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Cross-linkable fluororesin modified prepreg and thermosetting copper-clad plate prepared from same

A technology of cross-linked fluororesin and prepreg, which is applied in the field of communication materials to achieve broad application prospects, a good industrial production basis, and the effect of low thermal expansion coefficient

Active Publication Date: 2018-11-27
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, so far, no one has prepared a cross-linkable fluororesin and used it to modify a thermosetting copper-clad laminate, in order to establish a chemical cross-linking structure between the matrix resin and the fluororesin, so as to obtain a brand new product with higher comprehensive performance. Fluorine resin modified thermosetting copper clad laminate

Method used

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  • Cross-linkable fluororesin modified prepreg and thermosetting copper-clad plate prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028]Add 9 parts of divinylbenzene and 0.28 parts of bipyridine to 85 parts of tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer emulsion (DuPont Teflon® PFAD 335D, solid content 60%), stir well, and repeat freezing -Degassing-dissolving step three times to remove the oxygen in the system; then, add 0.45 parts of CuBr to the above system, repeat the freezing-degassing-dissolving step three times in the same way to further remove the oxygen in the system, at 85 ℃, vigorously stir After reacting for 32 hours, stir-dialysis to obtain a dispersion of divinylbenzene grafted PFA; then add 5 parts of SiO 2 (Xinyi Hongrun), 20 parts of flame retardant magnesium hydroxide (USA Albemarle MAGNIFIN H-5), 60 parts of TiO 2 (Tianjin Zhongzheng Huamei Technology), 0.65 parts of silane coupling agent KH550 (Nanjing Shuguang Chemical General Factory) and 0.24 parts of azobisisobutylamidine hydrochloride (Runxing Optoelectronics V-50), stir evenly at 20°C and tighten Then add 150 part...

Embodiment 2

[0030] The preparation method of the dispersion and the compound paste of divinylbenzene grafted PFA is the same as in Example 1; the compound paste is scraped into a film with a thickness of about 0.29 mm on a clean glass plate, and the After baking for 2 minutes, continue to bake at 210°C for 20 minutes. After it naturally drops to room temperature, peel off the film from the glass sheet to obtain a semi-cured dielectric sheet; take 2 sheets of the semi-cured dielectric sheet, 1 sheet of PTFE film and 2 pieces of loz copper foil, at a pressure of 120~150kg / cm 2 , and laminated for 8 hours at a temperature of 330° C. to obtain a fluororesin-modified thermosetting polybutadiene-based copper clad laminate.

Embodiment 3

[0032] The dispersion liquid of divinylbenzene grafted PFA is identical with embodiment 1; Then add 5 parts of SiO 2 (Xinyi Hongrun), 20 parts of flame retardant magnesium hydroxide (USA Albemarle MAGNIFIN H-5), 60 parts of TiO 2 (Tianjin Zhongzheng Huamei Technology), 0.65 parts of silane coupling agent KH550 (Nanjing Shuguang Chemical General Factory) and 0.24 parts of azobisisobutylamidine hydrochloride (Runxing Optoelectronics V-50), stir evenly at 20°C and tighten Then add 150 parts of DMF solution (Sabic SA9000) of 45wt% vinyl-terminated polyphenylene ether modified and stir vigorously evenly, wait until it is flocculated and precipitated until white sticky precipitate no longer appears, then pour off the solvent to obtain a composite paste; Scrape the composite paste on a clean stainless steel plate to form a film with a thickness of about 0.81mm, bake at 70°C for 5 minutes, and then continue to bake at 230°C for 35 minutes, and wait for it to cool down to room temperat...

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Abstract

The invention relates to a cross-linkable fluororesin modified prepreg and a thermosetting copper-clad plate prepared from the same. According to the cross-linkable fluororesin modified prepreg, a chemical cross-linking structure exists between fluororesin and matrix resin, the cross-linkable fluororesin modified prepreg has same dielectric property, heat stability, chemical stability and copper foil peel strength with a traditional fluororesin modified copper-clad plate, presents relatively high mechanical strength and harness and relatively low thermal expansion coefficient, is suitable forproducing multi-layer high-frequency copper-clad plates and can meet various performance requirements on functional diversification and complication of copper-clad plate materials in the field of high-frequency and high-speed communication at present. Therefore, the cross-linkable fluororesin modified prepreg has good industrial production basis and wide application prospects.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a crosslinkable fluororesin modified prepreg and a thermosetting copper clad laminate prepared therefrom. Background technique [0002] Thermosetting resins represented by epoxy resins, phenolic resins and cyanate resins have high thermomechanical properties, low thermal expansion coefficient, high quality and low price, convenient processing, and strong versatility. They are often used to make base materials for copper clad laminates. However, their high dielectric constant and dielectric loss limit their use only at low frequencies, which cannot meet the performance requirements of substrate materials in the current high-frequency and high-speed communication field. Later, people gradually developed copper-clad laminates based on thermosetting hydrocarbon resins represented by polybutadiene and vinyl-terminated polyarylethers. On the basis of ensuring the perf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/20B32B27/20B32B33/00C08L47/00C08L71/12C08L51/00C08K13/02C08K3/22C08K3/36C08F259/08C08F212/36
CPCB32B15/08B32B15/20B32B27/20B32B33/00B32B2307/308B32B2307/558B32B2307/714C08F259/08C08K2003/2224C08K2003/2241C08L47/00C08L71/12C08L51/003C08K13/02C08K3/22C08K3/36C08F212/36
Inventor 俞卫忠俞丞顾书春冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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