Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

New material for reducing LED junction temperature and preparation method thereof

A new type of material and plastic technology, applied in the field of composite materials or parts, can solve the problems of limited use of high-power LED lamp housing materials, poor mechanical strength, complex processing, etc., to improve the ability to transfer and dissipate heat, and improve mechanical strength and processability, improving the effect of compatible links

Inactive Publication Date: 2012-08-01
许永信
View PDF4 Cites 42 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] So similar to the above inorganic powders or their fibers - carbons such as graphite, graphene, carbon nanotubes, carbides such as silicon carbide, metal oxides or nitrides such as alumina, ceramic powder, zinc oxide, nitride Boron, aluminum nitride, metal powders such as silver powder, copper powder, aluminum powder, etc., have the ability to solve the heat dissipation problem of LED environmental protection lighting, and most of them have low price, low density, high transmission and high dispersion. The characteristics of thermal properties, but its complex processing and poor mechanical strength limit its use as a high-power LED lamp housing material

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • New material for reducing LED junction temperature and preparation method thereof
  • New material for reducing LED junction temperature and preparation method thereof
  • New material for reducing LED junction temperature and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058]

[0059] First put the graphite in the above formula in a blast drying oven at 125 degrees to bake for 2 hours, put the polyphenylene sulfide in a blast drying oven at 120 degrees and bake for 2 hours, and then put the weighed raw materials in the internal mixer After turning on the temperature for banburying for 5 minutes, enter the twin-screw extruder for mixing and modification, extrude into strips through the porous die of the machine head, and finally start the hot cutting to pelletize to obtain granular "new materials".

Embodiment 2

[0061]

[0062] First put the graphite and carbon nanotubes in the above formula in a blast drying oven at 125 degrees to bake for 2 hours, put the polyphenylene sulfide in a blast drying oven at 120 degrees and bake for 2 hours, then graphite and carbon nanotubes, polyphenylene sulfide After the ether and functional additives are mixed separately, the mixture of polyphenylene sulfide and functional additives is firstly metered into the screw extruder for plasticization, and then the mixture of graphite and carbon nanotubes is metered into the screw extruder for further plasticization Evenly dispersed, extruded into strips by the porous die of the machine head, and finally started to cut into pellets to obtain granular "new materials".

Embodiment 3

[0064]

[0065] First put the graphite and carbon fiber in the above formula in a blast drying oven at 90 degrees to bake for 8 hours, put the polyamide in a blast drying oven at 105 degrees and bake for 8 hours, and then put the weighed raw materials in the internal mixer Turn on the temperature for 18 minutes and enter the twin-screw extruder. The carbon fiber is added to the side feeder of the twin-screw extruder for mixing and modification. It is extruded into strips by the porous die of the machine head, and finally the hot cutting is started for pelletizing. A granular "new material" is obtained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
electron mobilityaaaaaaaaaa
Login to View More

Abstract

The invention relates to an inorganic material with high heat transfer and radiation characteristics in the technical field of LED (light-emitting diode) heat radiation. The technical scheme is as follows: a new material for reducing LED junction temperature comprises the following components in percent by weight: 50-90% of one or more inorganic material components A with high heat transfer and radiation characteristics, 5-48% of one or more plastic components B, and 2-20% of functional auxiliary agent component C. The preparing process of the new material for reducing the LED junction temperature comprises the following working steps: (1) heating and drying main materials; (2) respectively mixing organic materials and inorganic materials, and then metering and adding according to a proportion in sequence or adding after full mixing, banbury compounding, plastication and adhesion; (3) uniformly plasticizing and dispersing by a screw extruder; (4) extruding by a porous mold head to obtain strips; (5) carrying out mold head hot pelleting or strip cold pelleting; and (6) carrying out injection molding.

Description

technical field [0001] The present invention relates to the technical field of using inorganic substances with high heat transfer and heat dissipation characteristics for LED heat dissipation. It is based on the introduction of organic polymer materials based on inorganic substances with high heat transfer and high heat dissipation characteristics, and is prepared by special processes. Into a composite material or part with high transfer and high heat dissipation characteristics and low cost. Background technique [0002] Plastic has the characteristics of impact resistance, anti-aging, anti-ultraviolet, weather resistance, convenient and cheap processing and molding, and is widely used in the housing and lamp cup materials of electronic appliances such as energy-saving lamps and low-power LED lamps. Cup, because of its low thermal conductivity, it cannot meet the heat dissipation requirements of high-power LED lights under the condition of natural heat dissipation. [0003...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/12C08L67/00C08L67/02C08L77/00C08L81/02C08L71/12C08L101/12C08K13/02C08K3/04C08K13/04C08K7/00C08K7/06C08K3/22C08K3/34C08K7/08C08K3/38C08K3/00C08K3/28C08K3/08C04B26/02C04B26/04C04B26/10C04B26/20C04B26/18F21V29/00F21Y101/02F21V29/87F21Y115/10
Inventor 许永信
Owner 许永信
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com