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Preparation method of ceramic capacitor

A technology of ceramic capacitors and ceramics, applied in the field of electronic equipment, can solve problems such as inability to adapt to component miniaturization, poor capacitor stability, and general withstand voltage characteristics, and achieve low production costs, excellent withstand voltage characteristics, and low equipment requirements.

Inactive Publication Date: 2017-01-04
ZHANGJIAGANG HONGJIA DIGITAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: in order to solve the problems that the dielectric constant of the ceramic capacitor prepared by the existing ceramic capacitor preparation method is low, the stability of the capacitor is poor, the withstand voltage characteristic is general, and the problem that it cannot adapt to the miniaturization of components is provided by the present invention. A preparation method of a ceramic capacitor, the prepared ceramic capacitor has a higher dielectric constant, good capacitor stability, and excellent withstand voltage characteristics

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A method for preparing a ceramic capacitor, comprising the steps of:

[0021] 1) MnCO 3 : 3%, CuO: 5%, SiO 2 : 10%, and the balance is BaTiO 3 Wet grind evenly, grind finely and then dry;

[0022] 2) mixing the dried ceramic composition in step 1) with a ceramic molding binder at a mass ratio of 9:1, stirring evenly, and die-casting to obtain a green body;

[0023] Among them, the binder for ceramic molding is composed of the following components by mass percentage: diatomite: 9%, silane coupling agent: 3%, polyvinyl butyral: 9%, sodium aluminate: 5%, acetic acid Ethyl ester: 7%, isopropanol: 13%, the balance is epoxy resin,

[0024] 3) The green body is degummed, sintered, and ultrasonically cleaned in sequence;

[0025] 4) Sorting, printing, reducing, testing and encapsulating the green body;

[0026] The debinding temperature is 400°C, the sintering temperature is 1430°C, and the sintering time is 4 hours.

Embodiment 2

[0028] A method for preparing a ceramic capacitor, comprising the steps of:

[0029] 1) MnO 2 : 12.6%, CuO: 15.5%, SiO 2 : 14%, Al 2 o 3 : 12% and the balance BaTiO 3 Wet grind evenly, grind finely and then dry;

[0030] 2) mixing the dried ceramic composition in step 1) with a ceramic molding binder in a mass ratio of 9:3, stirring evenly, and die-casting to obtain a green body;

[0031] Among them, the binder for ceramic molding is composed of the following components by mass percentage: diatomite: 8%, silane coupling agent: 2%, polyvinyl butyral: 8%, sodium aluminate: 4%, acetic acid Ethyl ester: 6%, isopropanol: 13%, and the balance is epoxy resin.

[0032] 3) The green body is degummed, sintered, and ultrasonically cleaned in sequence;

[0033] 4) Sorting, printing, reducing, testing and encapsulating the green body;

[0034] The debinding temperature is 400°C, the sintering temperature is 1430°C, and the sintering time is 3 hours.

Embodiment 3

[0036] A method for preparing a ceramic capacitor, comprising the steps of:

[0037] 1) MnO 2 : 5%, CuO: 9%, SiO 2 : 11%, Al 2 o 3 : 4% and the balance BaTiO 3 Wet grind evenly, grind finely and then dry;

[0038] 2) mixing the dried ceramic composition in step 1) with a ceramic molding binder in a mass ratio of 9:2, stirring evenly, and die-casting to obtain a green body;

[0039] Among them, the binder for ceramic molding is composed of the following components by mass percentage: diatomite: 10%, silane coupling agent: 4%, polyvinyl butyral: 11%, sodium aluminate: 8%, acetic acid Ethyl ester: 8%, isopropanol: 19%, the balance is epoxy resin,

[0040] 3) The green body is degummed, sintered, and ultrasonically cleaned in sequence;

[0041] 4) Sorting, printing, reducing, testing and encapsulating the green body;

[0042] The debinding temperature is 280°C, the sintering temperature is 1350°C, and the sintering time is 3 hours.

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Abstract

The invention belongs to the technical field of electronic equipment, and more specifically relates to a preparation method of a ceramic capacitor. The preparation method comprises following steps: 1, ingredients of an electronic ceramic composition are subjected to uniform wet grinding and drying; 2, the dried electronic ceramic composition is mixed with a ceramic molding adhesive at a certain ratio, and an obtained mixture is stirred to be uniform, and is subjected to pressure casting and moulding so as to obtain a green body; 3, the green body is subjected to adhesive removing, sintering, and ultrasonic cleaning successively; and 4, the green body is subjected to sorting, silver printing, reduction, measuring, and encapsulating; wherein adhesive removing temperature is controlled to be 280 to 400 DEG C, sintering temperature is controlled to be 1350 to 1430 DEG C, and sintering time is controlled to be 3 to 4h. The ceramic capacitor obtained via the preparation method possesses relatively high dielectric constant, high capacitor stability, and excellent voltage withstand characteristics; the preparation method is simple; equipment requirement is low; production cost is low; and profit rate is high.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a preparation method of a ceramic capacitor. Background technique [0002] Electronic ceramics refer to ceramic materials with stable mechanical properties, good corrosion resistance and aging properties, especially ceramic materials that can be used in electronics, communications, automobiles, machinery, textiles and other industries because of their excellent electrical properties. For example, piezoelectric materials can generate electric fields due to mechanical deformation, and can also generate mechanical deformation due to the action of electric fields. This inherent electromechanical coupling effect makes piezoelectric materials widely used in engineering, such as drives, energy converters, sensors, frequency control devices, etc., and the new generation of piezoelectric materials also has conditioned reflection and The ability to command analysis. This uni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/622C04B35/468
Inventor 徐靖赵维达徐丹范佳晨徐凯
Owner ZHANGJIAGANG HONGJIA DIGITAL TECH
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