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Epoxy resin packaging material for dry-type transformer and preparation method thereof

A dry-type transformer and epoxy resin technology, applied in the field of transformer materials, can solve the problems of environmental pollution, performance degradation of packaging materials, poor heat resistance, etc.

Inactive Publication Date: 2016-03-16
WUHU JINNIU ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional epoxy resin has the following defects: strong odor, strong irritation, and pollutes the environment; it is difficult to control the molecular weight during the synthesis process, resulting in uneven batches and affecting batch stability; the process range is small, and the furnace temperature / The rotational speed has a great influence on the application requirements, and it is difficult to form a smooth surface; the adhesive force is too small, and there are inevitably gaps or air bubbles during use, which makes it difficult to ensure insulation performance, poor heat resistance, and is easily affected by electrothermal aging. The overall performance of the packaging material Decrease continuously, and finally affect the service life of the dry-type transformer

Method used

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preparation example Construction

[0012] The invention provides a method for preparing an epoxy resin encapsulation material for a dry-type transformer, comprising:

[0013] 1) Heat and melt epoxy resin, red brick powder, vinyltrimethoxysilane, nano-silicon dioxide, nano-alumina, bentonite, tantalum carbide, glass fiber, silk and polyethyl acrylate, and cool and solidify to obtain an improved permanent epoxy resin;

[0014] 2) Mix modified epoxy resin, organic solvent, pentaerythritol triacrylate, dodecyl dimethyl tertiary amine, polyacrylic acid, zinc phosphate, silicon powder, flame retardant and plasticizer and perform heat treatment, then cool , Grinding to obtain epoxy resin encapsulation material.

[0015] In step 1) of the present invention, the specific types of epoxy resin and polyethyl acrylate can be selected in a wide range, but in order to make the epoxy resin encapsulation material obtained have more excellent mechanical properties and electrical properties, Preferably, the epoxy resin is bisph...

Embodiment 1

[0026] 1) Epoxy resin (bisphenol A type), red brick powder (particle size is 2μm), vinyltrimethoxysilane, nano-silica (particle size is 20nm), nano-alumina (particle size is 5nm) , bentonite (particle size 3nm), tantalum carbide, glass fiber, silk and polyethylacrylate (weight average molecular weight 4500) according to the weight of 100:10:50:0.3:0.4:4:2.1:5:8:60 Mixed, then heated and melted at 140°C for 1.5h, then cooled and solidified at 32°C to obtain a modified epoxy resin;

[0027] 2) The above-mentioned modified epoxy resin, organic solvent (n-butanol), pentaerythritol triacrylate, dodecyl dimethyl tertiary amine, polyacrylic acid (weight average molecular weight is 6000), zinc phosphate, silicon powder (grain diameter of 2mm), flame retardant (melamine polyphosphate) and plasticizer (polyamide resin with a weight average molecular weight of 1500) according to the weight of 100:160:35:25:18:20:10:0.8:1 The epoxy resin encapsulation material A1 was prepared by mixing a...

Embodiment 2

[0029] 1) Epoxy resin (bisphenol F type), red brick powder (particle size is 1 μm), vinyltrimethoxysilane, nano-silica (particle size is 15nm), nano-alumina (particle size is 2nm) , bentonite (particle size is 2nm), tantalum carbide, glass fiber, silk and polyethylacrylate (weight average molecular weight is 3500) according to the weight of 100:7:40:0.1:0.3:3:2:4:6:55 Mixed, then heated and melted at 135°C for 1 hour, then cooled and solidified at 30°C to obtain a modified epoxy resin;

[0030] 2) The above-mentioned modified epoxy resin, organic solvent (cyclohexanone), pentaerythritol triacrylate, dodecyl dimethyl tertiary amine, polyacrylic acid (weight average molecular weight is 5000), zinc phosphate, silicon powder (grain diameter of 1mm), flame retardant (melamine polyphosphate) and plasticizer (polysulfide rubber with an average molecular weight of 3500) according to the weight ratio of 100:150:25:17:15:15:7:0.6:0.3 Mix and heat-treat at 140° C. for 40 minutes, then c...

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Abstract

The invention discloses an epoxy resin packaging material for a dry-type transformer and a preparation method thereof. The preparation method comprises the steps that 1, epoxy resin, red brick powder, vinyl trimethoxy silane, nanosilicon dioxide, nano aluminum oxide, bentonite, carbonized tantalum, glass fiber, silk and polyacrylic acid ethylester are heated, fused, cooled and solidified to obtain modified epoxy resin; 2, the modified epoxy resin, an organic solvent, pentaerythritol triarylate, dodecyl dimethyl tertiary amine, polyacrylic acid, zinc phosphate, silica powder, a fire retardant and a plasticizer are mixed and thermally treated, and then are cooled and ground to obtain the epoxy resin packaging material. The epoxy resin packaging material obtained through the method has the excellent electrical performance and mechanical performance.

Description

technical field [0001] The invention relates to a transformer material, in particular to an epoxy resin encapsulation material for a dry-type transformer and a preparation method thereof. Background technique [0002] The dry-type transformer is mainly composed of four components: iron core, high-voltage coil, low-voltage coil, and packaging layer. Among them, the iron core, high-voltage coil and low-voltage coil need packaging materials for packaging to achieve insulation and fixing. Currently, the most commonly used encapsulation layer material is epoxy resin. Epoxy resin is a widely used chemical raw material. It has flame retardant, flame retardant, and superior electrical properties. It has higher insulation strength than air and transformer oil. The transformer coil after casting has high mechanical strength and excellent moisture resistance. , Dustproof performance, widely used in urban power grids, especially places with high requirements for fire prevention and saf...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L33/10C08L89/00C08K13/04C08K7/14C08K3/36C08K3/22C08K3/34C08K3/14C08K3/32
Inventor 刘朝振卞传林高胜吴燕魏叶林
Owner WUHU JINNIU ELECTRIC
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