High-power LED liquid cooled module lamp

A LED module, high-power technology, applied in cooling/heating devices, lighting devices, light sources, etc.

Inactive Publication Date: 2016-05-18
汪绍芬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] COB packaging is an inevitable trend of future development. In a sense, the core technology of LED packaging should be the R&D and manufacturing of LED brackets, which determine the thermal resistance, function, performance and cost of the package. At present, traditional light sources include single light sources, SMT light sources, integrated light sources, COB aluminum substrates, and flip-chip COB light sources are constantly researching LED bracket structures and process manufacturing technologies. However, the above-mentioned packaging technologies will encounter many problems such as: packaging thermal resistance, material temperature resistance, and dams Barriers such as glue blocking, packaging process and manufacturing cost, so it is imperative to design a new type of light source to solve the above problems

Method used

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  • High-power LED liquid cooled module lamp
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  • High-power LED liquid cooled module lamp

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Experimental program
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Effect test

Embodiment 1

[0023] 1, in Figure 1-3 Among them, the LED light source, driving power supply, heat dissipation, light distribution and protection are integrated to form a five-in-one LED module light, which includes: [1] LED light source and [2] two independent closed systems of driving power, The cooling liquid 7 is injected respectively, and the LED light source 11 and the power supply 21 are soaked in it, and the heat energy of the LED light source 11 and the power supply 2 is transferred to the heat sink 3 through the heat flow ring and dissipated.

[0024] 1. The functions and beneficial effects of the above [1] LED light source closed system design are:

[0025] 1-1, the LED chip 113 quickly transfers heat to the outside through the heat flow ring, which further reduces the thermal resistance of the package of the LED light source 11 and prolongs the service life of the LED light source 11 .

[0026] 1-2, since the refractive index of the cooling liquid 7 is higher than that of air,...

Embodiment 2

[0044]The LED light source 11 is designed with a WFCOB light source 110, which includes: a base plate 111 punched with N grooves, and fluorine rubber tubes 115 are arranged on both sides to wrap the weldable metal sheet 112, and the base plate 111 is punched out on both sides. The weldable metal sheet 112 covered with insulating rubber tube 115 is punched and wrapped to form a dam, and the LED chip 113 is placed in it, and its positive and negative electrodes are welded to the positive and negative ends of the metal sheet 112. On the pad 114 outside the dam of the sheet metal 112 . A kind of WFCOB light source 110, compared with various light sources widely popular at present, its effect and beneficial effect of above-mentioned design are:

[0045] 1. Compared with the integrated light source:,

[0046] 1-1 adopts an all-metal integrated structure, which not only eliminates the injection molding process, but also completely solves the problem that the plastic PPA will turn ye...

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PUM

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Abstract

The invention discloses a high-power LED liquid cooled module lamp which is characterized in that: 1. an LED light source, a drive power supply, heat dissipation, light distribution, and protection are integrated together to achieve a five-in-one LED module lamp; 2. the LED light source, the drive power supply are soaked in a cooling liquid to achieve the long service life of the LED light source and the drive power supply; and 3. a WFCOB light source is designed to achieve low thermal resistance, high lighting effect, high temperature resistance, and long service life.

Description

technical field [0001] The invention relates to semiconductor lighting, in particular to a high-power LED liquid-cooled module lamp. Background technique [0002] The liquid cooling technology used for LED heat dissipation was proposed by many people many years ago and some products came out. This technology is to soak the LED light source in the cooling liquid, and transfer the heat energy to the surroundings through the heat flow ring, which not only reduces the thermal resistance of the system, but also improves the light efficiency. , It can also improve the protection level of lamps and greatly prolong the service life of LEDs, which is a design idea that serves multiple purposes. However, in the actual design, due to the strict airtight requirements of the lamps and lanterns, they have to undergo repeated high and low temperature changes during work without leakage, and their structural design and processing technology are quite complicated. Most of the liquid-cooled ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/00F21Y101/02
Inventor 汪绍芬王枰中
Owner 汪绍芬
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