Circuit substrate and manufacturing method thereof

A technology of circuit substrate and manufacturing method, which is applied in the fields of printed circuit manufacturing, circuit substrate material, multilayer circuit manufacturing, etc. It can solve the difficulty of transmitting signals, the difficulty of providing high-quality signal current in high-frequency areas, and the difficulty of circuit substrates adapting to high-frequency signals, etc. problem, to achieve low adhesion, suppress crosstalk or radiation noise

Inactive Publication Date: 2007-05-09
大见忠弘 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is very difficult to transmit a signal without noise
[0008] In addition, the circuit board described in Patent Document 1 is not only very difficult to adapt to high-frequency signals, but also it is difficult to provide high-frequency signals in the high-frequency region due to crosstalk or radiation noise between adjacent conductors (wiring) as the density of circuit boards increases. High quality signal current

Method used

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  • Circuit substrate and manufacturing method thereof
  • Circuit substrate and manufacturing method thereof
  • Circuit substrate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0126] 8-Ethyl-tetracyclo[4.4.0.1 2，5 .1. 7，10 ] Ring-opening polymerization of dodec-3-ene followed by hydrogenation reaction to obtain a hydrogenated polymer with number average molecular weight (Mn)=31,200, weight average molecular weight (Mw)=55,800, Tg=about 140°C. The hydrogenation rate of the obtained hydrogenated polymer is above 99%.

[0127] 100 parts of this hydrogenated polymer, 40 parts of maleic anhydride and 5 parts of dicumyl peroxide were dissolved in 250 parts of tert-butylbenzene, and the reaction was carried out at 140° C. for 6 hours. The obtained reaction product solution was added to 1000 parts of isopropanol to solidify the reaction product, and the obtained solid was vacuum-dried at 100° C. for 20 hours to obtain a maleic acid-modified hydrogenated polymer. This maleic acid-modified hydrogenated polymer had Mn=33,200, Mw=68,300, Tg was 170° C., and the maleic anhydride group content was 25 mol%.

[0128] Make 100 parts of maleic acid modified hydrog...

Embodiment 2

[0140] Except that the surface of the first electrical insulating layer 3 of the above-mentioned Example 1 was immersed in a permanganate treatment bath for 30 minutes, a multilayer circuit board B with wiring patterns on both sides and 4 layers was obtained in the same manner as in Example 1. The surface roughnesses of the first conductor layer 2 and the first electrical insulating layer 3 measured in the process of producing the substrate were 70 nm and 350 nm, respectively. The evaluation results are shown in Table 1 below.

Embodiment 3

[0142] Make 100 parts of the aforementioned maleic acid modified hydrogenated polymer, 40 parts of bisphenol A bis(propylene glycol glycidyl ether) ether, 0.1 part of 1-benzyl-2-phenylimidazole (curing accelerator), 5 parts of 2- [2-Hydroxy-3,5-bis(a,a-dimethylbenzyl)phenyl]benzotriazole (laser processability enhancer), 1 part of tris(3,5-di-tert-butyl-4 -Hydroxybenzyl)-isocyanurate, 10 parts of liquid polybutadiene (B-1000, manufactured by Nippon Petrochemical Co., Ltd.), 156 parts of ferrite material ( Toda Kogyo Co., Ltd.) was dissolved in a mixed organic solvent composed of 222 parts of xylene and 555 parts of cyclopentanone, uniformly dispersed and mixed using a planetary mixer, and a varnish containing fine magnetic powder was obtained.

[0143] A multilayer circuit board C with wiring patterns having 4 layers on both sides was produced in the same manner as in Example 1 except that the varnish containing fine magnetic powder was used. The surface roughnesses Ra of the ...

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Abstract

A circuit board having high adhessiveness contact between electrically insulating layers and having a low interlayer electric resistance is provided. A circuit board is provided with a first conductive layer formed on a core ( 1 ) and a first electrically insulating layer formed thereon. In the circuit board, a first conductor layer has a surface roughness Ra of 0.1 nm or more but less than 100 nm, and a first primer layer having a thiol compound as a main material is provided between the first conductive layer and the first electrically insulating layer. Thus, the circuit board which has excellent adhesiveness between the first conductor layer and the first electrically insulating layer and is also applicable to high frequency signal is provided.

Description

technical field [0001] The present invention relates to a circuit board, and more specifically, relates to a high adhesiveness between a conductor layer and an electrical insulating layer or between electrical insulating layers, and the noise of the conductor layer and the crosstalk or radiation noise between adjacent conductors (wiring) are not easy. Circuit boards used in high-frequency signals passing through circuits, electronic devices using circuit boards, and methods of manufacturing circuit boards. Here, the conductor layer may be either a layer composed only of a conductor or a layer including a circuit formed of a conductor. Background technique [0002] Along with miniaturization and multifunctionalization of electronic equipment, circuit boards used in electronic equipment are required to be further dense. [0003] Multilayering of circuit boards is well known as a general method for increasing the density of circuit boards. A multilayered circuit board (multil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K1/03H05K3/46H05K1/02
CPCH05K1/0216H05K1/024H05K1/0242H05K3/389H05K1/05
Inventor 大见忠弘森本明大加藤丈佳川崎雅史胁坂康寻
Owner 大见忠弘
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