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Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

A composition and adhesive technology, applied in the direction of adhesive types, carboxyl rubber adhesives, ester copolymer adhesives, etc., can solve the problem of reduced anti-migration performance, impossibility of large-scale use, acrylonitrile butadiene To solve the problem of expensive vinyl rubber and achieve good flame retardancy

Inactive Publication Date: 2006-11-22
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Examples of known materials satisfying the above requirements include an adhesive composition containing an epoxy resin, an aromatic phosphate ester, a curing agent, and high-purity acrylonitrile butadiene rubber, and a flexible rubber using the adhesive composition. Copper-clad laminates and cover films (see patent reference 1), however, high-purity acrylonitrile butadiene rubber is very expensive, which means that except for some special applications, the large-scale use of this material is impossible of
Also, an adhesive composition comprising an epoxy resin, an aromatic phosphate ester, a nitrogen-containing phenol novolac resin, and acrylonitrile butadiene rubber of normal purity, and a flexible copper clad using the adhesive composition Compression materials and cover films are also known (see patent reference 2), but because these materials use acrylonitrile butadiene rubber of normal purity, their migration resistance is reduced

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0144] Each component in the adhesive composition was mixed in the ratio shown in the column labeled Example 1 in Table 1, and then a mixed solvent of methyl ethyl ketone and dioxolane was added to the resulting mixture to produce a dispersion, Wherein the combined concentration of the organic solid component and the inorganic solid component is 35% by mass.

[0145] Then, the above dispersion was applied onto the surface of polyimide film A (trade name: Kapton H, manufactured by DuPont Toray Co., Ltd., thickness: 25 μm) in an amount sufficient to produce a thickness using an applicator. The as-applied coating was then dried at 120° C. for 10 minutes in a forced-air oven to transform the composition into a semi-cured state. The dispersion-coated surface of the polyimide film A and one surface of a rolled copper foil (trade name: BHY22BT, manufactured by Japan Energy Corporation, thickness: 35 μm) were used at 120° C. and a linear pressure of 2 kg / cm using a roll A type lamina...

Embodiment 2

[0147] A flexible copper clad laminate was prepared in the same manner as in Example 1, except that each component of the adhesive composition was mixed in the ratio shown in the column labeled Example 2 in Table 1. The properties of the flexible copper-clad laminate were also measured in accordance with the following measurement method 1. The results are shown in Table 1.

Embodiment 3-6

[0160]A dispersion was prepared in the same manner as in Example 1, except that each component of the adhesive composition was mixed in the proportions shown respectively in the columns labeled Examples 3-6 in Table 2. At the same time, one side of a polyimide film B (trade name: Apical NPI, manufactured by Kanegafuchi Chemical Industry Co., Ltd., thickness: 25 μm) was placed under predetermined conditions (pressure: 13.3 Pa, argon flow rate: 1.0 L / min, applied voltage: 2kV, frequency: 110kHz, power: 30kW, processing rate: 10m / min) for low-temperature plasma treatment. Subsequently, each of the above dispersions was applied to the low-temperature plasma-treated surface of the polyimide film using an applicator in an amount sufficient to produce a dry coating with a thickness of 25 μm, which was then dried in a forced-air oven. The applied coating was dried at 90° C. for 10 minutes, thereby turning the composition into a semi-cured state, and forming a covering film. The prop...

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PUM

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Abstract

Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and / or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates.

Description

technical field [0001] The present invention relates to an adhesive composition which is halogen-free and produces a cured product upon curing which exhibits excellent flame retardancy; and also relates to an adhesive sheet, cover film using the composition and a flexible copper clad laminate, and a method of bonding two substrates using the adhesive sheet. Background technique [0002] Conventionally, in order to ensure a high level of flame retardancy, adhesives used in electronic materials such as semiconductor sealing materials and glass epoxy-based copper clad laminates include bromine-containing epoxy resins or phenoxy resin etc. However, since compounds containing halogen such as bromine release toxic gas such as dioxin-based compounds when burned, the use of halogen-free materials in adhesives has been intensively studied in recent years. [0003] On the other hand, flexible copper laminates are being widely used, which are thinner and offer more flexibility than t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00B32B15/088B32B33/00C09J7/10C09J9/00C09J11/06C09J133/00C09J167/00H01B3/30
CPCB32B7/12B32B15/06B32B15/092B32B15/16B32B15/20B32B25/08B32B25/16B32B27/08B32B27/18B32B27/26B32B27/38B32B2264/104B32B2274/00B32B2307/202B32B2307/306B32B2307/3065B32B2307/5825B32B2405/00B32B2457/00C08J5/125C08K5/3462C08K5/34922C08K5/5205C08L33/08C08L33/20C08L55/02C08L63/00C09J11/06C09J113/00C09J133/08C09J133/20C09J155/02C09J163/00C09J2433/00C09J2455/00C09J2461/00C09J2463/00C09J2467/00C09K21/12H05K1/0346H05K1/0393H05K3/386H05K2201/012H05K2201/0133H05K2203/122C08L2666/02C08L2666/14C09J7/10Y10T428/24917Y10T428/2804Y10T428/31511Y10T428/31515Y10T428/31522Y10T428/31721Y10T428/31529C09J2301/408C09J133/06C09J109/02
Inventor 中西畅近藤和纪星田繁宏天野正
Owner SHIN ETSU CHEM CO LTD
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