Lead-free low-melting-point sealing glass doped with fusible metal alloy and preparation method of lead-free low-melting-point sealing glass

Abstract

The invention relates to lead-free low-melting-point sealing glass doped with fusible metal alloy and a preparation method thereof. The glass comprises the following components in percentage by weight: 60-85% of lead-free low-melting-point sealing glass; 8%-20% of a low-expansion filler; and 7%-20% of fusible metal alloy. The expansion coefficient of the lead-free low-melting-point sealing glass is matched with that of platinum group glass, the sealing temperature is smaller than or equal to 420 DEG C, and the lead-free low-melting-point sealing glass is good in chemical stability, high in sealing strength and easy to prepare. According to different characteristic index requirements, the proportion of each component can be flexibly adjusted, the formula of the glass is optimized, and the specific requirements of the market on the lead-free low-melting-point sealing glass are met.

Description

technical field [0001] The invention relates to the technical field of glass material preparation, in particular to a lead-free low-melting-point sealing glass doped with fusible metal alloys and a preparation method. Background technique [0002] As a kind of sealing material, low melting point sealing glass is superior to organic polymer materials in terms of air tightness and heat resistance, and superior to metal materials in terms of electrical insulation performance, so low melting point sealing glass has a wide range of applications. field of application. With the development of modern science and technology, especially the rapid progress in vacuum electronics technology, optoelectronics technology, microelectronics semiconductor technology, laser and infrared technology, electric light source, industrial testing and other fields, the miniaturization of devices and the precision of structural components are constantly increasing. As there are more and more types of e...

AI Technical Summary

Problems solved by technology

The expansion coefficient of the prepared lead-free bismuthate glass is (95.6~104.9)×10 -7 / °C, used for sealing at 480-500°C, the sealing temperature of this kind of glass is too high, which limits its practical use

[0007] Existing lead-free low-melting point sealing glasses all have different degrees of performance defects, such as high sealing temperature, easy crystallization of glass, poor chemical stability, narrow range of practical applications, etc.

Images