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Black surface treatment process of electrolytic copper foil

A technology for electrolytic copper foil and surface treatment, which is applied in the field of high-precision electrolytic copper foil production technology to achieve the effects of excellent oxidation resistance and good appearance characteristics

Active Publication Date: 2010-12-08
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to provide a method that can solve the problem of high bending resistance of FPC, solve the requirement of copper foil etchability for the development of fine pitch of FPC, and solve the black problem when electrolytic copper foil is used instead of rolled copper foil for FPC. The black surface treatment process of copper foil with appearance problems, the copper foil obtained after this treatment process can reach the performance of FPC in terms of bending resistance, elongation, surface roughness, peel strength, moisture resistance, heat resistance and oxidation resistance. With copper foil requirements

Method used

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  • Black surface treatment process of electrolytic copper foil
  • Black surface treatment process of electrolytic copper foil
  • Black surface treatment process of electrolytic copper foil

Examples

Experimental program
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Effect test

Embodiment 1

[0037] The black surface treatment process of electrolytic copper foil, the specific process is as follows

[0038] 1. Preparation of roughening solution: mix and dissolve cathode copper, concentrated sulfuric acid, soft water, and steam to form a copper sulfate solution, then add additive A, mix well, pump it into the roughening tank for electroplating; among them, Cu 2+ 15g / L,H 2 SO 4 150g / L, Additive A 50ppm, temperature 40℃, current density 25A / dm 2 , Additive A selects thiourea for use.

[0039] 2. Preparation of curing solution: mix and dissolve cathode copper, concentrated sulfuric acid, soft water and steam to generate copper sulfate solution, pump it into the curing tank for electroplating; where Cu 2+ 65g / L, H 2 SO 4 85g / L, temperature is 80℃, current density is 32A / dm 2 .

[0040] 3. Weak coarsening: mix and dissolve cathode copper, concentrated sulfuric acid, soft water, and steam to form a copper sulfate solution, then add additive C to the copper sulfa...

Embodiment 2

[0046] The difference between this embodiment and embodiment 1 is:

[0047] 1. Coarsening: Cu 2+ 20g / L, H 2 SO 4 150g / L, additive A 10ppm, temperature 26°C, current density 30A / dm 2 , Additive A selects gelatin for use.

[0048] 2. Curing: Cu 2+ 58g / L,H 2 SO 4 160g / L, the temperature is 40℃; the current density is 25A / dm 2 .

[0049] 3. Weak coarsening: Cu 2+ 8g / L, H 2 SO 4 180g / L, additive C 1.2g / L, temperature 40°C, current density 7.5A / dm 2 , additive C is NaAsO 3 .

[0050] 4. Cobalt-plated alloy: K 4 P 2 o 7 140-300g / L, Co 2+ 15g / L, Zn 2+ 1.5g / L, additive M 420ppm, additive N 8.5g / L, pH 9.2, temperature 35°C, current density 12A / dm 2 , the additive M is Ag 2 SO 4 , the additive N is NH 4 AC.

[0051] 5. Galvanized alloy: K 4 P 2 o 7 220g / L, Zn 2+ 6.8g / L, additive D 145ppm, pH 9.6, temperature 40°C, current density 1.6A / dm 2 , the additive D chooses CuSO 4 .

[0052] 6. Passivation: potassium chromate 8.5g / L, pH 10.6, temperature 35...

Embodiment 3

[0055] The difference between this embodiment and embodiment 1 is:

[0056] 1. Coarsening: Cu 2+ 12g / L,H 2 SO 4 142g / L, Additive A 5.5ppm, temperature 45℃, current density 25 A / dm 2 , Additive A selects hydroxyethyl cellulose for use.

[0057] 2. Curing: Cu 2+ 70g / L, H 2 SO 4 95g / L, the temperature is 52℃; the current density is 30A / dm 2 .

[0058] 3. Weak coarsening: Cu 2+ 14g / L,H 2 SO 4 180g / L, additive C 1.8g / L, temperature 50°C, current density 9.2A / dm 2 , Additive C chooses NH 4 Cl.

[0059] 4. Nickel-plated alloy: K 4 P 2 o 7 180g / L, Ni 2+ 12g / L, Zn 2+0.5g / L, additive M 120ppm, additive N 3g / L, pH 10.8, temperature 40°C, current density 12A / dm 2 , the additive M chooses CoSO 4 ·7H 2 O, the additive N is triammonium citrate.

[0060] 5. Galvanized alloy: K 4 P 2 o 7 260g / L, Zn 2+ 5g / L, additive D 140ppm, pH 10.6, temperature 39°C, current density 0.68A / dm 2 , the additive D chooses NiSO 4 ·6H 2 O.

[0061] 6. Passivation: sodium chr...

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Abstract

The invention relates to a black surface treatment process of an electrolytic copper foil, belonging to the technical field of production processes of high and precision electrolytic copper foils. The black surface treatment process of an electrolytic copper foil is characterized in that a VLP (Very Low Profile) electrolytic copper foil of 8-12 mu m is used as an electrode, and then copper or copper alloy is roughened, solidified, weakly roughened and electrically deposited at a running speed of 25.0+ / -0.1m / min; a layer of nano-scale nickel or cobalt alloy and a layer of nano-scale zinc alloy are sequentially and electrically deposited; and then alkaline chromate passivation is carried out and a layer of coupling agent is coated. In the invention, the black copper foil for an FPC (Flexible Printing Circuit) is obtained by carrying out a series of special surface treatments on the ultrathin and VLP electrolytic copper foil of 8-12 mu m, wherein the surface roughness Ra of the obtained copper foil is smaller than or equal to 0.30 mu m, Rz is smaller than or equal to 2.5 mu m; the thickness of the copper foil subjected to the surface treatments is increased by 1.40-1.80 mu m; the copper foil does not contain elements having serious damages to the human body, such as lead, mercury, cadmium, stibium, and the like and has excellent oxidation resistance as well as corrosion and etching resistance; the peel strength of the copper foil on a PI (Polyimide) film reaches higher than 1.0N / mm, and the folding strength on the PI film reach more than 100 thousand numbers of times; the copper foil has good appearance characteristics after the copper foil is microetched, and after the copper foil is made into an FCCL (Flexible Copper Clad Laminate), the copper foil has similar appearance characteristics to a rolled copper foil; and the properties of the copper foil product are equivalent to that of an electrolytic copper foil with the same specification for the FCCL.

Description

technical field [0001] The invention relates to a black surface treatment process of electrolytic copper foil, belonging to the technical field of high-precision electrolytic copper foil production technology. Background technique [0002] Flexible Printed Circuit (FPC) has the advantages of softness, lightness, thinness and flexibility. It has been widely used in notebook computers, digital Cameras, mobile phones, video cameras, liquid crystal displays, electronic communications, aviation electrical and other products. From the mid-1990s to the present, the FPC market has rapidly shifted from military use to civilian use, focusing on consumer electronics products, forming a trend that almost all high-tech electronic products that have emerged in recent years use FPC in large quantities. [0003] FCCL (FCCL is the processing base material of flexible printed circuit board) is a special type of CCL (copper clad substrate). In addition to the advantages of thinness, lightness...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/00C25D5/10C25D5/34C25D5/48C25D7/06
Inventor 徐树民刘建广杨祥魁马学武宋召霞胡旭日
Owner SHANDONG JINBAO ELECTRONICS
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