One-way heat conduction special copper tube and preparation method thereof

A copper tube, one-way technology, applied in the field of one-way heat conduction special copper tube and its preparation, can solve the problems of poor heat conduction directivity, overheating of parts to be radiated, easy excessive heat dissipation, etc., and achieve the effect of improved thermal conductivity and good heat conduction

Active Publication Date: 2021-02-05
安徽德诠新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the poor heat conduction directivity of the existing special copper tubes, while enhancing the heat dissipation performance of the heat dissipation parts such as electronic components, there are also problems such as easy excessive heat dissipation or reverse heat conduction leading to overheating of the heat dissipation parts. The present invention provides One-way heat conduction special copper tube and preparation method thereof

Method used

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  • One-way heat conduction special copper tube and preparation method thereof
  • One-way heat conduction special copper tube and preparation method thereof
  • One-way heat conduction special copper tube and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] Prepare the polymer vesicle layer 3 on the outer wall of the inner copper tube 2:

[0064] 1) Select the outer wall of the inner copper tube 2 as the object covered with the polymer vesicle layer 3, which is recorded as the substrate reaction surface;

[0065] 2) Pretreatment of the reaction surface of the substrate, the pretreatment process is: degreasing, descaling, cleaning and drying of the reaction surface of the substrate;

[0066] Then it is subjected to template treatment, and the template treatment process is as follows: the inner wall of the inner copper tube 2 is coated with a layer of anti-acid film, placed in 1wt% dilute nitric acid solution for 30 seconds, taken out and cleaned, and then placed in ammonia gas Treat at 110°C for 2 hours in the atmosphere;

[0067] 3) Prepare a dichloromethane solution of saturated polystyrene-poly(ethylene-r-butylene)-polystyrene block copolymer, the saturated polystyrene-poly(ethylene-r-butylene)-polystyrene The dichloro...

Embodiment 2

[0079] Prepare the polymer vesicle layer 3 on the outer wall of the inner copper tube 2:

[0080] 1) Select the outer wall of the inner copper tube 2 as the object covered with the polymer vesicle layer 3, which is recorded as the substrate reaction surface;

[0081] 2) Pretreatment of the reaction surface of the substrate, the pretreatment process is: degreasing, descaling, cleaning and drying of the reaction surface of the substrate;

[0082] Then it is templated. The templating process is as follows: Potential activation is performed on the reaction surface of the substrate, an insulating polymer film is attached to the inner wall of the inner copper tube 2, the inner copper tube 2 is used as an electrode, and graphite is used as a counter electrode. Conduct electrodeposition activation in copper sulfate electrolyte, the activation current density is 10mA / cm 2 , the activation time is 2 minutes;

[0083] 3) Prepare a saturated polystyrene-poly4-vinylpyridine block copolym...

Embodiment 3

[0094] Prepare the polymer vesicle layer 3 on the inner wall of the outer copper tube 1:

[0095] 1) Select the inner wall of the outer copper tube 1 as the object covered with the polymer vesicle layer 3, which is recorded as the substrate reaction surface;

[0096] 2) Pretreatment of the reaction surface of the substrate, the pretreatment process is: degreasing, descaling, cleaning and drying of the reaction surface of the substrate;

[0097] Then it is templated. The templating process is as follows: a commercially available AAO film with a pore size of 400nm (AAO template) is used as a template for preparing a copper film, and the copper film is prepared by a secondary replica method, and the copper film is transferred through a scotch tape. And attach the copper film to the inner wall of the outer copper tube 1, carefully peel off the scotch tape, and then heat-treat at 500°C for 5 hours to complete the templating treatment and form a pre-template on the reaction surface ...

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Abstract

The invention relates to the field of heat conduction pieces, in particular to a one-way heat-conduction special copper pipe and a preparing method thereof. The one-way heat-conduction special copperpipe comprises an outer copper pipe body and an inner copper pipe body which are sleeved with each other. The inner wall of the outer copper pipe body communicates with the outer wall of the inner copper pipe body. The inner wall surface of the outer copper pipe body or the outer wall surface of the inner copper pipe body is covered with high-molecular vesicle layer. The high-molecular vesicle layer is composed of a plurality of high-molecular vesicles which contain liquid. One-way heat conduction can be realized, the problem of the overheat of a to-be-cooled piece caused by the inverse heat conduction in the cooling process or the heat loss caused by the inverse heat conduction during heating by means of the one-way heat conduction function can be avoided, and the problem of the damage tothe to-be-cooled piece caused by the excessive cooling or the damage to a to-be-heated piece caused by the too rapid temperature raising during heating by means of the one-way heat conduction function can be avoided.

Description

technical field [0001] The invention relates to the field of heat conduction parts, in particular to a unidirectional heat conduction special copper tube and a preparation method thereof. Background technique [0002] Special copper tubes are heat-conducting parts that are commonly used for heat dissipation of electronic components. They are also commonly referred to as heat-dissipating copper tubes. The heat generated by the components is dissipated to increase the heat dissipation area, and some special copper tubes are also passed through and circulated to further accelerate heat dissipation. However, the existing special copper tubes have relatively large defects and usage restrictions. [0003] For example, the existing special copper tubes are only suitable for situations where the temperature of electronic components is higher than the external ambient temperature and the external ambient temperature is relatively suitable, not too low or too high. A good heat dissi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/02
CPCF28D15/02
Inventor 朱胜利张惠斌朱艳杰仇慧萍
Owner 安徽德诠新材料科技有限公司
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