A kind of anti/heat insulation stealth integrated skin and preparation method thereof

A technology of skin and heat insulation layer, which is applied in the field of anti/heat insulation stealth integrated skin and its preparation, and can solve the problems of low-frequency stealth performance that cannot be applied to metamaterials

Active Publication Date: 2021-09-14
BEIJING RES INST OF MECHANICAL & ELECTRICAL TECH
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem that the stealth scheme of the conventional absorbing structure cannot be applied to the high-temperature environment of high-speed flight and the low-frequency stealth performance of the electric loss type high-temperature resistant absorbing material or metamaterial is poor, the inventor proposes a Ultra-broadband absorbing structure with thermal performance and stealth performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of anti/heat insulation stealth integrated skin and preparation method thereof
  • A kind of anti/heat insulation stealth integrated skin and preparation method thereof
  • A kind of anti/heat insulation stealth integrated skin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Step 1: Prepare the metal structure layer

[0040] Titanium alloy Ta5 is selected as the high-strength metal alloy as the structural layer, and a metal structural layer with a thickness of 3mm is obtained by machining, and prefabricated holes are prepared by machining technology, which is convenient for bolt connection in the later stage. The spacing of the prefabricated holes is 300mm, and the The hole diameter is about 6mm.

[0041] Step 2: Preparation of organic absorbing layer

[0042] Pour fluorine rubber and micron magnetic nickel powder (30wt.%) into the open mill and knead evenly, and the kneading temperature is 50°C, and the above-mentioned mixture is pressed into a wave-absorbing layer raw film with a thickness of 2mm by a calender, and cut into Put the designed shape into the mold, heat up and vulcanize after closing the mold, and obtain the required magnetic wave-absorbing patch material. The dielectric constant and dielectric loss are about 20 and 0.1, res...

Embodiment 2

[0052] Step 1: Prepare the metal structure layer

[0053] Nickel alloy C276 is selected as the high-strength metal alloy as the structural layer, and a metal structural layer with a thickness of 0.8mm is obtained by machining, and prefabricated holes are prepared by machining technology, which is convenient for bolt connection in the later stage. The hole diameter is about 16mm.

[0054] Step 2: Prepare resin matrix containing magnetic absorber

[0055] Using micron magnetic iron-nickel alloy powder (75wt.%) as the wave absorbing agent and polyimide as the solvent, the wave absorbing agent and the solvent are fully mixed by mechanical stirring and ultrasonic dispersion to form a wave absorbing matrix to prepare the bottom magnetic resin base composite absorbing layer.

[0056] The third step: preparation of organic absorbing layer

[0057] The magnetic resin-based composite material layer is made of silica fiber-reinforced polyimide-based composite material, and aluminum ox...

Embodiment 3

[0067] Step 1: Prepare the metal structure layer

[0068] Titanium alloy Ta5 is selected as the high-strength metal alloy as the structural layer, and a metal structural layer with a thickness of 4mm is obtained by machining, and prefabricated holes are prepared by machining technology, which is convenient for bolt connection in the later stage. The spacing of the prefabricated holes is 260mm, and the The hole diameter is about 4mm.

[0069] Step 2: Prepare resin matrix containing magnetic absorber

[0070] Using micron iron powder (60wt.%) as a wave absorbing agent and polytetrafluoroethylene as a solvent, the wave absorbing agent and solvent are fully mixed by mechanical stirring and ultrasonic dispersion to form a wave-absorbing matrix to prepare the bottom magnetic resin-based composite material Absorbing layer.

[0071] The third step: preparation of organic absorbing layer

[0072] The magnetic resin-based composite material layer is made of quartz fiber-reinforced PT...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The present invention proposes an anti / heat-insulating stealth integrated skin and its preparation method. From the outside to the inside, it consists of a wave-transparent ceramic matrix composite material, an electric loss type wave-absorbing and heat-insulating integrated layer, a transition layer, an organic wave-absorbing layer, The above functional layers are connected by bolts of ceramic matrix composite materials to form a skin structure. Its core is to comprehensively optimize the design of stealth performance, heat insulation performance and structural load-bearing performance, effectively solve the problems of insufficient broadband absorbing performance of stealth structural materials and low structural strength under high temperature conditions, and finally realize the integrated skin design of stealth functions. The broadband stealth performance is through the design of multi-layer wave-absorbing periodic structure or resistive film. The outer layer of the anti-heat-insulation stealth integrated skin is designed with an electric loss type high-temperature-resistant wave-absorbing structure with heat insulation performance to achieve heat insulation and cooling and high absorption. High-frequency electromagnetic waves, and make the working temperature of the inner magnetic wave-absorbing material lower than its Curie temperature, and finally obtain the anti / heat insulation stealth integrated skin.

Description

technical field [0001] The invention belongs to the technical field of high-speed aircraft stealth, and in particular relates to an anti / heat-insulating stealth integrated skin and a preparation method thereof. Background technique [0002] During the flight of high-speed aircraft, the outer surface temperature will exceed 600°C due to severe aerodynamic heating, and the maximum temperature can reach more than 1400°C. Strong scattering components such as air intakes, wings, cabins, and tails of high-speed aircraft are all under high-temperature aerodynamic heating conditions. Down. Stealth performance is an important indicator of future high-speed aircraft, but the shape of high-speed aircraft is constrained by various design requirements such as overall, structure, and aerodynamics. The application of shape stealth technology is greatly restricted. The most important and effective technical approach of strong scattering. [0003] For magnetic loss materials, demagnetizati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/00B32B15/08B32B27/28B32B27/20B32B9/00B32B9/04B32B25/14B32B15/06B32B27/32B32B7/08B32B37/00B64C1/12
CPCB32B5/18B32B7/08B32B9/005B32B9/043B32B9/045B32B9/046B32B15/00B32B15/06B32B15/08B32B25/14B32B27/20B32B27/281B32B27/322B32B37/00B32B2262/10B32B2307/304B32B2311/18B32B2311/22B32B2315/02B32B2319/00B32B2327/18B32B2379/08B64C1/12B32B2266/126
Inventor 郝璐刘晓菲张松靖郭晓铛
Owner BEIJING RES INST OF MECHANICAL & ELECTRICAL TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap