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A kind of composite solder containing WC and ZRC at the same time, its preparation method, and the method for brazing

A composite brazing material and brazing technology, which is applied in the direction of welding equipment, manufacturing tools, welding media, etc., can solve the problems of uneven distribution, agglomeration, wettability and climbing height difference of the brazing material, and improve the brazing material Effects of wettability and climbing height, improvement of bonding strength, and improvement of hardness

Active Publication Date: 2022-04-15
ANHUI UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the poor wettability and climbing height of the existing copper-based solder, and the problem that the solder is easily unevenly distributed and agglomerated, the invention provides a composite solder containing both WC and ZrC. By optimizing the solder formula, it improves Wettability and climbing height of solder to avoid agglomeration of solder

Method used

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  • A kind of composite solder containing WC and ZRC at the same time, its preparation method, and the method for brazing
  • A kind of composite solder containing WC and ZRC at the same time, its preparation method, and the method for brazing
  • A kind of composite solder containing WC and ZRC at the same time, its preparation method, and the method for brazing

Examples

Experimental program
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Effect test

Embodiment 1

[0050] A composite solder containing both WC and ZrC in this embodiment includes CuSnTi alloy phase and WC, ZrC mixed reinforcement phase, wherein the CuSnTi alloy phase includes 70% Cu, 20% Sn and 10% Ti, WC The addition amount of powder is 10% of the volume percentage of CuSnTi alloy phase, the particle size of WC powder is 50 μm, the addition amount of ZrC powder is 5% of the volume percentage of CuSnTi alloy phase, and the particle size of ZrC powder is 1 μm.

[0051] The composite solder containing WC and ZrC in this embodiment is used to connect diamond and Q460 steel to make a diamond grinding tool by brazing. Specifically, the preparation method of the composite solder in this embodiment and its implementation The steps of the brazing method are:

[0052] (1) According to the mass percentage, 70% Cu powder, 20% Sn powder and 10% Ti powder are uniformly mixed to obtain the CuSnTi alloy phase;

[0053] (2) After adding WC powder accounting for 10% by volume of the CuSnT...

Embodiment 2

[0059] A composite solder containing both WC and ZrC in this embodiment includes CuSnTi alloy phase and WC, ZrC mixed reinforcement phase, wherein the CuSnTi alloy phase includes 70% Cu, 20% Sn and 10% Ti, WC The addition amount of powder is 3.5% of the volume percentage of CuSnTi alloy phase, the particle size of WC powder is 40 μm, the addition amount of ZrC powder is 1.5% of the volume percentage of CuSnTi alloy phase, and the particle size of ZrC powder is 2 μm.

[0060] The composite solder containing WC and ZrC in this embodiment is used to connect diamond and Q460 steel to make a diamond grinding tool by brazing. Specifically, the preparation method of the composite solder in this embodiment and its implementation The steps of the brazing method are:

[0061] (1) According to the mass percentage, 70% Cu powder, 20% Sn powder and 10% Ti powder are uniformly mixed to obtain the CuSnTi alloy phase;

[0062] (2) After adding WC powder accounting for 3.5% of CuSnTi alloy ph...

Embodiment 3

[0068] A composite solder containing both WC and ZrC in this embodiment includes CuSnTi alloy phase and WC, ZrC mixed reinforcement phase, wherein the CuSnTi alloy phase includes 70% Cu, 20% Sn and 10% Ti, WC The amount of powder added is 8% of the volume percentage of CuSnTi alloy phase, the particle size of WC powder is 45 μm, the amount of ZrC powder added is 2% of the volume percentage of CuSnTi alloy phase, and the particle size of ZrC powder is 3 μm.

[0069] The composite solder containing WC and ZrC in this embodiment is used to connect diamond and Q460 steel to make a diamond grinding tool by brazing. Specifically, the preparation method of the composite solder in this embodiment and its implementation The steps of the brazing method are:

[0070] (1) According to the mass percentage, 70% Cu powder, 20% Sn powder and 10% Ti powder are uniformly mixed to obtain the CuSnTi alloy phase;

[0071] (2) After adding WC powder accounting for 8% volume percentage of CuSnTi al...

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Abstract

The invention discloses a composite solder containing WC and ZrC at the same time, a preparation method thereof, and a brazing method, belonging to the field of superhard abrasive tool production. Composite solder includes CuSnTi alloy phase and reinforcement phase, each component of CuSnTi alloy phase and its mass percentage are 70-75% Cu powder, 15-20% Sn powder and 5-10% Ti powder, and the reinforcement phase is WC Mixed powder with ZrC, wherein the reinforcement phase accounts for 5% to 40% by volume of the CuSnTi alloy phase; first mix the CuSnTi alloy phase and the reinforcement phase mechanically for a period of time, and then add 5% acrylic acid and 95% p A binder made of toluene is placed between the diamond and the Q460 steel surface to be welded, and then placed in a vacuum brazing furnace for vacuum brazing. The grinding experiment of the diamond tool prepared after brazing in the present invention shows that the diamond holding force is higher and the particle grinding effect is better.

Description

technical field [0001] The invention belongs to the field of making superhard abrasive tools, and in particular relates to a composite solder containing WC and ZrC at the same time, a preparation method thereof, and a brazing method. Background technique [0002] Due to its ultra-high hardness, wear resistance and corrosion resistance, diamond is often used to prepare grinding tools, and it is mostly used in energy, aerospace machinery, metallurgy, electronics, wood, stone processing and other industries. With the production of diamond tools It is becoming increasingly sophisticated and efficient, so it has aroused great attention from various industrial powers to this field. [0003] According to processing theory, the processing performance of diamond grinding tools is determined by two aspects: on the one hand, the ability of diamond to carry loads, that is, the strength of diamond and the ability of the bond to hold diamond; It is critical for single-layer bonded abrasi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K1/008B23K1/20
CPCB23K35/302B23K1/008B23K1/20
Inventor 徐东崔冰尹孝辉杨德张雷李胜男丁天然程战
Owner ANHUI UNIVERSITY OF TECHNOLOGY
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