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Processing technology of epoxy glass fiber board

A technology of epoxy glass fiber and processing technology, which is applied in the direction of glass/slag layered products, synthetic resin layered products, chemical instruments and methods, etc. Oxygen glass fiber sheet thermal conductivity, poor interfacial compatibility and other issues, to achieve the effect of enhancing interfacial compatibility, increasing thermal conductivity, increasing elongation at break and tensile strength

Pending Publication Date: 2022-04-29
广东纵胜新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, since the epoxy glass fiber board is composed of glass fiber cloth and epoxy resin, the interface compatibility between the two is poor, so that the interlayer shear toughness of the prepared epoxy glass fiber board is poor, causing interlayer damage and causing Brittle fracture occurs, which greatly limits its application
In addition, the thermal conductivity of the epoxy glass fiber board is also one of the keys to the research. Due to the poor thermal conductivity of the epoxy resin itself, the thermal conductivity of the epoxy glass fiber board is affected.
In the prior art, the thermal conductivity of epoxy resin is generally improved by adding materials such as boron nitride and carbon fiber with thermal conductivity into the epoxy resin glue solution. Few studies have been done to increase the thermal conductivity of epoxy resin by curing agent. conductivity

Method used

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  • Processing technology of epoxy glass fiber board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026]Step 1: Preparation of materials: (1) Preparation of silica sol: 12 parts of tetraethyl silicate, 8 parts of N-(2-aminoethyl)-3-aminopropyltriethoxysilane are added to Dissolve in a reaction kettle containing 35 parts of ethanol; add 1mol / L hydrochloric acid solution to adjust the pH of the reaction solution to 2; set the stirring speed at 150rmp, and the reaction temperature at 80°C for 10 hours, cool to obtain silica sol. (2) Preparation of mixed curing agent: A. under inert gas, diphenylazaborane is added in the reactor containing methylene chloride solution, stirred and dissolved; concentrated sulfuric acid and concentrated nitric acid are added dropwise, and reacted for 4 hours at room temperature; After the reaction, put it into an ice-water bath, extract it with ether, adjust the pH=7 with a saturated aqueous solution of sodium bicarbonate, wash, and dry to obtain dinitrophenazaborane; put it in a reaction kettle, and add Isopropanol, iron powder, concentrated sul...

Embodiment 2

[0032] Step 1: Preparation of materials: (1) Preparation of silica sol: 16 parts of tetraethyl silicate, 12 parts of N-(2-aminoethyl)-3-aminopropyltriethoxysilane are added to Dissolve in a reaction kettle containing 40 parts of ethanol; add 1mol / L hydrochloric acid solution to adjust the pH of the reaction solution to 3; set the stirring speed at 180rmp, and the reaction temperature at 85°C for 12 hours, cool to obtain silica sol. (2) Preparation of mixed curing agent: A. under inert gas, diphenylazaborane is added in the reactor containing methylene chloride solution, stirred and dissolved; concentrated sulfuric acid and concentrated nitric acid are added dropwise, and reacted for 5 hours at room temperature; After the reaction, put it into an ice-water bath, extract it with ether, adjust the pH=8 with a saturated aqueous solution of sodium bicarbonate, wash, and dry to obtain dinitrophenazaborane; put it in a reaction kettle, and add Isopropanol, iron powder, concentrated s...

Embodiment 3

[0038] Step 1: Preparation of materials: (1) Preparation of silica sol: 14 parts of tetraethyl silicate, 10 parts of N-(2-aminoethyl)-3-aminopropyl triethoxysilane are added to Dissolve in a reaction kettle containing 38 parts of ethanol; add 1mol / L hydrochloric acid solution to adjust the pH of the reaction solution to 2.5; set the stirring speed at 165rmp, and the reaction temperature at 82°C for 11 hours, cool to obtain silica sol. (2) Preparation of mixed curing agent: A. under inert gas, diphenylazaborane is added in the reaction kettle containing methylene chloride solution, stirred and dissolved; concentrated sulfuric acid and concentrated nitric acid are added dropwise, and reacted for 4.5 hours at room temperature; After the reaction, put it in an ice-water bath, extract it with ether, adjust the pH=7.5 with a saturated aqueous solution of sodium bicarbonate, wash, and dry to obtain dinitrophenylazaborane; put it in a reaction kettle, and add Isopropanol, iron powder,...

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Abstract

The invention discloses a processing technology of an epoxy glass fiber board. The epoxy glass fiber board has the beneficial effects that epoxy resin formed by mixing petroleum-based epoxy resin and bio-based epoxy resin is used, and the curing capacity of the two resins at different curing temperatures is utilized, so that cohesion is generated between semi-curing and post-curing, a uniform cross-linked network is formed, and the tensile strength and interlayer fracture toughness of the epoxy glass fiber board are improved; the elongation at break and the tensile strength of the epoxy glass fiber board are improved by using the olive powder; diaminobenzene carborane and 5-chloro-m-phenylenediamine are mixed to form a curing agent; diaminobenzene carborane is used for optimizing the influence of complementary bio-based epoxy resin on the high-temperature adhesive; boron oxide formed by thermal oxidation degradation of nitrogen borane and silica sol are used for synergistically enhancing the flame retardance of the epoxy glass fiber board; 5-chloro-m-phenylenediamine has high thermal conductivity, and 5-chloro-m-phenylenediamine and silica sol cooperate to enhance the thermal conductivity of the epoxy glass fiber board and improve the heat dissipation performance.

Description

technical field [0001] The invention relates to the technical field of epoxy glass fiber boards, in particular to a processing technology of epoxy glass fiber boards. Background technique [0002] Epoxy glass fiber board is a kind of composite material with light weight, strong designability and high dielectric properties. It is widely used in electronic product parts, aerospace, automobile and other fields. Among them, since the epoxy glass fiber board is composed of glass fiber cloth and epoxy resin, the interface compatibility between the two is poor, so that the interlayer shear toughness of the prepared epoxy glass fiber board is poor, causing interlayer damage and causing Brittle fracture occurs, which greatly limits its application. In addition, the thermal conductivity of the epoxy glass fiber board is also one of the keys to the research. Due to the poor thermal conductivity of the epoxy resin itself, the thermal conductivity of the epoxy glass fiber board is affec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L99/00C08K9/02C08K7/14C08K3/36C08G59/50B32B17/04B32B17/12B32B27/04B32B27/38B32B33/00
CPCC08L63/00C08G59/504B32B5/02B32B5/26B32B33/00B32B2260/021B32B2260/046B32B2307/306B32B2307/302C08L2205/03C08L2205/025C08L2201/02C08L99/00C08K9/02C08K7/14C08K3/36
Inventor 张宗权陈建
Owner 广东纵胜新材料股份有限公司
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