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Heat-resistant high-light-transmitting modified epoxy resin adhesive applied to chip encapsulation of LED plant growth lamp

An epoxy resin glue, plant growth technology, applied in the direction of epoxy resin glue, adhesive, polymer adhesive additives, etc., can solve the problems of affecting the light output efficiency and service life of the chip, short service life, low luminous efficiency, etc. Achieve the effect of improving mechanical properties and optical properties, simple use, and improving anti-corrosion properties

Inactive Publication Date: 2016-11-09
FUYANG GUANGPU LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] LED plant growth lamps are mostly composed of a number of uniformly distributed single lamps, of which a single lamp is packaged by several light-emitting chips. The production process generally includes crystal bonding, wire bonding, potting, cutting, testing, and packaging. A process, in which the performance of potting glue will directly affect the light output efficiency and service life of the chip. At present, the problems existing in the application process of LED plant lights are mainly low luminous efficiency, high light dispersion, and high-power chip packaging. There are problems such as poor heat dissipation and short service life

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] This example lithium modified epoxy resin glue is made from the following raw materials in parts by weight: bisphenol A epoxy resin 50, polypyrrole 6, diphenylsilanediol 4, graphene oxide 1, nano silicon dioxide 5, silane Coupling agent 0.1, m-phenylenediamine 10, aluminum isopropoxide 0.5, butyl glycidyl ether 5.

[0013] This modified epoxy resin glue is made by following steps:

[0014] (1) Mix, grind and disperse nano-silica and silane coupling agent for 20 minutes for later use;

[0015] (2) Put aluminum isopropoxide and graphene oxide into butyl glycidyl ether, and mix with airtight ultrasonic stirring for 3 hours to make a transparent sol for later use;

[0016] (3) Mix the other remaining materials evenly and then add the materials prepared in step (1) and step (2) in turn. After the addition is complete, stir and mix for 20 minutes. The mixed material is then filtered and vacuum degassed, and then coated on the chip or fluorescent layer , and the encapsulatio...

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Abstract

The invention discloses a heat-resistant high-light-transmitting modified epoxy resin adhesive applied to chip encapsulation of an LED plant growth lamp. The encapsulation adhesive is added with nano silica, diphenyl silanediol, graphene oxide and other raw materials, mechanical properties and optical properties of a traditional epoxy adhesive are improved, the resin adhesive has stronger heat resistance and condensation properties, and the added polypyrrole improves the anti-corrosion performance of the adhesive and improves the curing speed. Compared with the prior art, the prepared epoxy adhesive has good bonding strength, is compact in encapsulation, is hydrophobic, heat-resistant, dissipates heat and increases permeability, the service life of a chip is prolonged, better light intensity is obtained, the effective irradiation rate of plants is improved, and the epoxy resin adhesive is high in efficiency, capable of saving energy, simple in use and good in application prospect.

Description

technical field [0001] The invention relates to the technical field of LED encapsulation adhesives, in particular to a heat-resistant and high-transparency modified epoxy resin adhesive applied to LED plant growth lamp chip encapsulation. Background technique [0002] Illumination is a crucial factor in the process of plant growth. During the planting process, due to changes in natural conditions, especially in late autumn and winter, the light of plants is obviously insufficient. At this time, indoor supplementary lighting is particularly important. LED light source is an ideal artificial light source in the agricultural field that has emerged in recent years. Compared with traditional light sources, LED light source is energy-saving and environmentally friendly, with a pure spectrum and a wavelength range that fits the growth of plants. It has a huge market demand. [0003] LED plant growth lamps are mostly composed of a number of uniformly distributed single lamps, of whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08H01L33/56
CPCC08K2201/011C08L2201/08C08L2203/206C09J11/04C09J11/06C09J11/08C09J163/00H01L33/56C08L79/04C08K13/06C08K9/06C08K3/36C08K3/04C08K5/5419
Inventor 秦廷廷
Owner FUYANG GUANGPU LIGHTING TECH
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