A fan-out panel-level BGA package with extended pins and its manufacturing process

Abstract

The invention discloses a Fan-out Panel Level BGA package with extended pins and its manufacturing process. The second insulating layer, the second metal copper wiring, and the third insulating layer are composed. The manufacturing process is carried out according to the following steps: wafer thinning, wafer dicing, flip chip mounting, plastic packaging, film tearing and flipping, first insulation treatment, first drilling and copper wiring, second insulation Processing, the second punching and copper wiring, the third insulation treatment, the third punching and nickel-palladium-gold plating, printing and reflow soldering, cutting. The invention solves the problem of line crossover, saves cost, and improves electrical performance and product reliability.

Description

technical field [0001] The invention relates to a fan-out panel-level BGA package with extended pins and a manufacturing process thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] With the continuous development of technology, electronic packaging must not only provide chip protection, but also meet the increasing requirements of performance, reliability, heat dissipation, power distribution, etc. at a certain cost. The increase in the speed and processing capacity of functional chips requires more Higher pin count, faster clock frequency and better power distribution. The market needs electronic products to have more functions, longer battery life and smaller geometric size, adapt to lead-free soldering (protect the environment) and effectively reduce costs. [0003] The traditional QFN packaging technology requires the use of lead frames and bonding wires. To a certain extent, not only the packaging cost is high, but also t...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the deficiencies of the traditional packaging technology, and develop a fan-out panel-level BGA package with extended pins and its manufacturing process. The output wiring forms a three-dimensional state, thereby expanding the output pins. It does not use lead frames, PCBs, and metal welding wires, which reduces packaging costs and greatly reduces the packaging size. Copper wiring technology makes the connection more efficient, shortens the current and signal transmission distance, and improves the electrical performance and product reliability

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