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Method for preparing insulation board

A thermal insulation board, room temperature technology, applied in the field of insulation board preparation, can solve the problems of poor performance competitiveness, high thermal conductivity, corrosion resistance, etc., and achieve the effect of strong viscosity, low thermal conductivity, and excellent thermal insulation performance

Inactive Publication Date: 2010-05-26
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, expanded vermiculite, foamed asbestos, foam glass, expanded graphite insulation materials, aluminate fibers, and insulation coatings are also produced and applied in a small amount in my country, but due to their poor competitiveness in terms of performance, price, and use, they are used in insulation materials. In the material industry, it only plays a supplementary and auxiliary role
[0003] The characteristics of flammability, non-corrosion resistance, and short life limit the scope of use of organic insulation materials, while traditional inorganic insulation materials have some problems such as relatively high thermal conductivity and large specific gravity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Step 1: Take 20g of 4', 4' diaminodiphenyl ether and add it into 100ml of dimethylformamide to fully dissolve and prepare mixed solution A;

[0014] Step 2: Mix sepiolite powder and glass microspheres with a particle size of 10-20 μm uniformly at a mass ratio of 1:1 to prepare a mixture B of sepiolite and glass microspheres, take 20 g of the mixture B and add it to the mixed solution A and stir evenly Obtain mixture C;

[0015] Step 3: Add 3ml of triethylamine and 3ml of acetic anhydride to the mixture C prepared in step 2, and then add 3,3' of the same amount as 4', 4' diaminodiphenyl ether while stirring , 4,4'-benzophenone tetraacid dianhydride, reacted for 1 hour, prepared sepiolite, glass beads, polyamic acid blend D;

[0016] Step 4: Put the above-mentioned blend D in a mold and heat it to 200°C for 3 hours, then control the pressure to 20Mp and the temperature to 300°C, extrude for 3 hours, demould, and cool naturally to room temperature to obtain a heat preserv...

Embodiment 2

[0018] Step 1: Take 40g of 4', 4' diaminodiphenyl ether and add it into 100ml of dimethylformamide to fully dissolve and prepare mixed solution A;

[0019] Step 2: Mix sepiolite powder and glass microspheres with a particle size of 10-20 μm uniformly according to a mass ratio of 1:3 to prepare a mixture B of sepiolite and glass microspheres, take 40 g of the mixture B and add it to the mixed solution and stir evenly to obtain mixture C;

[0020] Step 3: Add 5ml of triethylamine and 5ml of acetic anhydride to the mixture C prepared in step 2, and then add 3,3' in the same amount as 4', 4'diaminodiphenyl ether while stirring , 4,4'-benzophenone tetraacid dianhydride, reacted for 3 hours, prepared sepiolite, glass beads, polyamic acid blend D;

[0021] Step 4: Put the above blend D in a mold and heat it to 400°C for 1h, then control the pressure to 40Mp and temperature to 500°C, extrude for 1h, demould, and cool naturally to room temperature to obtain a heat preservation board. ...

Embodiment 3

[0023] Step 1: Take 30g of 4', 4' diaminodiphenyl ether and add it into 100ml of dimethylformamide to fully dissolve and prepare mixed solution A;

[0024] Step 2: Mix sepiolite powder and glass microspheres with a particle size of 10-20 μm uniformly at a mass ratio of 1:2 to prepare a mixture B of sepiolite and glass microspheres, take 30 g of the mixture B and add it to the mixed solution A and stir evenly Obtain mixture C;

[0025] Step 3: Add 4ml of triethylamine and 4ml of acetic anhydride to the mixture C prepared in step 2, and then add 3,3' of the same amount as 4', 4' diaminodiphenyl ether while stirring , 4,4'-benzophenone tetraacid dianhydride, reacted for 2 hours, prepared sepiolite, glass beads, polyamic acid blend D;

[0026] Step 4: Put the above-mentioned blend D in a mold and heat it to 300°C for 2 hours, then control the pressure to 30Mp and the temperature to 400°C, extrude for 2 hours, then demould, and cool naturally to room temperature to obtain a heat p...

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Abstract

The invention provides a method for preparing an insulation board. The method comprises the following steps: firstly, adding 4,4'-diaminodiphenyl ether into dimethyl fomamide to prepare mixed solution; mixing sepiolite powder and glass beads, adding the mixture into the mixed solution, uniformly stirring to obtain a mixture; respectively adding triethylamine and aceticanhydride into the mixture, and adding 3,3',4,4'-benzophenone tetracarboxylic dianhydride into the mixture for reaction to prepare a blend; and demolding the blend after the blend is extruded in a mould, and naturally cooling the blend to room temperature to obtain the insulation board. In the method, the sepiolite powder and the glass beads serving as inorganic phases and polyimide serving as an organic phase are adopted to prepare the insulation board which is high-temperature resistant and has long service life. Compared with common insulation materials, by sufficiently utilizing the advantages of corrosion resistance, light weight, low heat conductivity of the sepiolite powder and the glass beads, and high temperature resistance, water prevention, high adhesiveness and the like of the polyimide, the material has the advantages of low heat conductivity, light weight, acid and alkali resistance, corrosion resistance, wide application temperature range and the like, thereby having great market prospect.

Description

technical field [0001] The invention relates to a method for preparing a thermal insulation board, by which a lightweight, long-life and high-temperature-resistant thermal insulation board can be prepared. Background technique [0002] In recent years, energy saving and heat preservation have become a hot issue among people. To sum up, the insulation materials used in my country are mainly expanded perlite products, phenolic resin foam, polystyrene foam, rigid polyurethane foam and silicate composite materials. Expanded perlite and its products currently account for a large proportion of my country's building and industrial thermal insulation materials, about 44% of thermal insulation materials; phenolic resin foam is more suitable for some special occasions as thermal insulation materials or other functional materials. Polystyrene foam is made of polystyrene foamed and suitable as the preferred thermal insulation material for exterior wall insulation and finishing systems;...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/20
Inventor 黄剑锋王新震曹丽云吴建鹏
Owner SHAANXI UNIV OF SCI & TECH
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