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Non-volatile organic water-based soldering flux and preparation method thereof

A technology of organic matter and flux, applied in the field of volatile organic matter-free water-based flux and its preparation, can solve the problems of environmental pollution, instability, etc., and achieve the effects of stable chemical properties, simple production, and low solid content

Pending Publication Date: 2019-03-29
CHONGQING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the above-mentioned deficiencies of the prior art, and the purpose of the present invention is to provide a water-based flux without volatile organic matter and a preparation method; to solve the problem that the existing flux uses alcohols and ketones as carriers to generate a large amount of volatile gas, which is unstable , pollute the environment and other disadvantages

Method used

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preparation example Construction

[0039] A method for preparing water-based flux without volatile organic compounds, characterized in that: comprising the following steps:

[0040] Step 1: Add the active agent into the solvent and stir at a temperature of 30°C~60°C to promote the dissolution of the active agent;

[0041] The second step: add the surfactant to the solution obtained in the first step, stir and dissolve at a temperature of 30°C~60°C;

[0042] Step 3: Add film forming agent (if any), antioxidant, corrosion inhibitor, additive (if any) to the solution obtained in the second step, stir and dissolve at 30°C~60°C, mix well, and filter That is, the flux is obtained.

[0043] Further: in the second and third steps, use heating equipment to keep the temperature in the range of 30°C to 60°C.

[0044] The active agent of the present invention, its selectable specific mass percentage is: 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, etc., can satisfy Needs of the present invention; Surfactant, its op...

Embodiment 1

[0046] In this implementation, the raw materials are prepared according to the following mass ratio: the active agent is a mixture of DL-malic acid and itaconic acid, DL-malic acid:itaconic acid=1:1, the mass ratio is 2.5%, and the surfactant is NP-9 and AEO- 9 mixed, 2%, NP-9: AEO-9=1:1, corrosion inhibitor is hydroxypropyl chitosan 0.01%, antioxidant is hydroquinone 0.01%. The balance is solvent, and the solvent is deionized water.

[0047]When preparing, add the active agent into the solvent, stir at a temperature of 30°C to 60°C to promote its full dissolution, then add the surfactant to the solution, and stir at a temperature of 30°C to 60°C until it is completely dissolved; then Add film-forming agent (if any), corrosion inhibitor, antioxidant, additive (if any) to the aforementioned solution, stir and dissolve at a temperature of 30°C~60°C, mix evenly, cool and filter to obtain the flux .

Embodiment 2

[0049] In this implementation, the raw materials are prepared according to the following mass ratio: the active agent is a mixture of DL-malic acid and dimethylol butyric acid, the mass ratio is 3%, DL-malic acid: dimethylol butyric acid = 3:2, and the surfactant is AEO-9 mixed with American Air 465, 3%, AEO-9: American Air 465=1:1, film-forming agent is triethanolamine 0.15%, corrosion inhibitor is hydroxypropyl chitosan 0.08%, antioxidant Hydroquinone 0.08%, additive polyethylene glycol 400 0.2%, the balance is solvent, and the solvent is deionized water.

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PUM

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Abstract

The invention provides a non-volatile organic water-based soldering flux and a preparation method thereof. The soldering flux is prepared from, by mass, 2.5-7% of an active agent, 2-5% of a surfactant, 0-0.6% of a film forming agent, 0.01-0.2% of an antioxidant, 0.01-0.2% of a corrosion inhibitor, and the balance being deionized solvent water, wherein the active agent is prepared by mixing at least two of itaconic acid, pimelic acid, DL-malic acid, dimethylol butyric acid and methyl succinic acid in a corresponding mass ratio of more than 0% at 30-60 DEG C; the film forming agent is triethanolamine; the antioxidant is hydroquinone; and the corrosion inhibitor is hydroxypropyl chitosan. The water-based soldering flux has no halogen, no rosin, less solid content and small residual after welding and reduces corrosion on a circuit board; the welded surfaces are clean and bright; the volatile gas is little; the irritating odor is inexistent; the health of the operators is not affected; andthe soldering flux is environmentally friendly.

Description

technical field [0001] The invention belongs to the chemical industry field of preparing flux for circuit welding, and relates to a water-based flux without volatile organic matter and a preparation method thereof. Background technique [0002] Flux is an indispensable part of the welding process, and its main function is to remove oxides on the metal surface. In addition, it can also protect the welding area, reduce the surface tension of the liquid solder, improve the diffusion of the liquid solder, enhance the filling ability, and improve the heat transfer and balance of the welding area. [0003] At present, the active ingredients of some fluxes on the market contain halogens. Fluxes containing halogens can quickly remove the oxide film of the pad and enhance the wettability of the solder. However, the addition of halogens will weaken the reliability of solder joints and cause surface insulation. The reduction of resistance will also have adverse effects on the ecologic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K35/362B23K35/40
CPCB23K35/3612B23K35/362B23K35/40
Inventor 甘贵生田谧哲刘歆夏大权曹华东蒋刘杰蒋妮吴懿平
Owner CHONGQING UNIV OF TECH
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