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Multilayer high-frequency printed circuit board copper foil surface coarsening solution and using method thereof

A printed circuit board, surface roughening technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problem that it is difficult to take into account the interlayer bonding force and high-frequency signal integrity of multilayer boards at the same time , to achieve excellent technical effects, improve processing efficiency, and reduce investment

Active Publication Date: 2019-09-17
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

[0006] In view of the problem that the surface roughening treatment technology in the background technology is difficult to simultaneously take into account the interlayer bonding force and high-frequency signal integrity of the multilayer board, the purpose of the present invention is to provide a multilayer high-frequency printed circuit board copper foil surface roughening The chemical solution and its use method, in this method, the coarsening treatment step uses the principle of chemical balance, and by adding a reaction regulator, the oxidation-reduction and dissolution precipitation are skillfully integrated together, and a layer that has the same properties as the resin is formed on the surface of the treated copper foil. Benzotriazole, a substance with strong affinity, realizes the organic balance between copper foil surface roughening and interlayer bonding force

Method used

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  • Multilayer high-frequency printed circuit board copper foil surface coarsening solution and using method thereof
  • Multilayer high-frequency printed circuit board copper foil surface coarsening solution and using method thereof
  • Multilayer high-frequency printed circuit board copper foil surface coarsening solution and using method thereof

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Embodiment 1

[0030] In this embodiment, M6G copper foil for high-frequency and high-speed printed circuit board manufacturing is selected. The thickness of the copper layer is 35 μm, and it is cut into a size of 40 mm×40 mm with a cutter.

[0031] A kind of surface roughening liquid of copper foil of multi-layer high-frequency printed circuit board, preparation steps are as follows:

[0032] First add a certain amount of deionized water, slowly add 75 grams of 98% concentrated sulfuric acid into the deionized water, stir while adding, and after the mixed solution is cooled, add 65 grams of 85% phosphoric acid, 45 grams of 30% hydrogen peroxide, and 8 grams of ethyl alcohol in sequence. Disodium diamine tetraacetate, 2 grams of benzotriazole, and 6 grams of polyethylene glycol were finally adjusted to 1000 ml with water to obtain the roughening solution required in this embodiment.

[0033] A method for roughening the copper foil surface of a multilayer high-frequency printed circuit board,...

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Abstract

The invention provides a multilayer high-frequency printed circuit board copper foil surface coarsening solution and a coarsening method thereof, and belongs to the technical field of printed circuit manufacturing. The copper foil coarsening solution comprises the components of hydrogen peroxide, sulfuric acid, phosphoric acid, a copper coordination agent, a corrosion inhibitor and the like, wherein the phosphoric acid, the copper coordination agent and the corrosion inhibitor form a reaction adjusting system, the oxidation reduction and the dissolution precipitation are skillfully fused together by adding a reaction regulator, and a layer of substance benzotriazole with strong affinity with resin is generated on the surface of the treated copper foil, so that organic consideration of surface coarsening and interlayer binding force of the copper foil is realized. Due to the fact that the copper reaction activity of the phosphoric acid system is low, air plasma activation is added before coarsening of the surface of the copper foil, high-activity particles such as electrons, positive ions, neutral particles and the like existing in the air plasma are utilized to activate copper, and then the treatment efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit manufacturing, and in particular relates to a surface roughening solution for copper foil of a multilayer high-frequency printed circuit board and a method for using the same. Background technique [0002] The communication capacity of 5G communication technology is 1000 times that of 4G, and the peak rate is about 10Gbps to 20Gbps. Compared with 4G communication, the transmission rate, data delay and connection density are several times higher. The wide application of 5G technology makes it subject to data transmission. Processing speed, including AR / VR, 4K high-definition video, unmanned driving, big data analysis and other industries have strong technical support. In order to improve the communication capacity and speed of the product, 5G communication needs to use a high-frequency communication frequency band of 3.5GHz to 30GHz. As we all know, with the increase of communication signa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18H05K3/38
CPCC23F1/18H05K3/383
Inventor 王守绪李浩霖何为周国云陈苑明王翀洪延
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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