Reflow-soldering plated-through-hole aluminum-based microstrip plate production process

Abstract

The invention discloses a reflow-soldering plated-through-hole aluminum-based microstrip plate production process. The production process sequentially comprises the following steps: blanking, drillingof plated through holes, silk-screen printing of solder resist ink on copper foils, three times of zinc immersion and zinc stripping, chemical plating of multi-element nickel alloy, acid copper plating of a printed board, removal of the silk-screen printing solder resist ink, plasma treatment, hole metallization and full-board copper plating, pattern transfer, pattern copper / nickel gold electroplating, etching, silk-screen printing of solder resist and characters, pasting of a protective adhesive film, secondary drilling, appearance processing and removal of the protective adhesive film; 180-mesh silk screens are adopted for silk-screen printing of the solder resist ink on the copper foils; through pretreatment process of three times of zinc immersion and zinc stripping, the bonding forceof a chemical nickel alloy plating layer and an aluminum base layer is improved; a traditional zinc immersion process is replaced with a chemical multi-element nickel alloy plating process, so that the bonding force between plating layers is enhanced, and the high-temperature resistance of the microstrip plate is improved; and the temperature resistance can reach 300 DEG C, and the requirement ofreflow soldering of the aluminum-based microstrip plate is met.

Description

Technical field: [0001] The invention belongs to the field of printed circuit board manufacturing, and in particular relates to a production process of an aluminum-based microstrip board with metallized reflow soldering holes. Background technique: [0002] (1) Aluminum-based microstrip boards began to be used in the military electronics industry in the early 1990s. Its structure is as follows figure 1 As shown, in the circuit design, part of the front microstrip wire (ie copper foil layer) is required to conduct with the aluminum base layer (ie metal base layer) on the bottom surface, such as figure 2 , that is, the via holes on the aluminum-based microstrip board require hole metallization. However, since the aluminum base layer of the aluminum-based microstrip plate is different from the ordinary FR-4 epoxy glass cloth substrate, the chemical activity of metal aluminum makes the conventional hole metallization technology unable to be directly carried out on the aluminum...

AI Technical Summary

Problems solved by technology

[0015] The purpose of the present invention is to overcome the above-mentioned shortcomings of the prior art, and provide a production process for aluminum-based microstrip boards with metallized holes for reflow soldering. The metallized aluminum-based microstrip boards produced have strong high temperature resistance, which can reach 300 ° C. , solve the quality problem of poor bonding force of the hole metallized aluminum-based microstrip plate coating, and meet the process requirements of reflow soldering

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