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Method for measuring copper content in copper, nickel and manganese brazing filler metal

A technology of copper content, copper, nickel and manganese, which is applied in the direction of analysis by chemical reaction of materials and material analysis by observing the influence on chemical indicators, which can solve the problems of low measurement results, cumbersome experimental process, and reagent pollution. , to ensure the operability, the method is accurate and reliable, and the effect of improving the accuracy

Inactive Publication Date: 2015-04-29
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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Problems solved by technology

At present, there is no detection method standard for the analysis of the elemental composition of copper-nickel-manganese solder at home and abroad. The methods used in the current work of many testing centers are the chemical analysis methods of copper and copper alloys. Part 1: Determination of copper content (GB / T 5121.1-2008), Iron, Steel and Alloy Chemical Analysis Methods - Sodium Thiosulphate Separation Iodometric Method for Determination of Copper Content (GB / T 223.18-1994), Superalloy Chemical Analysis Methods Part 27: Copper Reagent - Ether Extraction Absorbance Photometry Determination of copper content (HB5220.27-2008) and methods for chemical analysis of nickel-based alloy powder Part 9: Determination of copper content-sodium thiosulfate iodometric method (YS / T 539.9-2009) and other method standards, but the above-mentioned standards exist Disadvantages such as complex operation steps, unsuitable measurement range and contamination of reagents (such as ether, etc.)
Due to the special composition of copper-nickel-manganese solder, the determination of the elements in it is more complicated, and if the sample dissolution method of nickel-based alloy powder, copper and copper alloy is simply applied, there are often incomplete dissolution of copper-nickel-manganese solder samples , The phenomenon of low measurement results
[0003] Regarding the analysis of copper elements in copper-nickel-manganese solder, there is no clear and accurate analysis method at home and abroad. Basically, the analysis methods of copper and copper alloys (GB / T 5121.1-2008) or other alloys are applied. Disadvantages such as large dosage, reagent pollution, unclear interference of coexisting elements, cumbersome experimental process, etc. lead to long analysis cycle

Method used

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Embodiment Construction

[0045] (1), the reagents used in the determination process are as follows:

[0046] (1.1), ammonium fluoride solution: 200g / L;

[0047] (1.2), starch solution (preparation for current use) 5g / L: weigh 1g of soluble starch, add a small amount of water to make a paste, then slowly pour into 200mL boiling water, stir and boil, dissolve and cool;

[0048] (1.3), sulfuric acid: 1+4;

[0049](1.4), Potassium thiocyanate solution, 100g / mL: Weigh 20g of potassium thiocyanate, put it in a 400mL beaker, add 50mL of water and stir until completely dissolved, dilute to 200mL with water, and shake well;

[0050] (1.5), potassium iodide: solid;

[0051] (1.6), copper standard solution with a mass fraction not less than 99.9%: 2.00mg / mL, weigh 2.0000g of pure copper, put it in a 300mL beaker, add 30mL of nitric acid 1+1, heat to dissolve, boil to remove nitrogen oxides , cooled to room temperature. Transfer the solution into a 1000mL volumetric flask, dilute to the mark with water, and s...

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Abstract

The invention belongs to the elemental analytic technology of copper, nickel and manganese brazing filler metal and relates to a method for measuring copper content in copper, nickel and manganese brazing filler metal. By treating the copper, nickel and manganese brazing filler metal by adopting 5-10mL of nitric acid, 5-10mL of hydrochloric acid and 0-10 drops of hydrofluoric acid, the method solves the problems that in the prior art, a sample dissolving reagent is great in dosage, samples are incompletely dissolved, experimental procedures are relatively tedious and the like. Copper in the copper, nickel and manganese brazing filler metal is measured by adopting a classical chemical method-sodium thiosulfate iodometry. As the copper, nickel and manganese brazing filler metal is free of standard substances matched with major elements, interference of coexistence elements on measuring the copper content is determined through a coexistence element interference test. The coexistence elements nickel and manganese do not affect measurement of the copper content but the coexistence element cobalt affects the judgment of a titration end point due to the inherent color of the element so as to affect the accuracy of the titration result. By integrating the conditions, the accuracy of analytic measurement is improved by selecting a nickel and copper alloy standard substances without cobalt element or with cobalt being less than or equal to 0.05%.

Description

technical field [0001] The invention belongs to the element analysis technology of copper-nickel-manganese solder, and relates to a method for measuring the copper content in copper-nickel-manganese solder. Background technique [0002] With the development of the national defense industry, new materials are constantly introduced, and the requirements for the composition of various materials with excellent performance are becoming more and more stringent. The content of impurity elements in the alloy has a very important influence on the performance of the material. Copper alloy solder is a widely used solder at present, including copper-zinc solder, copper-nickel solder, copper-phosphorus solder, copper-manganese solder, copper-germanium solder, copper-nickel-manganese solder, etc. The common feature of the materials is that some alloying elements such as zinc, nickel, phosphorus, manganese or several elements are added to the copper alloy at the same time, thereby changing...

Claims

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Application Information

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IPC IPC(8): G01N21/79
Inventor 付二红蒙益林杨春晟杨峥张艳茹
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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