 is the reactive gas, Ar is the working gas, and Ar is ionized to form Ar + , Ar + Colliding with the target under the action of an electromagnetic field, Ar + Exchange energy with the target atoms. When the...
Embodiment 2
[0028] (1) Cleaning of Si (100)
[0029] Using the Si(100) substrate as the substrate, the Si(100) was first cleaned with acetone in an ultrasonic cleaner for 20 minutes at room temperature and pressure, and then cleaned with alcohol in an ultrasonic cleaner for 20 minutes. 2 Blow dry, bombard with Ar ions for 20 min before deposition, and put into sputtering chamber.
[0030] (2) Growth of diamond-like film
[0031] The process was completed in an ultra-high vacuum multifunctional magnetron sputtering system with a background vacuum of 4.0×10 -5 Pa, the target material adopts high-purity carbon target (99.999%), the gas flow rate of Ar gas is 35.2 sccm, where Ar is the working gas, and Ar is ionized to form Ar + , Ar + Colliding with the target under the action of an electromagnetic field, Ar + Exchange energy with the target atoms. When the energy obtained by the target atoms is greater than the work escape of the metal, they will leave the target surface and deposit on ...
Embodiment 3
[0033] (1) Cleaning of Si (100)
[0034] Using the Si(100) substrate as the substrate, the Si(100) was first cleaned with acetone in an ultrasonic cleaner for 20 minutes at room temperature and pressure, and then cleaned with alcohol in an ultrasonic cleaner for 20 minutes. 2 Blow dry, bombard with Ar ions for 20 min before deposition, and put into sputtering chamber.
[0035] (2) Growth of buffer layer CNx
[0036] The process was completed in an ultra-high vacuum multifunctional magnetron sputtering system with a background vacuum of 4.0×10 -5 Pa, the target uses high-purity carbon target (99.999%), N 2 The flow rate of Ar gas and Ar gas are 3.2, 35.2 sccm respectively, where N 2 is the reactive gas, Ar is the working gas, and Ar is ionized to form Ar + , Ar + Colliding with the target under the action of an electromagnetic field, Ar +Exchange energy with the target atoms. When the energy obtained by the target atoms is greater than the work escape of the metal, they w...
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