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Heat-conducting insulated pressure sensitive tape and preparation method thereof

A pressure-sensitive tape, thermal insulation technology, applied in the direction of adhesive, adhesive type, film/sheet adhesive, etc., can solve the problems of high cost, insufficient thermal conductivity, edge warping, etc., and achieve high production efficiency , The effect of convenient assembly and production, prolonging life

Active Publication Date: 2012-10-24
TIANJIN BOYUAN NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the existing thermally conductive insulating tape can guarantee the bonding strength, there are many shortcomings such as insufficient thermal conductivity and high cost. At the same time, the edge is prone to warping when die-cutting and assembling.

Method used

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  • Heat-conducting insulated pressure sensitive tape and preparation method thereof
  • Heat-conducting insulated pressure sensitive tape and preparation method thereof
  • Heat-conducting insulated pressure sensitive tape and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Step 1: Prepare polyacrylate adhesive as follows:

[0035] First, under a nitrogen environment, in a reaction vessel equipped with a stirrer and a reflux condenser, add 86 g of butyl acrylate, 5 g of acrylic acid, 10 g of 2-ethylhexyl acrylate, 20 g of toluene, 192.5 g of ethyl acetate, and trigger After mixing 0.2g of azobisisobutyronitrile evenly, control the temperature to 78°C, control the stirring speed to 70 rpm, add 0.2g of initiator azobisisobutyronitrile once every 2 hours, and react for 6 hours Cool down to room temperature to obtain a polyacrylate adhesive.

[0036] Step 2: Prepare the modified BN dispersion as follows:

[0037] (2-1) In a beaker, add 30g of BN particles with a micron-sized particle size of 5-15 μm, 10g of BN with a nano-sized particle size of 400-600nm, 10g of BN nanowires with a length of 300-600nm and 100g of ethanol, and carry out Mix evenly, pre-disperse with ultrasonic waves, the dispersion time is 20-40min, and the ultrasonic output ...

Embodiment 2

[0044] Step 1: Prepare polyacrylate adhesive as follows:

[0045] First, under a nitrogen environment, in a reaction vessel equipped with a stirrer and a reflux condenser, add 86 g of butyl acrylate, 5 g of acrylic acid, 10 g of 2-ethylhexyl acrylate, 20 g of toluene, 192.5 g of ethyl acetate, and trigger After mixing 0.2g of azobisisobutyronitrile evenly, control the temperature to 80°C, control the stirring speed to 70 rpm, add 0.2g of initiator azobisisobutyronitrile once every 2 hours, and react for 6 hours Cool down to room temperature to obtain a polyacrylate adhesive.

[0046]Step 2, prepare modified AlN dispersion liquid as follows:

[0047] (2-1) In a beaker, add 30g of AlN particles with a micron-sized particle size of 5-15μm, 10g of AlN with a nano-sized particle size of 400-600nm, 10g of AlN nanowires with a length of 300-600nm and 100g of ethyl acetate , mix evenly, and pre-disperse with ultrasonic waves, the dispersion time is 20-40min, and the ultrasonic outpu...

Embodiment 3

[0056] Step 1: Prepare Polyacrylate Adhesive:

[0057] First, under a nitrogen environment, in a reaction vessel equipped with a stirrer and a reflux condenser, add 86 g of butyl acrylate, 5 g of acrylic acid, 10 g of 2-ethylhexyl acrylate, 20 g of toluene, 192.5 g of ethyl acetate, and trigger After mixing 0.2g of azobisisobutyronitrile evenly, control the temperature to 80°C, control the stirring speed to 70 rpm, add 0.2g of initiator azobisisobutyronitrile once every 2 hours, and react for 6 hours Cool down to room temperature to obtain a polyacrylate adhesive.

[0058] Step 2: Prepare modified AlN, BN mixed dispersion:

[0059] (2-1) In a beaker, add 15g of AlN particles with a micron-sized particle size of 5-15μm, 5g of AlN with a nano-sized particle size of 400-600nm, 5g of AlN nanowires with a length of 300-600nm, 15g of micron-sized particles BN particles with a diameter of 5-15 μm, 5g of BN with a nano-scale particle size of 400-600nm, 5g of BN nanowires with a leng...

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Abstract

The invention relates to a heat-conducting insulated pressure sensitive tape and a preparation method of the tape. The principal technical features are as follows: the heat-conducting insulated pressure sensitive tape comprises a heat-conducting insulated pressure sensitive tape without a base material and a heat-conducting insulated pressure sensitive tape with the base material; and the preparation method comprises the following steps: (1) preparing a polyacrylate adhesive; (2) preparing modified heat-conducting filler dispersion liquid; and (3) mixing the polyacrylate adhesive prepared in the step (1) with the modified heat-conducting filler dispersion liquid prepared in the step (2), coating wet glues with different thicknesses onto a release protection layer by a film coater, and drying in a gradually heating way to prepare the heat-conducting insulated pressure sensitive tape without the base material; or bonding with the both faces of the base material to prepare the heat-conducting insulated pressure sensitive tape with the base material. The heat-conducting insulated pressure sensitive tape is high in heat conductivity, good in bonding performance and excellent in ageing resistance, has excellent die cutting processability, and can be widely applied to bonding of heat radiating fins and heating devices such as a CPU (central processing unit), a power tube, a module power supply and the like, as well as bonding of screens, frames and injection molded boards in electronic products such as a mobile phone, an LED (light emitting diode) device and the like.

Description

technical field [0001] The invention belongs to the field of heat-conducting adhesive tapes, and relates to a heat-conducting and insulating pressure-sensitive adhesive tape and a preparation method thereof. Background technique [0002] Thermally conductive tape is widely used in the heat conduction design of heat generating devices such as CPU, power tube, module power supply, and LED super large screen, so as to transfer heat efficiently and conveniently. As people's requirements for such electronic products are increasing day by day, light, thin, short and small have become an inevitable trend in the development of electronic equipment. At high operating frequency, the heat generated by electronic components also increases rapidly. At this time, the heat dissipation capacity becomes a key factor affecting its life, so there are higher requirements for thermally conductive insulating tape and its performance. Although the existing heat-conducting insulating tape can guar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J7/02C09J7/04C09J9/00C09J133/08C09J11/04
Inventor 李春刚鹿秀山张兰月刘柏松李维訾严吕树仁苏景丽孙鹏
Owner TIANJIN BOYUAN NEW MATERIALS
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