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A kind of low temperature resistant epoxy resin material and preparation method

A technology of epoxy resin and low temperature resistance, which is applied in the field of low temperature resistant epoxy resin materials and preparation, can solve the problem that the low temperature resistance performance of epoxy resin cannot be improved, and the impact resistance and stress resistance performance, impact resistance and stress resistance performance cannot be improved. Poor and other problems, to achieve the effect of increasing the upper limit of use temperature, good low temperature toughening effect, and good ultra-low temperature toughness

Active Publication Date: 2021-06-22
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Epoxy resin is widely used in aerospace, machinery and other industrial fields due to its excellent bonding performance, heat resistance, corrosion resistance, good mechanical properties, dimensional stability and manufacturability. The molecular chain has a three-dimensional cross-linked network structure, so there are disadvantages such as high brittleness, poor fatigue resistance, and poor impact toughness. , the effective means to solve this problem is to make the epoxy resin flexible. The flexible methods mainly include physical addition method and chemical modification method, or a combination of the two. The physical addition method is mainly to add toughening agent or plasticizer The chemical modification method is to modify the chemical structure of the curing agent or epoxy resin, but there are still problems in the existing prepared epoxy resin or its composite materials, which cannot maintain its high impact resistance and Defects in stress resistance limit its application in some fields
[0003] In the prior art, there are reports about adopting graphene to modify epoxy resin. Because the unique two-dimensional crystal structure of graphene endows it with excellent mechanical, thermal, optical, electrical and other properties, graphene has a good effect on epoxy resin. Modification can improve the dielectric properties, thermal stability and flame retardancy of epoxy resin, but in the above modification, the low temperature resistance of epoxy resin cannot be improved

Method used

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  • A kind of low temperature resistant epoxy resin material and preparation method
  • A kind of low temperature resistant epoxy resin material and preparation method
  • A kind of low temperature resistant epoxy resin material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Three functional fat ring epoxy resin 100 parts

[0032] 10 copies of hexanedylphenyl polyaryl ether sulfone

[0033] Graphene 0.5

[0034] Curing agent: 4,4'-diaminobenzylmethane, add amount of 30% of epoxy resin

[0035] Preparation Process:

[0036] In the first step, a certain amount of epoxy resin and graphene were weighed, and the epoxy resin was heated to 120 ° C, graphene, stirred for 10 hours, to obtain a mixture 1.

[0037] In the second step, the mixture 1 is poured into the conical bottle, and in the ultrasonic pool, the water bath temperature is controlled at 80 ° C, and the ultrasonic vibration is 4 hours to obtain a mixture 2.

[0038] In the third step, a quantitative hemolinophenyl polyarylene ether sulfone is weighing, and the mixture 2 is heated to 140 ° C, and the hemoliphenyl polyaryl ether sulfone is slowly added, and the stirring speed is 600r / min, and stirred for 100 minutes It is mixed uniform to give mixture 3;

[0039] In the fourth step, the cu...

Embodiment 2

[0042] Tri-functional epoxy resin TGAP 100 parts

[0043] 20 copies of hexaphenyl polyaryl ether sulfone

[0044] Graphie 0.8

[0045] Curing agent: 4,4'-diaminobenzylmethane, add amount of 30% of epoxy resin

[0046] Preparation Process:

[0047] The preparation process is the same as in Example 1. Tensile strength, impact strength, fracture toughness, and glass transition temperature of the liquid nitrogen temperature resistant to low temperature epoxy resin composites, as shown in Table 1.

Embodiment 3

[0049] Bisphenol F-type epoxy resin 100 parts

[0050] Two-formalne polysyl ether sulfone

[0051] Curing agent: 4,4'-di amino diphenylmethane, add amount of 30% of the epoxy resin mass,

[0052] Gradene Ethylene 0.7

[0053] The preparation process is the same as in Example 1. Tensile strength, impact strength, fracture toughness, and glass transition temperature of the liquid nitrogen temperature resistant to low temperature epoxy resin composites, as shown in Table 1.

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Abstract

The present invention proposes a low-temperature-resistant epoxy resin material and a preparation method thereof. The material is composed of epoxy resin, polyaryl ether sulfone, graphene and a curing agent. The graphene and polyaryl ether sulfone of the present invention are Aryl ether sulfone has a synergistic effect. Graphene regulates the phase separation degree of polyaryl ether sulfone and epoxy resin during the curing process, so that the phase structure of the composite material stays in the "double continuous phase structure" during the curing process. , so that the epoxy resin composite material has good ultra-low temperature toughness; the present invention achieves a synergistic effect between graphene and polyaryl ether sulfone by adjusting the proportion and content of various components and obtains a greatly improved comprehensive low temperature resistance performance The epoxy resin material, that is, the epoxy resin material of the present invention has the advantages of high mechanical properties and excellent thermal stability at the temperature of liquid nitrogen, and is easy to manufacture and process.

Description

Technical field [0001] The present invention relates to a low temperature epoxy resin material and a preparation method, which belongs to the technical field of composite materials. Background technique [0002] The epoxy resin is widely used in the field of aerospace, mechanical, etc., in the field of aerospace, mechanical, etc. in the field of aerospace, mechanical, etc. in its excellent bonding properties, heat resistance, corrosion resistance, good mechanical properties, dimensional stability, and corrosion resistance. The molecular chain has a three-dimensional crosslinked network structure, thereby having a large brittleness, poor fatigue resistance, and poor impact toughness, especially in ultra-low temperature, the epoxy resin is more susceptible to cracking, impact resistance and stress performance. The effective means of solving this problem is to make the epoxy resin flexible and flexible. The method is mainly physically added to chemical modification, or the combinati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L81/06C08K3/04C08G59/50
CPCC08G59/5033C08L63/00C08L2201/08C08L81/06C08K3/04
Inventor 刘思畅张涛陈磊嵇培军王国勇
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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