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Method for improving corrosion resistance of copper by adding oxygen group alloy elements

An alloy element, anti-corrosion technology, applied in the field of anti-corrosion of metal surfaces, can solve the problems of high cost and high price, and achieve the effect of improving protection ability, reducing production cost and reducing packaging cost

Inactive Publication Date: 2011-04-13
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since high-purity copper is expensive, this method is costly

Method used

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  • Method for improving corrosion resistance of copper by adding oxygen group alloy elements
  • Method for improving corrosion resistance of copper by adding oxygen group alloy elements
  • Method for improving corrosion resistance of copper by adding oxygen group alloy elements

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] a. 0.5wt.% of S with a purity of 99.99wt.% is mixed with 99.5wt.% of pure Cu with a purity of 99.99wt.%.

[0027] b. Put the mixed material in the electric arc furnace, then vacuumize the furnace body, and feed high-purity argon gas, the flow rate of high-purity argon gas is 3000cm 3 / min, the air pressure is one atmosphere;

[0028] c. Start the electric arc furnace, set the discharge power to 2kW through glow discharge, heat up the copper and oxygen group alloy elements to 1133°C to melt, stop melting after 5 minutes of melting, cool down to room temperature, turn on the furnace, turn over the materials, and Turn the bottom one to the top, and turn the top one to the bottom. After turning over, close the furnace door, then vacuumize the furnace body, inject high-purity argon gas, and then re-melt and smelt. Repeat this process for 6 times to make Cu. -S alloy;

[0029] d. Put the prepared Cu-S alloy into a heating furnace with high-purity hydrogen and anneal it at a...

Embodiment 2

[0032] a. 0.1 wt.% of Se with a purity of 99.99 wt.% is mixed with 99.9 wt.% of pure Cu with a purity of 99.99 wt.%.

[0033] b. Place the mixed materials in the electric arc furnace respectively, then vacuumize the furnace body, and feed high-purity argon with a flow rate of 4000cm 3 / min, the air pressure is one atmosphere;

[0034] c. Start the electric arc furnace, set the discharge power to 5kW through glow discharge, heat up the copper and oxygen group alloy elements to 1150°C to melt, stop melting after 5 minutes, lower to room temperature, turn on the furnace, turn over the materials, and Turn the bottom one to the top, and turn the top one to the bottom. After turning over, close the furnace door, then vacuum the furnace body, inject high-purity argon gas, and then re-melt and smelt. Repeat this process for 7 times to make Cu. -Se alloy;

[0035] d. Put the prepared Cu-Se alloy into a heating furnace with high-purity hydrogen for annealing at a temperature of 600°C;...

Embodiment 3

[0038] a. Mix 0.05wt.% of Te with a purity of 99.99wt.% and 99.95wt.% of pure Cu with a purity of 99.99wt.%.

[0039] b. Place the mixed materials in the electric arc furnace respectively, then vacuumize the furnace body, and feed high-purity argon with a flow rate of 6000cm 3 / min, the air pressure is one atmosphere;

[0040]c. Start the electric arc furnace, set the discharge power to 10kW through glow discharge, and heat up the copper and oxygen group alloy elements to 1183°C to melt. After smelting for 5 minutes, stop the smelting, lower it to room temperature, turn on the furnace, turn over the materials, and put the original Turn the bottom one to the top, and turn the top one to the bottom. After turning over, close the furnace door, then vacuumize the furnace body, inject high-purity argon gas, and then re-melt and smelt. Repeated melting 8 times to make Cu -Te alloy;

[0041] d. Put the prepared Cu-Te alloy into a heating furnace with high-purity hydrogen for anneal...

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Abstract

The invention relates to a method for improving corrosion resistance of copper by adding oxygen group alloy elements, comprising the following steps: respectively mixing S, Se and Te with Cu, repeatedly smelting copper in an arc furnace to prepare Cu-S, Cu-Se or Cu-Te alloy and annealing the alloy in a heating furnace, preserving the heat for a certain time and cooling to room temperature to prepare corrosion resistant steel. The method has the following benefits: after the copper is corroded, the surface of the copper is covered by acicular whiskers and the density of the whiskers is high, after being added, the alloy elements are to partially replace oxygen to enter into the oxide lattices of the copper, thus weakening the forming capability of vacancy in the copper, blocking the lattices of the copper to spread, improving the protection capability of the copper oxide on the surface and ensuring the corrosion resistance of the alloy copper to be stronger than that of the pure copper; not only the corrosion resistance of the copper can be improved but also the production cost can be lowered by taking full advantage of the residual Se and Te in the copper smelting process; the packaging temperature of the packaging materials in the existing integrated circuits is lower than 673K, and not only the corrosion resistance of the packaging materials is improved but also the package cost is reduced by using the Cu-Se or Cu-Te alloy as the lead frame material.

Description

Technical field: [0001] The invention relates to a metal surface anti-corrosion method, in particular to improving the anti-corrosion ability of the surface of integrated circuit lead frame material copper components by adding oxygen group alloy elements when smelting copper. Background technique: [0002] Copper has good physical and chemical properties such as electrical conductivity, thermal conductivity, corrosion resistance and ductility. The electrical conductivity and thermal conductivity are second only to silver, and pure copper can be drawn into very thin copper wires and made into very thin copper foils. Because copper has the above-mentioned excellent properties, it has a wide range of uses in industry. Including the electrical industry, machinery manufacturing, transportation, construction, etc. At present, copper is mainly used in the field of electrical and electronic industries to manufacture wires, communication cables and other finished products such as m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22F1/08C22C1/02
Inventor 朱永福吕海波李建忱文子赵明蒋青
Owner JILIN UNIV
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