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Fabrication method of wire electrode array structure for micro electrolytic machining

A technology of array structure and micro electrolysis, which is applied in the fields of machining electrodes, electric machining equipment, electrode manufacturing, etc., can solve the problems of low machining efficiency, difficulty in machining high aspect ratio microstructures, insufficient machining accuracy, etc. The effect of improving locality and improving steepness

Active Publication Date: 2016-01-20
江苏蔚之领域智能科技有限公司
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  • Application Information

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Problems solved by technology

[0009] The purpose of the present invention is to provide a method for preparing a wire electrode array structure for micro electrolytic machining, which solves the problems of low processing efficiency, insufficient processing precision and difficulty in processing high aspect ratio microstructures in the micro electrolytic machining process of the prior art. question

Method used

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  • Fabrication method of wire electrode array structure for micro electrolytic machining
  • Fabrication method of wire electrode array structure for micro electrolytic machining
  • Fabrication method of wire electrode array structure for micro electrolytic machining

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preparation example Construction

[0035] refer to figure 1 , the method for preparing a wire electrode array structure for micro-electrolytic machining of the present invention (describing the process of mask electrolytic deep etching combined with removal of back material to prepare wire electrodes), specifically includes the following steps:

[0036] Step 1. Pretreatment of the metal substrate: the metal substrate 1 is made of copper material. The purpose of the treatment is to make the surface of the sample smooth, clean and dry, and to be able to better adhere to the photoresist. The specific method is to polish the metal substrate 1 on a polishing machine. Polishing treatment to make the surface roughness Ra≤0.3, then use acetone, alcohol and deionized water to clean in sequence, then blow dry with nitrogen and dry on the dryer for use (see figure 1 a).

[0037] Step 2. Fabrication of patterned masking film for mask electrolytic processing: the masking film needs to have good electrical insulation. In th...

Embodiment

[0049] refer to Figure 4 , is the application of the electrode made by the method of the present invention, adopts the wire electrode array of the present invention to carry out metal microstructure array processing, implements according to the following steps:

[0050] Step 1, workpiece preparation ( Figure 4 a): The surface of the workpiece 10 to be processed is polished, cleaned, and dried for use;

[0051] Step 2, tool electrode preparation ( Figure 4 b): Using the above-mentioned wire electrode array manufacturing method (for the process principle, see figure 1 ) to make a wire electrode with integrated wire and frame, and control the distance between the wire electrode wires by controlling the width of the photoresist masking film during wire electrode fabrication, so that when the above wire electrode is used for electrolytic machining, the wire electrode The influence of mutual stray corrosion between them is small enough to improve the localization of processing...

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Abstract

The invention discloses a method for preparing a wire electrode array structure for micro-electrolytic processing. The steps include: step 1, pretreatment of a metal substrate; step 2, making a patterned masking film; step 3, electrolytic deep etching of the mask, and The surface-patterned metal substrate is used as the anode for electrolytic processing, and the mask is obtained by electrolytic deep etching to manufacture the tool cathode in the wire electrode template. The electrolytic etching time is determined according to the width of the photoresist pattern and the electrolytic current density until the metal with a sharp top is obtained. Grid line array pattern; step 4, remove the back material, remove the back material corresponding to the fabricated metal grid lines to obtain a line electrode array integrated with the frame, and it is ready. The method of the present invention can produce metal microstructure arrays with different shapes such as square, rectangle, rhombus, etc., and efficiently realize the metal microstructure arrays with large aspect ratio, high density and high processing quality.

Description

technical field [0001] The invention belongs to the technical field of micro electrolytic machining, the main application target is the preparation of metal microstructure arrays with high aspect ratios, and relates to a method for preparing a wire electrode array structure for micro electrolytic machining. Background technique [0002] In microelectromechanical systems, high aspect ratio microstructures can bring higher sensitivity, greater displacement or stronger driving force to microdevices, for example, in aerospace airborne equipment, micromirror arrays, microfluidic sensors, In terms of micro motors and micro nozzles, in order to obtain high reliability, high signal-to-noise ratio signals, high transmission efficiency, low energy loss, and high integration microsystems, the fabrication of high aspect ratio microstructures is an important pursuit in microelectromechanical systems. Target. [0003] Micro-electrolytic machining (EMM) is based on the principle of electr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23H3/04
Inventor 王权岱肖继明
Owner 江苏蔚之领域智能科技有限公司
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