Preparation method of copper clad plate

Abstract

The invention discloses a preparation method of copper clad plate and the method comprises the following steps: (1) adopting bismaleimide resin and allyl compound in a weight ratio of 100:40-100 to react at 110-160 DEG C for 10-120min and obtain prepolymer, cooling to room temperature after finishing the reaction, using acetone to prepare prepolymer solution; (2) adding 15-150 parts of epoxy resin with phosphorous, 10-100 parts of compound curing agent and 0-5 parts of curing accelerator in the solution obtained in the step 1, stirring evenly to obtain a glue solution, selecting a flat E-glassfibic cloth, coating the glue solution evenly on the glassfibic cloth, then roasting to prepare B-stage prepreg; (3) cutting the B-stage prepreg to proper size according to the size of a pressing machine, overlying five prepregs while placing two high impact copper foils with the same size separately on the top and bottom of the prepregs, placing the prepregs with copper foils in a vacuum hot pressing machine to press and obtaining the copper clad plate. The obtained copper clad plate can meet the demand for halogen-free and flame resistance, the heat resistance and humidity resistance are excellent, and the low dielectric loss and pressing toughness are good.

Description

technical field [0001] The invention relates to a method for preparing a copper clad laminate. Background technique [0002] Due to the rapid development of the current electronic industry, electronic products are required to develop in the direction of light weight, thinner, high performance, high reliability and environmental protection, so higher requirements are also put forward for printed circuit boards and copper clad boards. The specific requirements of its products are high heat resistance, low thermal expansion coefficient, high humidity and heat resistance, environmental protection and flame retardancy, low dielectric constant and dielectric loss, and high elastic modulus. [0003] As a high-performance resin matrix, bismaleimide resin has the characteristics of high moisture / heat resistance, radiation resistance, low dielectric constant and dielectric loss, high modulus, etc., and has broad application prospects. However, due to the shortcomings of bismaleimide ...

AI Technical Summary

Problems solved by technology

[0008](1) Improper ratio of phosphorus-containing resin to allyl-modified bismaleimide resin will cause compatibility problems;

[0009] (2) When the amount of phosphorus-containing resin is too large, it will affect the high heat resistance of the allyl-modified bismaleimide resin, such as Tg reduction , poor moisture resistance, etc., which also cannot meet the requirements of high-performance copper clad laminates

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