Method for improving corrosion resistance of nickel-phosphorus chemical coating
A technology of chemical plating and corrosion resistance, which is applied in the direction of liquid chemical plating, coating, metal material coating process, etc., and can solve the problems of corrosion resistance decline and other problems
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Embodiment 1
[0030] (1) Electroless nickel-phosphorus plating on the surface of clean carbon steel substrate, plating solution formula for electroless nickel-phosphorus plating: nickel sulfate 25g / L, sodium hypophosphite 20g / L, sodium acetate 5g / L, sodium citrate 5g / L, Methyltetrahydroxyphthalic anhydride 1.5g / L, pH 4-5; bath temperature 85°C, electroless plating time 10 minutes;
[0031] (2) Put the nickel-phosphorus-plated substrate into the copper plating solution to replace copper plating. Copper plating solution: copper sulfate 20g / L, 20% dilute sulfuric acid 10g / L, 2-mercaptobenzothiazole 10mg / L, benzene ethylenediaminetetraacetic acid 2g / L; the bath temperature is 30 degrees Celsius, and the electroless plating time is 30 minutes;
[0032] (3) The substrate after copper plating is electroless-plated nickel-phosphorus again, and the plating solution formula for electroless nickel-plating phosphorus is: nickel sulfate 25g / L, sodium hypophosphite 20g / L, sodium acetate 5g / L, sodium citr...
Embodiment 2
[0035] (1) Electroless nickel-phosphorus plating on the surface of clean carbon steel substrate, plating solution formula for electroless nickel-phosphorus plating: nickel sulfate 25g / L, sodium hypophosphite 20g / L, sodium citrate 15g / L, citric acid 5g / L, Succinic acid 5g / L, malic acid 25g / L, pH 4-5; bath temperature 90°C, electroless plating time 5 minutes;
[0036](2) Put the nickel-phosphorus-plated substrate into the copper plating solution to replace copper plating. Copper plating solution: copper sulfate 20g / L, 20% dilute sulfuric acid 10g / L, 2-mercaptobenzothiazole 10mg / L, benzene ethylenediaminetetraacetic acid 2g / L; the bath temperature is 40 degrees Celsius, and the electroless plating time is 20 minutes;
[0037] (3) The substrate after copper plating is electroless nickel-phosphorous again, and the plating solution formula for electroless nickel-plating phosphorus is: nickel sulfate 25g / L, sodium hypophosphite 20g / L, sodium citrate 15g / L, citric acid 5g / L, amber Ac...
Embodiment approach
[0041] (1) Perform alkaline electroless nickel-phosphorus plating on the surface of a clean carbon steel substrate, and the plating solution formula for electroless nickel-plating phosphorus: nickel sulfate 25g / L, sodium hypophosphite 25g / L, sodium pyrophosphate 50g / L, thiourea 2mg / L, lead nitrate 1mg / L, pH value 10; bath temperature is 70°C, electroless plating time is 5 minutes;
[0042] (2) Put the nickel-phosphorus-plated substrate into the copper plating solution to replace copper plating. Copper plating solution: copper sulfate 30g / L, 20% dilute sulfuric acid 15g / L, 2-mercaptobenzothiazole 10mg / L, benzene ethylenediaminetetraacetic acid 2g / L; the bath temperature is 25 degrees Celsius, and the electroless plating time is 30 minutes;
[0043] (3) The substrate after copper plating is electroless nickel-phosphorous again, and the plating solution formula for electroless nickel-plating phosphorus: nickel sulfate 25g / L, sodium hypophosphite 25g / L, sodium pyrophosphate 50g / L...
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