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Packaging adhesive containing modified sepiolite powder

A sepiolite powder and modification technology, applied in the direction of adhesives, adhesive additives, epoxy resin glue, etc., can solve the problems of poor storage stability, slow curing speed, poor cold resistance, etc., and achieve long service life and curing speed. Fast, improve the effect of adhesion strength

Active Publication Date: 2014-05-14
广西汇智生产力促进中心有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, adhesives generally have the disadvantages of slow curing speed, poor heat resistance, poor cold resistance, and poor storage stability.
In order to overcome the shortcomings of traditional adhesives such as poor heat resistance, poor cold resistance, and poor storage stability, a new type of adhesive is produced by improving the formula.

Method used

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  • Packaging adhesive containing modified sepiolite powder
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A packaging adhesive containing modified sepiolite powder, made of the following raw materials in parts by weight: 100 parts of phenolic propane epoxy resin, 50 parts of polystyrene, 10 parts of epoxy octyl stearate, polytetrahydrofuran 3 parts of ether glycol, 5 parts of cellulose ether, 5 parts of nitrile rubber, 8 parts of lignin, 1 part of boron powder, 10 parts of modified sepiolite powder, 2 parts of nano-titanium dioxide, 5 parts of high wear-resistant carbon black, 1 part of ferrocene, 0.5 part of dibutyltin dilaurate, 0.3 part of phosphoric acid, 2 parts of mica iron oxide, 2 parts of sodium silicate, 2 parts of antioxidant MB, 2 parts of accelerator BZ, 1 part of silane coupling agent, modified pulverized coal Ash 10 parts.

[0018] The modified sepiolite powder is prepared by the following steps: first roast the sepiolite at 400°C for 3 hours, then soak the sepiolite with 15% hydrochloric acid for 2 hours, let stand, centrifuge, and then wash with deionized w...

Embodiment 2

[0024] A packaging adhesive containing modified sepiolite powder, made of the following raw materials in parts by weight: 80 parts of phenolic propane epoxy resin, 70 parts of polystyrene, 13 parts of epoxy octyl stearate, polytetrahydrofuran 4 parts of ether glycol, 7 parts of cellulose ether, 8 parts of nitrile rubber, 9 parts of lignin, 2 parts of boron powder, 13 parts of modified sepiolite powder, 3 parts of nano-titanium dioxide, 6 parts of high wear-resistant carbon black, 2 parts of ferrocene, 0.6 parts of dibutyltin dilaurate, 0.4 parts of phosphoric acid, 3 parts of mica iron oxide, 3 parts of sodium silicate, 3 parts of antioxidant MB, 3 parts of accelerator BZ, 2 parts of chromium complex coupling agent, modified 14 parts of permanent fly ash.

[0025] The modified sepiolite powder is prepared by the following steps: first roast the sepiolite at 500°C for 4 hours, then soak the sepiolite with 18% hydrochloric acid for 3 hours, let stand, centrifuge, and then wash w...

Embodiment 3

[0031] A packaging adhesive containing modified sepiolite powder, made of the following raw materials in parts by weight: 100 parts of phenolic propane epoxy resin, 80 parts of polystyrene, 15 parts of epoxy octyl stearate, polytetrahydrofuran 5 parts of ether glycol, 8 parts of cellulose ether, 10 parts of nitrile rubber, 10 parts of lignin, 3 parts of boron powder, 15 parts of modified sepiolite powder, 4 parts of nano-titanium dioxide, 10 parts of high wear-resistant carbon black, 3 parts of ferrocene, 0.8 parts of dibutyltin dilaurate, 0.5 parts of phosphoric acid, 4 parts of mica iron oxide, 4 parts of sodium silicate, 4 parts of antioxidant MB, 4 parts of accelerator BZ, 3 parts of titanate coupling agent, modified 15 parts of fly ash.

[0032] The modified sepiolite powder is prepared by the following steps: first roast the sepiolite at 600°C for 5 hours, then soak the sepiolite with 20% hydrochloric acid for 3 hours, let stand, centrifuge, and then wash with deionized ...

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Abstract

The invention discloses a packaging adhesive containing modified sepiolite powder. The packaging adhesive is prepared from the following raw materials in parts by weight: 50-100 parts of phenol propane epoxy resin, 50-80 parts of polystyrene, 10-15 parts of epoxy octyl stearate, 3-5 parts of polytetrahydrofuran ether glycol, 5-8 parts of cellulose ether, 5-10 parts of butadiene-acrylonitrile rubber, 8-10 parts of lignin, 1-3 parts of boron powder, 10-15 parts of modified sepiolite powder, 2-4 parts of nano titanium dioxide, 5-10 parts of high abrasion furnace black, 1-3 parts of ferrocene, 0.5-0.8 part of dibutyltin dilaurate, 0.3-0.5 part of phosphoric acid, 2-4 parts of mica iron oxide, 2-4 parts of sodium silicate, 2-4 parts of an anti-aging agent MB, 2-4 parts of an accelerant BZ, 1-3 parts of a coupling agent and 10-15 parts of modified fly ash. The packaging adhesive disclosed by the invention, through the modified sepiolite powder and the modified fly ash as well as regulating proportions, is excellent in binding power, chemical corrosion resistance, heat resistance and acid-base resistance, rapid in curing speed and long in service life.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an adhesive for packaging containing modified sepiolite powder and a preparation method thereof. Background technique [0002] Adhesive is a substance that can tightly bond materials of the same or different types together. With the development of science and technology and the national economy, adhesives have been widely used in wood processing, construction engineering, textile printing and dyeing, shoemaking, leather, electronics, automobiles, machinery, aerospace, biomedical and other industries and high-tech fields. At present, adhesives generally have the disadvantages of slow curing speed, poor heat resistance, poor cold resistance, and poor storage stability. In order to overcome the shortcomings of traditional adhesives such as poor heat resistance, poor cold resistance, and poor storage stability, a new type of adhesive is produced by improving the formula. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J125/06C09J109/02C09J197/00C09J11/04
Inventor 何益庆
Owner 广西汇智生产力促进中心有限公司
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