An environment-friendly organic dry film stripping liquid

Abstract

The invention discloses an environment-friendly organic dry film stripping liquid, which comprises the following raw materials in parts by volume: 5-30 parts of organic base, 5-20 parts of an organicsolvent, 5-15 parts of an inhibitor, 0.1-5 parts of a corrosion inhibitor and 30-85 parts of deionized water. The circuit board of the invention is used for treating fine lines: 1. the dry film fallsoff completely, and there is no residual ''pinching film'' phenomenon; 2. the invention doe not attack a tin plating layer; 3. the dry film is broken into small diaphragms so as not to cause blockageto a pipeline; and 4. toxicity is low and wastewater is relatively easy to treat.

Description

technical field [0001] The invention relates to the field of wafer production, in particular to an environment-friendly organic dry film stripping solution. Background technique [0002] 1. During the manufacturing process of the circuit board, the material can be effectively protected by covering a layer of dry film on the surface of the material, or a photosensitive film mask can be formed on the surface of the material, and the pattern can be transferred after exposure. Dry film is one of the important "imaging" technologies when transferring graphics. Before entering the next process, the remaining photosensitive film or dry film on the surface of the material needs to be peeled off (removal). In this process, it is required to remove all remaining photosensitive film or dry film, and not to corrode any substrate. [0003] 2. The traditional dry film stripper is mainly prepared by combining polar organic solvents and strong alkalis. However, with the development of mu...

AI Technical Summary

Problems solved by technology

[0003] 2. The traditional dry film stripping solution is mainly prepared by combining polar organic solvents and strong alkalis

The contact area between the "clamp film" and the stripping solution is small, and it is difficult for the stripping solution to infiltrate the "clamp film", resulting in unclean stripping of the film, and the circuit after etching is prone to short circuit and other abnormalities

Therefore, the use of traditional inorganic alkali solutions such as sodium hydroxide and potassium hydroxide has been unable to meet the requirements of fine line processing

[0004] 3. In the production process of circuit boards, most of them need to be coated with a layer of tin on the surface to protect the circuit, but tin is an amphoteric metal, which is easily attacked by inorganic strong alkali solution, so the use of inorganic alkali solution is also subject to certain restrictions

[0005] 4. After the plate is treated by the inorganic strong alkali stripping solution, the dry film will fall off in a whole piece (large piece), which will easily cause blockage of the bath liquid pipeline during the stripping process, seriously affecting the service life of the stripping solution and equipment