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Hollow glass bead cladded with phenolic resin, and preparation method of hollow glass bead

A technology of hollow glass microspheres and phenolic resin, applied in chemical instruments and methods, inorganic pigment treatment, dyeing polymer organic compound treatment, etc., can solve the problems of poor compatibility between the surface and the medium, achieve good interface compatibility and easy operation Ease of operation and enhanced stress resistance

Active Publication Date: 2018-11-16
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem of poor compatibility between the surface and medium of glass microspheres as filling materials, the invention provides a hollow glass microsphere coated with phenolic resin and a preparation method thereof

Method used

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  • Hollow glass bead cladded with phenolic resin, and preparation method of hollow glass bead
  • Hollow glass bead cladded with phenolic resin, and preparation method of hollow glass bead

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The coating process of phenolic resin on the surface of hollow glass microspheres is as follows:

[0021] 1. Hydroxylation treatment of hollow glass microspheres. Put 1 g of hollow glass microspheres into 20 mL of 20 wt % NaOH solution for 2 h, and control the temperature at 40 ° C;

[0022] 2. Separate the hollow glass microspheres in step 1 from the sodium hydroxide solution, and then drop them into a 100mL mixed solution containing phenol and formaldehyde, wherein the content of phenol is 0.01mol / L, and the molar ratio of phenol to formaldehyde is controlled at 1:1 , the temperature is controlled at 80°C, and the reaction is carried out for 2 hours under stirring;

[0023] 3. After the reaction, separate the hollow glass microspheres from the liquid, wash the microspheres with ethanol, and dry the microspheres at 50° C. to obtain hollow glass microspheres coated with phenolic resin.

[0024] figure 1 is the SEM photograph of the obtained coated microspheres. SEM ...

Embodiment 2

[0026] The coating process of phenolic resin on the surface of hollow glass microspheres is as follows:

[0027] 1. Hydroxylation treatment of hollow glass microspheres. Treat 1 g of hollow glass microspheres in 20 mL of 30 wt % NaOH solution for 1 h, and control the temperature at 50 ° C;

[0028] 2. Separate the hollow glass microspheres in step 1 from the sodium hydroxide solution, and then put them into a 100mL mixed solution containing phenol and formaldehyde, wherein the concentration of phenol is 0.01mol / L, and the molar ratio of phenol to formaldehyde is controlled at 1:1.5 , the temperature is controlled at 70°C, and the reaction is carried out for 1 hour under stirring;

[0029] 3. After the reaction, separate the hollow glass microspheres from the liquid, wash the microspheres with ethanol, and dry the microspheres at 50° C. to obtain hollow glass microspheres coated with phenolic resin. The thickness of the resin coating at this time was about 3 μm as observed by...

Embodiment 3

[0031] The coating process of phenolic resin on the surface of hollow glass microspheres is as follows:

[0032] 1. Hydroxylation treatment of hollow glass microspheres. Treat 1 g of hollow glass microspheres in 20 mL of 25 wt % NaOH solution for 2 h, and control the temperature at 30 ° C;

[0033] 2. Separate the hollow glass microspheres in step 1 from the sodium hydroxide solution, and then drop them into a 100mL mixed solution containing phenol and formaldehyde, wherein the concentration of phenol is 0.01mol / L, and the molar ratio of phenol to formaldehyde is controlled at 1:2 , the temperature is controlled at 60°C, and the reaction is carried out for 1.5h under stirring;

[0034] 3. After the reaction, separate the hollow glass microspheres from the liquid, wash the microspheres with ethanol, and dry the microspheres at 50° C. to obtain hollow glass microspheres coated with phenolic resin. The thickness of the resin coating at this time was about 0.5 μm as observed by ...

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Abstract

The invention discloses a hollow glass bead cladded with phenolic resin, and a preparation method thereof. The hollow glass bead is of a nuclear shell structure, and the inner kernel is a hollow glassbead, and the shell is the phenolic resin. The hollow glass bead is prepared from the following steps: firstly processing the hollow glass bead in a 20-30% NaOH solution at 30-50 DEG C to obtain a surface-hydroxylated hollow glass bead; and then putting the surface-hydroxylated hollow glass bead into a mixed aqueous solution containing phenol and formaldehyde, stirring and reacting at the temperature of 70-80 DEG C to obtain the product. The preparation method disclosed by the invention is simple, low on equipment requirement, low in cost, short in period, environmentally-friendly, safe, andeasy for industrial production; the composite hollow beam particle is uniform in cladding, the hollow bead has a certain tenacity and deformability while satisfying the high temperature resistance andpressure resistance; the hollow glass bead is low in breakage rate in a dynamic grinding environment, and can be well applied to automobile weight reducing materials, thermal insulation materials, coatings and other fields.

Description

technical field [0001] The invention belongs to the technical field of surface coating modification of hollow glass microspheres, in particular, it relates to a hollow glass microsphere coated with phenolic resin and a preparation method thereof. Background technique [0002] Hollow glass microsphere is a kind of hollow spherical powdery inorganic non-metallic material with very small mass. It is a new lightweight material with wide application and good performance developed in recent years. more and more popular. Hollow glass microspheres are specially processed glass microspheres, whose main features are smaller density and poorer thermal conductivity than glass microspheres. It is a new micron-scale lightweight material developed in the 1950s and 1960s. Its main component is borosilicate, with a general particle size of 10-250 μm and a wall thickness of 1-2 μm. Lightweight, heat and sound insulation, high compressive strength, high melting point, high resistivity, small...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/28C09C3/10C09C3/06
CPCC09C1/28C09C3/006C09C3/10
Inventor 万传云马敏刘喜亚叶俊勇
Owner SHANGHAI INST OF TECH
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