Composite heat insulation material using phenolic resin and perlite as major raw materials and preparation method of composite heat insulation material
A technology of composite thermal insulation material and phenolic resin, which is applied in the field of thermal insulation material and its preparation, can solve the problems of organic thermal insulation materials such as aging resistance, toxic gas emission, large deformation coefficient, etc., and achieve small deformation coefficient, good fire resistance, The effect of long service life
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0030] Its specific preparation method steps are as follows:
[0031] (1) Grind the solid phenolic resin to 80~100 mesh or choose powdery resin directly, and choose a bulk density of 80~150 kg / m 3 Spherical closed-cell expanded perlite bulk;
[0032] (2) According to the mass fraction of resin 20~70%, expanded perlite 30~80%, auxiliary agent 5~10% to prepare raw materials;
[0033] (3) Fully mix the raw materials in step (2) evenly, and put them into a steel mold;
[0034] (4) Under the conditions of compression ratio of 1.25-2.5 and hot-pressing temperature of 200-240°C, hot-pressing and holding pressure for 1.5-2.5 hours, a composite insulation material with phenolic resin and perlite as the main raw materials can be obtained.
Embodiment 1
[0036] (1) Grind the solid boron-modified phenolic resin to 80-100 mesh; choose a bulk density of 80-150 kg / m 3 Spherical closed-cell expanded perlite bulk; choose silicone water repellent, hexamethylenetetramine curing agent, zinc stearate lubricant, and nitrile rubber toughening agent.
[0037] (2) According to the mass fraction of resin 40%, expanded perlite 50%, additives 10% (including 1% water-repellent agent, 7% curing agent, 1% lubricant, 1% toughening agent) to prepare raw materials.
[0038] (3) Mix the raw materials thoroughly and evenly, and put them into steel molds.
[0039] (4) Under the condition of compression ratio of 1.67 and hot pressing temperature of 220 °C, hot pressing was performed, and the pressure was maintained for 2 hours to obtain a phenolic resin / perlite composite insulation material.
[0040] The obtained phenolic resin / perlite composite insulation material sample has an apparent density of 290 Kg / m 3 , thermal conductivity 0.042 W / (m﹐K), comp...
Embodiment 2
[0042] (1) Grind the solid boron-modified phenolic resin to 80-100 mesh; choose a bulk density of 80-150 kg / m 3 Spherical closed-cell expanded perlite bulk; choose silicone water repellent, hexamethylenetetramine curing agent, zinc stearate lubricant, and nitrile rubber toughening agent.
[0043] (2) According to the mass fraction of resin 40%, expanded perlite 50%, additives 10% (including 1% water-repellent agent, 7% curing agent, 1% lubricant, 1% toughening agent) to prepare raw materials.
[0044] (3) Mix the raw materials thoroughly and evenly, and put them into steel molds.
[0045] (4) Under the conditions of compression ratio of 2 and hot pressing temperature of 220 °C, hot pressing was performed, and the pressure was maintained for 2 hours to obtain a phenolic resin / perlite composite insulation material.
[0046] The obtained phenolic resin / perlite composite insulation material sample has an apparent density of 320 Kg / m 3 , thermal conductivity 0.048 W / (m﹐K), compre...
PUM
Property | Measurement | Unit |
---|---|---|
Bulk density | aaaaa | aaaaa |
Apparent density | aaaaa | aaaaa |
Thermal conductivity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com