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One-chip ceramic electronic parts and mfg. method thereof

A technology of electronic components and manufacturing methods, which is applied in the direction of multilayer circuit manufacturing, fixed capacitance parts, electrical components, etc., can solve the problems of increasing the surface roughness of electrodes, malignant electrical characteristics of products, and reducing electrode coverage, etc., to achieve Excellent durability, high reliability, and material cost reduction effect

Inactive Publication Date: 2007-03-28
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But reducing the thickness will form pores in the electrode paste and increase the roughness of the electrode surface due to the decrease in the flatness of the electrode paste
These defects reduce the electrode coverage (electrode effective area) after sintering, thereby deteriorating the electrical characteristics of the product

Method used

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  • One-chip ceramic electronic parts and mfg. method thereof
  • One-chip ceramic electronic parts and mfg. method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0056] The invention is illustrated on the basis of the following examples.

[0057] Sample preparation

[0058] (1) Preparation of barium titanate (BaTiO 3 ) powder is used as ceramic raw material powder, and the powder is calcined at 800°C, 875°C or 950°C to form barium titanate particles with an average diameter of 98nm, 153nm or 210nm, respectively.

[0059] (2) Powdery oxides of dysprosium (Dy), magnesium (Mg), manganese (Mn), and silicon (Si) were added to barium titanate powder to prepare a ceramic composition.

[0060] (3) According to the ratio shown in Table 1, polyvinyl butyral (PVB) binder, dioctyl phthalate (DOP) plasticizer and solvent of mixture of ethanol and toluene were added to each ceramic composition. After the mixture is wet dispersed, the slurry is fully dispersed by sand milling.

[0061] Table 1

[0062] Ceramic area shrinkage

(%)

Ceramic powder

(weight percent)

Total PVB+DOP

(weight percent)

Solvent (ethanol+t...

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Abstract

A monolithic ceramic electronic component has a ceramic element including a plurality of ceramic layers and a plurality of internal electrode layers. Each internal electrode layer is disposed between two adjacent ceramic layers. The roughness of the interface between each internal electrode layer and each ceramic layer is about 200 nm or less, and the incidence of pores in the ceramic layer is about 1% or less by area at a polished cut cross-section. The monolithic ceramic electronic component can be a monolithic ceramic capacitor, a monolithic ceramic varistor, a monolithic ceramic piezoelectric component or a monolithic substrate.

Description

technical field [0001] The present invention relates to an electronic component and a manufacturing method thereof. In particular, the present invention relates to a monolithic ceramic electronic component having a ceramic element including a ceramic layer and an internal electrode layer and a method of manufacturing the same. Background technique [0002] Dielectric ceramic materials with a perovskite structure, such as barium titanate, strontium titanate, calcium titanate, etc., are widely used in capacitors due to their high dielectric constant. The trend toward miniaturization of electronic parts requires small capacitors with large electrostatic capacitance. [0003] Dielectric ceramic material A conventional monolithic ceramic capacitor used as a dielectric layer is sintered at a high temperature of about 1300°C, so it is necessary to use a noble metal such as palladium as an internal electrode material. The use of this expensive metal necessarily increases the mater...

Claims

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Application Information

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IPC IPC(8): H01G4/12H01G4/30H01C1/14H01C7/00H01C7/18H01L41/083H05K3/46
CPCH01G4/30H01C7/008H01C7/18H01L41/187H01C1/14H01L41/083Y10T29/43H10N30/50H10N30/853
Inventor 山名毅宫崎孝晴
Owner MURATA MFG CO LTD
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