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Wave absorbing material and forming method thereof

A technology of wave absorbing material and wave absorbing agent, applied in the field of wave absorbing material, can solve problems such as insufficient wave absorbing ability, and achieve the effect of good wave absorbing ability and mechanical properties

Inactive Publication Date: 2016-01-27
KUANG CHI INNOVATIVE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of insufficient wave-absorbing capability in the prior art due to the need to coat objects with wave-absorbing materials, according to one aspect of the present invention, a wave-absorbing material is provided, including: one or more layers Resin film, comprising: resin: 50-200 parts; filler: 50-150 parts; and one or more layers of carrier; wherein, one or more layers of resin film and one or more layers of carrier are placed alternately; including absorber

Method used

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  • Wave absorbing material and forming method thereof

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preparation example Construction

[0035] Preparation method of absorbing material

[0036] Such as figure 1 As shown in step S101, use a high-speed mixer to mix the resin, and fillers including wave absorbers and reinforcing agents at room temperature to form a mixture, and the mixing time is between 30 minutes and 2 hours.

[0037] In the present invention, the resin used in step S101 may be thermosetting resin or thermoplastic resin. Thermoplastic resins that may be used in embodiments of the present invention include, but are not limited to, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polymethyl methacrylate, polyester, polyoxymethylene, polyamide, or polyphenylene oxide. one or any combination of them. Thermosetting resins that can be used in embodiments of the present invention include, but are not limited to, epoxy resins, polyester resins, epoxy resins, phenolic resins, cyanate ester resins, bismaleimide resins, melamine formaldehyde resins, furan resins, One of silicone resin or po...

Embodiment 1

[0051] At a temperature of 70°C, use a high-speed mixer to mix 140 parts of epoxy resin, 7 parts of dicyandiamide, 7 parts of ammonium acrylate, 140 parts of carbonyl iron powder and a reinforcing agent to form a mixture. The volume ratio of wave agent and strengthening agent) is 1:9, and the strengthening agent includes chopped fibers and silicon dioxide. Then use a roll coater to make a resin film from the mixture by a roll coater. Lay a layer of resin film and a layer of aramid cloth, and use an oven to cure the laminated composite, wherein the temperature is heated at 110°C for 1 hour and at 150°C for 3 hours. Finally, absorbing material is formed.

Embodiment 2

[0053] At a temperature of 70°C, use a high-speed mixer to mix 70 parts of bisphenol A cyanate, 10 parts of novolac epoxy resin, 2 parts of ammonium acrylate, 140 parts of carbonyl iron powder and fillers to form a mixture, in which the resin and The volume ratio of the filler (including wave absorbing agent and reinforcing agent) is 3.5:6.5, and the reinforcing agent includes alumina and calcium carbonate. Then use a roll coater to make a resin film from the mixture by a roll coater. Two layers of resin film and one layer of quartz cloth were laminated, and the laminated composite was cured in an oven, wherein the temperature was heated at 130°C for 1 hour and at 200°C for 3 hours. Finally, absorbing material is formed.

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Abstract

The present invention provides a wave absorbing material, which comprises one layer resin glue film or multiple layer resin glue films, and one-layer carrier or multiple layer carriers, wherein the resin glue film comprises 50-200 parts of a resin and 50-150 parts of a filler, the one layer resin glue film or multiple layer resin glue films and the one-layer carrier or multiple layer carriers are alternately placed, and the filler comprises a wave absorbing agent. The present invention further provides a wave absorbing material preparation method. According to the present invention, the wave absorbing material and the object requiring good wave absorbing capability are combined, such that the defect that only the coating or sheet adhering way can be used to preparing the wave absorbing material in the prior art is effectively solved; the wave absorbing material has characteristics of light weight and strong wave absorbing ability; and the fiber compounding way is used, such that the prepared wave absorbing material has good wave absorbing ability and good mechanical property.

Description

technical field [0001] The present invention generally relates to the field of wave-absorbing materials, and specifically relates to a wave-absorbing material and a forming method thereof. Background technique [0002] At present, the miniaturization and high integration of electronic components will generate a lot of electromagnetic interference and make the living environment unhealthy. Therefore, the method of suppressing electromagnetic noise will generate a large market. The absorber can effectively suppress electromagnetic noise. For example, the absorber can be used to reduce the reflection of radar waves, reduce the interference of radar signals to airborne equipment, and suppress the interference of low-frequency signals to communication equipment. Therefore, microwave absorbing components have broad application prospects in military and civilian fields, and the general trend of the development of microwave absorbing components is thinner thickness, lighter weight, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/20B32B27/26B32B27/08B32B17/10B32B37/02C08K3/08C08K3/36C08G59/40C08G59/56C08G59/50C08L79/04C08K3/22C08K3/26
Inventor 不公告发明人
Owner KUANG CHI INNOVATIVE TECH
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