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Epoxy resin complex with long chemical storage stability and temperature thixotropy

A technology of storage stability and epoxy resin, applied in the field of polymer material science, can solve the problems of unrepeatable rheological properties, no long-term chemical storage stability and temperature thixotropic epoxy resin compound, etc., to achieve Stable winding track, reduced resin and fiber waste, long storage period at room temperature

Inactive Publication Date: 2007-06-06
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN1156166A proposes to use polydibutyl terephthalate or its block copolymer as the anti-flow modifier of epoxy resin to obtain the pasty epoxy resin adhesive with stable anti-flow property, but this technology is in Heating at high temperature dissolves poly(dibutyl terephthalate) or its block copolymer in epoxy resin. During this process, poly(dibutyl terephthalate) or its block copolymer easily interacts with epoxy resin. Transesterification reaction, rheological properties cannot be repeated
However, no epoxy resin compound with long-term chemical storage stability and temperature thixotropy is given

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Add acetyl acetone lanthanide transition metal complex (0.2% to 2.0%) to the E-51 epoxy resin matrix (100%, the following are mass ratios), stir well at 85°C and add methyl tetrahydro Phthalic anhydride (50%~80%) and silane coupling agent KH-550 (0.5%~5.0%), heat up to 90℃, stir evenly, add nano silica (4%~20%) while stirring ), and then continue to stir the whole system for 5 hours to obtain the epoxy resin compound. The fiber prepreg experiment was performed on glass fiber. After the resin matrix was heated at a constant temperature of 50-60°C for 10-20 minutes, it was impregnated with continuous glass fiber or carbon fiber or aramid fiber 3060S. After infiltration, the continuous fiber prepreg was naturally cooled to room temperature. volume. It can be unrolled directly after storage at room temperature for 60 days. During storage, the viscosity changes little, no resin migration, no adhesion. It can meet the requirements of the resin matrix used in the prepreg wet windi...

Embodiment 2

[0016] Add acetyl acetone lanthanide transition metal complex (0.2% to 2.0%) to E-51 epoxy resin matrix (100%, the following are mass ratios), stir well at 85°C and add methyl hexahydro Phthalic anhydride (50%~80%) and silane coupling agent KH-550 (0.5%~5.0%), heat up to 90℃, stir evenly, add nano silica (4%~20%) while stirring ), and then continue to stir the whole system for 5 hours to obtain the epoxy resin compound. Fiber prepreg experiment for glass fiber. After the resin matrix is ​​heated at a constant temperature of 50-60℃ for 10-20 minutes, it is impregnated with continuous glass fiber or carbon fiber or aramid fiber for 30-60S. After infiltration, the continuous fiber prepreg is naturally cooled to room temperature ,Winding. It can be unrolled directly after storage at room temperature for 60 days. During storage, the viscosity changes little, no resin migration, no adhesion. It can meet the requirements of the resin matrix used in the prepreg wet winding technology. At ...

Embodiment 3

[0018] Add acetyl acetone lanthanide transition metal complex (0.2% to 2.0%) to the E-51 epoxy resin matrix (100%, the following are mass ratios), stir well at 85°C and add methyl tetrahydro Phthalic anhydride (50%~80%) and silane coupling agent KH-560 (1.0%~4.0%), heat up to 90℃, stir evenly, add nano silica (4%~20%) while stirring ), and then continue to stir the whole system for 5 hours to obtain the epoxy resin compound. Fiber prepreg experiment for glass fiber. After the resin matrix is ​​heated at a constant temperature of 50-60℃ for 10-20 minutes, it is impregnated with continuous glass fiber or carbon fiber or aramid fiber for 30-60S. After infiltration, the continuous fiber prepreg is naturally cooled to room temperature ,Winding. It can be unrolled directly after storage at room temperature for 60 days. During storage, the viscosity changes little, no resin migration, no adhesion. It can meet the requirements of the resin matrix used in the prepreg wet winding technology...

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Abstract

The invention discloses a category of epoxy resin complexes with long chemical storage stability and temperature thixotropy characterized in that the complexes are prepared by charging acetyl acetone lanthanides group transition metal complexes, methyl tetrohydrogen orthophthalic acid anhydride, silicane coupling agent, nano silica into epoxy resin base through uniform dispersion. The prepared resin system has good wettability with the reinforced material.

Description

Technical field [0001] The invention belongs to the field of polymer material science and technology. A type of epoxy resin compound with long-term chemical storage stability and temperature thixotropy is disclosed. In particular, it relates to an epoxy resin compound that meets the pre-soaked fiber winding technology process. Background technique [0002] Epoxy resin is a kind of thermosetting polymer composite material with good adhesion, corrosion resistance, electrical insulation and high strength. It has been widely used in the manufacture of a variety of metal and non-metal bonding, corrosion-resistant coatings, electrical insulation materials, FRP / composite materials, etc. It plays an important role in electronics, electrical, machinery manufacturing, chemical corrosion protection, aerospace, ship transportation and many other industrial fields, and has become an indispensable basic material in various industrial fields. The epoxy resin can only show its inherent excellent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/70C08L63/00C08K3/36C08K5/54
Inventor 陈平王秀杰刘扬
Owner DALIAN UNIV OF TECH
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