Silicon slice glazed surface scuffing control method

Abstract

The invention provides a method for controlling the scuffing of the polishing surface of a silicon chip. The method comprises the following steps: the silicon chips are pasted on polishing discs of a polishing machine; the polishing discs are fixed on a polishing head of the polishing machine; the pressure of the polishing machine and the rotational speeds of the upper polishing disc and the lower polishing disc are controlled; and polishing solution is injected to the polishing discs and between the silicon chips. The method has the improved aspects: the polishing solution comprises a grinding material, a penetrating agent, a lubricant, a PH regulator, a surfactant, a chelon and deionized water; the pressure of the polishing machine is controlled below 50 kilopascal; the rotational speed of the upper polishing disc is controlled below 60 revolutions per minute; and the rotational speed of the lower polishing disc is controlled below 60 revolutions per minute. The method can effectively reduce the scuffing of the surface of the polishing silicon chip, simultaneously ensure high removing velocity of polishing the silicon chip, has low production cost and is suitable for the requirement of scale production.

Description

technical field [0001] The invention relates to a silicon chip processing method, in particular to a method for controlling surface scratches on the polished silicon chip which can process and polish single crystal silicon chips for integrated circuit substrates and can reduce the degree of surface scratches. Background technique [0002] Silicon is a hard and brittle material with a diamond crystal structure and covalent bonds between atoms. It is a good semiconductor material. At present, more than 90% of integrated circuit semiconductor chips are silicon wafers (silicon wafers). In order to print integrated circuits on silicon wafers and combine them closely with other components, the surface of silicon wafers must be flat, especially as the integration level of integrated circuits continues to increase, the requirements for the flatness and roughness of silicon wafer surface are higher. strict requirements. [0003] Polishing is the second mechanical processing on the s...

AI Technical Summary

Problems solved by technology

For example, in the patent 03155318.4, by controlling the abrasive particle size, the polishing scratches are smaller than the above two polishing liquids, but the removal rate of the polished silicon wafer is reduced due to the change of the abrasive particle size

In the patent 200510055710.5, a polishing method using spherical silica abrasives is proposed. Although the effect of less polishing scratches is achieved, this method has higher requirements on abrasive performance and increases production costs. It is not suitable for large-scale production. easy to accomplish