Controllable preparation method of porous silicon material by using reducing agent
A technology of porous silicon and reducing agent, applied in chemical instruments and methods, silicon compounds, hybrid/electric double layer capacitor manufacturing, etc., can solve the problems of increasing costs and achieve the effect of reducing the preparation process
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Embodiment 1
[0042] In this embodiment, a reducing agent can controlly prepare porous silicon material, and the steps are as follows:
[0043](1) Commercial micro-SiO and MgB with a particle size of 1-2 μm 2 Mix evenly, SiO and MgB in the mixture 2 The mass ratio is 1:1;
[0044] (2) Heat the mixture prepared in the step (1) to 800°C in an inert atmosphere of nitrogen or argon, and keep it at a constant temperature for 6h to perform a reduction reaction; then cool to room temperature under an inert atmosphere to obtain a solid product ;
[0045] (3) Etching the solid product obtained in the step (2) with dilute hydrochloric acid with a concentration of 20% by mass for 12 hours, then repeatedly washing with deionized water, and then drying to obtain a porous silicon material. Its morphology is as figure 1 shown.
Embodiment 2
[0047] This embodiment is basically the same as Embodiment 1, and the special features are:
[0048] In this embodiment, a reducing agent can controlly prepare porous silicon material, and the steps are as follows:
[0049] (1) Commercial micro-SiO and MgB with a particle size of 1-2 μm 2 Mix evenly, SiO and MgB in the mixture 2 The mass ratio is 2:1;
[0050] (2) Heat the mixture prepared in the step (1) to 900°C in an inert atmosphere of nitrogen or argon, and keep it at a constant temperature for 6h to perform a reduction reaction; then cool to room temperature under an inert atmosphere to obtain a solid product ;
[0051] (3) Etching the solid product obtained in the step (2) with dilute hydrochloric acid with a concentration of 20% by mass for 12 hours, then repeatedly washing with deionized water, and then drying to obtain a porous silicon material. Due to the insufficient amount of magnesium boride, in this embodiment only the outer layer has a porous structure, and...
Embodiment 3
[0053] This embodiment is basically the same as the previous embodiment, and the special features are:
[0054] In this embodiment, a reducing agent can controlly prepare porous silicon material, and the steps are as follows:
[0055] (1) Nano-SiO with a particle size of 200-500nm 2 with MgB 2 Evenly mixed, SiO in the mixture 2 with MgB 2 The mass ratio is 2:3;
[0056] (2) Heat the mixture prepared in the step (1) to 800°C in an inert atmosphere of nitrogen or argon, and keep it at a constant temperature for 6h to perform a reduction reaction; then cool to room temperature under an inert atmosphere to obtain a solid product ;
[0057] (3) Etching the solid product obtained in the step (2) with dilute hydrochloric acid with a concentration of 20% by mass for 12 hours, then repeatedly washing with deionized water, and then drying to obtain a porous silicon material. Its morphology is as figure 2 shown.
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