A kind of iron-nickel-aluminum-based bond diamond tool and preparation method thereof
A technology of diamond tools and base bond, applied in the direction of manufacturing tools, other manufacturing equipment/tools, etc., can solve the problems of high diamond grinding tool production cost, poor self-sharpening of bronze bond, sensitivity to sintering temperature, etc. Variable strength characteristics, good dry-type high temperature aerobic environment adaptability, excellent effect of medium temperature strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0029] A preparation method of an iron-nickel-aluminum-based bond diamond tool, comprising the following steps:
[0030] 1) Weigh the metal bond, sintering aid and abrasive according to the above composition, and mix them in a ball mill to obtain a diamond tool preparation material;
[0031] 2) cold pressing the diamond tool preparation material to obtain a diamond tool blank;
[0032] 3) Sintering the diamond tool body to obtain a diamond tool.
[0033] Preferably, in step 1), the rotating speed of the ball mill is 150-250r / min, the ball milling time is 3-5h, and the ball-to-material ratio is (5-15): 1; further preferably, in step 1), the rotating speed of the ball mill is 150~250r / min, the ball milling time is 3~4.5h, and the ball-to-material ratio is (6~12):1.
[0034] Further, in step 1), the total volume of the balls and the materials does not exceed 2 / 3 of the volume of the ball mill jar.
[0035] Preferably, in step 2), the compact density of the diamond tool blank i...
Embodiment 1
[0042] A kind of iron-nickel-aluminum base bond diamond tool, comprises the steps:
[0043] Fe 3 The mass fraction of Al is 40 parts, Ni 3 The mass fraction of Al is 40 parts, Fe 3 The particle size of Al powder is 8μm, Ni 3The particle size of the Al powder was 10 μm. The mass fraction of Cu-Sn pre-alloyed powder is 17 parts, and its particle diameter is 15 μm; the mass fraction of Si powder is 1 mass fraction, and its particle diameter is 3 μm; the mass fraction of B powder is 0.5 mass fraction, and its particle diameter is 2 μm; TiH 2 The mass fraction of the powder is 1.5 parts, and its particle diameter is 3 μm. Then add diamond abrasives so that the volume fraction of the grinding layer is 25%, and the particle size is 50 / 60 mesh. Put the metal bond, sintering aid and abrasive in the above ratio into a ball mill and mix thoroughly. The speed of the ball mill is 200r / min, the ball milling time is 3h, and the ball-to-material ratio is 6:1. Put the mixed abrasive too...
Embodiment 2
[0045] A kind of iron-nickel-aluminum base bond diamond tool, comprises the steps:
[0046] Fe 3 The mass fraction of Al is 42 parts, Ni 3 The mass fraction of Al is 42 parts, Fe 3 The particle size of Al powder is 15μm, Ni 3 The particle diameter of the Al powder is 20 μm. The mass fraction of Cu-Sn pre-alloyed powder is 12 parts, and its particle size is 20 μm; the mass fraction of Si powder is 2 parts, and its particle size is 10 μm; 5 μm; TiH 2 The mass part of the powder is 1 part, and its particle diameter is 10 μm. Then add diamond abrasives so that the volume fraction of the grinding layer is 18.75%, and the particle size is 40 / 50 mesh. Put the metal bond, sintering aid and abrasive in the above ratio into a ball mill and mix thoroughly. The speed of the ball mill is 150r / min, the ball milling time is 4h, and the ball-to-material ratio is 8:1. Put the mixed abrasive tool preparation material into a cemented carbide cold press mold for cold pressing, the pressure...
PUM
Property | Measurement | Unit |
---|---|---|
particle size (mesh) | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com