A memristor switch device based on a-TSC: O ceramic film and a preparation method thereof
A technology of ceramic thin films and switching devices, applied in electrical components and other directions, can solve problems such as research reports on applications in the field of optoelectronics that have not been seen, achieve good near-infrared transmittance, achieve large-scale production, and broaden the selection range.
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Embodiment 1
[0031] This embodiment provides a memristive switch device, such as figure 1 As shown, its structure from bottom to top is "ITO slide 1, a-SiOx Thin film 2, a-TSC:O thin film 3, a-TSC thin film 4 "vertical four-layer structure," a-SiO x Thin film 2 / a-TSC:O thin film 3" double-layer structure acts as a double resistance layer (that is, the dielectric layer of the memristive switching device).
[0032] This embodiment provides a method for preparing the above-mentioned memristive switch device, and the preparation process includes the following steps:
[0033] Step A: prepare the ITO glass slide 1 as a transparent substrate with a bottom electrode, and perform cleaning and drying according to a standard process;
[0034] Step B: using a silicon target as a raw material target, oxygen and argon as a working gas, and depositing an a-SiOx film 2 on an ITO glass substrate 1 by reactive radio frequency sputtering as a first resistive layer;
[0035] Step C: Using Ti 3 SiC 2 Polyc...
Embodiment 2
[0052] This embodiment provides a method for preparing a memristive switch device, and the preparation process includes the following steps:
[0053] Step A: Prepare a K9 glass substrate as a transparent substrate, and perform cleaning and drying according to standard processes; then deposit an ITO film on it as a bottom electrode;
[0054] Step B: using a crystalline silicon target as a raw material target, oxygen and argon as a working gas, and depositing an a-SiOx film on the ITO film by reactive radio frequency sputtering as the first resistive layer;
[0055] Step C: Using Ti 3 SiC 2 The polycrystalline powder is used as the raw material target, oxygen and argon are used as the working gas, and the a-TSC:O film is deposited on the a-SiOx film by reactive radio frequency sputtering as the second resistive layer. The specific operation is as follows:
[0056] C1: Target preparation:
[0057] Ti 3 SiC 2 Add the powder into deionized water and stir evenly to obtain Ti 3...
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