Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A structure for improving the water-oxygen barrier performance of flexible substrates and its preparation method

A water-oxygen barrier, flexible substrate technology, used in semiconductor/solid-state device manufacturing, photovoltaic power generation, electrical components, etc., can solve problems affecting device life, deterioration, poor flexibility of ultra-thin glass, etc. Reliability, reducing temperature gradient and junction temperature, improving the effect of water and oxygen barrier effect

Active Publication Date: 2018-07-13
SHANGHAI UNIV
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although ultra-thin glass can well isolate moisture and air, ultra-thin glass is not flexible, fragile, high cost, difficult to prepare, and cannot be used alone in the flexible packaging process, requiring polymer coating Protect the glass surface from mechanical damage and chemical reagents, and the epoxy resin sealing technology at the edge cannot meet the requirements
The water and oxygen permeability of metal foil is also better than that of polymers, but the surface of metal foil is rough, needs to be planarized, and is opaque, so it can only be made into a top emission structure that uses transparent electrodes to emit light, which is not very practical
The polymer substrate is thin, transparent, and flexible. It is the best choice for realizing flexible devices from purely bendable to truly flexible. However, the water and oxygen transmission rate of polymers is high, and organic materials suitable for flexible devices Optoelectronic materials are very sensitive to the erosion of moisture and oxygen. A small amount of water and oxygen will cause the oxidation, crystallization or electrode degradation of the organic material in the device, which will affect the life of the device or directly cause damage to the device. Therefore, it is necessary to look for ways to improve the flexibility of polymers. The method of substrate water and oxygen barrier performance is of great significance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A structure for improving the water-oxygen barrier performance of flexible substrates and its preparation method
  • A structure for improving the water-oxygen barrier performance of flexible substrates and its preparation method
  • A structure for improving the water-oxygen barrier performance of flexible substrates and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Example 1 Graphene water-oxygen barrier layer and Ag compound to prepare OLED device with high light extraction efficiency

[0021] 1) Graphene CVD preparation: a copper foil (1cm*1cm) with a thickness of 25 microns and a purity of 99.8wt% was ultrasonically cleaned in acetone, isopropanol, and deionized water for 20 minutes in sequence. The cleaned copper foil is used as a polished anode, and the copper plate is used as a cathode for electrochemical polishing. Wherein, the proportion of the electrolyte is deionized water: phosphoric acid: ethanol: isopropanol: urea = 100ml: 50ml: 50ml: 10ml: 1g. The polished copper foil was then ultrasonically cleaned with acetone, ethanol, and deionized water for 10 minutes, and dried with high-purity nitrogen. Put the copper foil in the CVD reaction chamber, evacuate until the pressure in the reaction chamber drops below 1Pa, pass in a hydrogen / argon gas mixture (hydrogen 10%) to normal pressure, repeat this step 3 times, and contro...

Embodiment 2

[0026] Example 2 Graphene water and oxygen barrier layer doubles as electrode to prepare transparent OLED device

[0027] 1) Graphene CVD preparation: place copper foil (6cm*10m) with a thickness of 25 microns and a purity of 99.8wt% in the roll-to-roll PECVD reaction chamber in sequence, and vacuumize until the pressure in the reaction chamber drops below 1Pa, and pass through Hydrogen / argon mixed gas (hydrogen 20%) to normal pressure, repeat this step 3 times, control the flow rate of the mixed gas to 100 sccm, raise the temperature to 900°C, adjust the power of the RF power supply to 300W to generate the plasma glow of the whole tube, and inject carbon Source precursor CH 4 , the flow rate is 200sccm, the pressure is 650Pa, the moving speed of the copper foil is set to 60cm / hour, the carbon source precursor is cut off after the growth is completed, the flow rate of the mixed gas is kept constant, and the temperature is lowered to room temperature.

[0028] 2) Graphene tran...

Embodiment 3

[0031] Embodiment 3 single graphene as flexible substrate water oxygen barrier layer

[0032] 1) Graphene CVD preparation: Nickel foil (3cm*3cm) with a thickness of 20 microns and a purity of 99.9wt% was ultrasonically cleaned in acetone, isopropanol, and deionized water for 10 minutes, and dried with nitrogen. Place in the CVD reaction chamber, evacuate until the pressure in the reaction chamber drops below 1Pa, feed hydrogen / argon mixed gas (hydrogen 10%) to normal pressure, repeat this step 3 times, control the flow rate of the mixed gas to 100 sccm, Raise the temperature to 1000°C and feed the carbon source precursor C 2 h 2 , the flow rate is 20 sccm, the temperature is kept at 650 Pa for 10 minutes, the carbon source precursor is cut off, the flow rate of the mixed gas is kept constant, and the temperature is rapidly cooled to room temperature.

[0033] 2) Graphene transfer: In step 1), the nickel / graphene obtained is transferred to a PI substrate covered with a 15-mic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a structure for improving the water-oxygen barrier performance of a flexible substrate and a preparation method thereof. The structure is that a graphene-based water-oxygen barrier film and a polymer substrate are used to form a flexible substrate; the flexible substrate is positioned on an electrode / N Type semiconductor layer / active layer / P-type semiconductor layer, or electrode / P-type semiconductor layer / active layer / N-type semiconductor layer to form a complete device. The preparation method is to transfer the graphene film or graphene composite film to the polymer substrate. The process adopts any one of the bubbling method, the corrosion substrate method, and the heat release method. The transfer process is roll-to-roll transfer or small-size manual transfer. . The invention utilizes the hydrophobic and waterproof characteristics of double-layer and above graphene to improve the water-oxygen barrier effect of the flexible polymer substrate, can be widely applied to photoelectric devices of various structures, and further improves the photoelectric efficiency of the device.

Description

technical field [0001] The invention relates to a structure for improving the water-oxygen barrier performance of a flexible substrate and a preparation method thereof. Background technique [0002] With its advantages of bendability, light and thin design, low power consumption, durability, and portability, flexible devices will bring unlimited imagination to the future life of human beings, and are an important extension direction of smart cities, smart lighting, and smart life. At the same time, the rise of wearable devices has become another potential booster for the development of flexible device manufacturing technology. [0003] At present, the optional flexible substrates mainly include ultra-thin glass, polymer substrate, metal foil and so on. Various flexible substrate materials have different water resistance, oxygen resistance and bendability characteristics. Although ultra-thin glass can well isolate moisture and air, ultra-thin glass is not flexible, fragile,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K77/111H10K50/844H10K71/00Y02E10/549
Inventor 杨连乔魏斌陈章福张建华
Owner SHANGHAI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products