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Polyamide acid resin composition, polyimide film using same, and method for producing said polyimide film

A polyamic acid resin, polyamic acid technology, applied in coating, transportation and packaging, thin material processing and other directions, can solve the problems of unavailability and high mechanical properties, and achieve the effect of excellent physical properties and low viscosity

Active Publication Date: 2015-04-08
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the degree of polymerization of the polyimide obtained by using this varnish is equal to that of the original polyamic acid, and high mechanical properties cannot be obtained

Method used

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  • Polyamide acid resin composition, polyimide film using same, and method for producing said polyimide film
  • Polyamide acid resin composition, polyimide film using same, and method for producing said polyimide film
  • Polyamide acid resin composition, polyimide film using same, and method for producing said polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0115] Hereinafter, although an Example etc. are given and this invention is demonstrated, this invention is not limited to these examples. In addition, regarding the measurement n number, unless otherwise specified, the measurement was performed with n=1.

[0116] (1) Viscosity measurement

[0117] The obtained varnish was diluted with N-methyl-2-pyrrolidone so that the solid content concentration became 10 mass %, and it measured at 25 degreeC using the viscometer (Toki Sangyo Co., Ltd. make, TVE-22H).

[0118] (2) Determination of weight average molecular weight

[0119] The weight average molecular weight was determined in terms of polystyrene using gel permeation chromatography (Waters 2690, manufactured by Nippon Waters Co., Ltd.). Tosoh TXK-GEL α-2500 and α-4000 manufactured by Tosoh Corporation were used as columns, and N-methyl-2-pyrrolidone was used as a mobile phase.

[0120] (3) Fabrication of polyimide film

[0121] The varnish was filtered under pressure usin...

Synthetic example 1

[0148] Synthesis Example 1: Compound A

[0149] A thermometer and a stirring bar with stirring wings were installed in a 300 mL 4-necked flask. Next, THF100g was injected|thrown-in under dry nitrogen gas flow, and it stirred at room temperature. Next, 10.00 g (49.94 mmol) of DAE and 61.01 mg (499.4 μmol) of DMAP were added and washed in with 10 g of THF. After cooling to 10° C. or lower, a diluted solution obtained by diluting 8.607 g (102.4 mmol) of diketene with 10 g of THF was added dropwise. After completion of the dropwise addition, the temperature was raised to 30° C. and stirred for 1 hour. After cooling, the precipitate was recovered by filtration. After drying, compound A represented by the following chemical formula (A) was obtained. The yield was 12.03 g (65% yield).

[0150]

Synthetic example 2

[0151] Synthesis Example 2: Compound B

[0152] A thermometer and a stirring bar with stirring wings were installed in a 300 mL 4-necked flask. Next, THF100g was injected|thrown-in under dry nitrogen gas flow, and it stirred at room temperature. Next, 10.00 g (92.47 mmol) of p-PDA and 113.0 mg (924.7 μmol) of DMAP were added and washed in with 10 g of THF. After cooling to 10° C. or lower, a diluted solution obtained by diluting 15.94 g (189.6 mmol) of diketene with 10 g of THF was added dropwise. After completion of the dropwise addition, the temperature was raised to 30° C. and stirred for 1 hour. After cooling, the precipitate was recovered by filtration. After recrystallization with ethanol and drying, compound B represented by the following chemical formula (B) was obtained. The yield was 19.99 g (yield 78%).

[0153]

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Abstract

The present invention addresses the problem of providing a polyamide acid resin composition which is able to be formed into a varnish that has a low viscosity, and which is capable of providing a coating film that exhibits excellent mechanical properties after being fired. The present invention also addresses the problem of providing a polyamide acid resin composition wherein a terminal acid anhydride group is less reacted with a diamine and less diamine is precipitated in a varnish. The problems can be solved by a polyamide acid resin composition which is characterized by containing (a) a polyamide acid and (b) a compound that is represented by chemical formula (1). (In chemical formula (1), Z represents a divalent or higher-valent organic group having 2 or more carbon atoms; V represents a structure that is represented by chemical formula (2); and k represents an integer of 2 or more.) (In chemical formula (2), delta represents an oxygen atom or a sulfur atom; W represents an electron-withdrawing group; and each of R11 and R12 independently represents a hydrogen atom or a hydrocarbon group having 1-10 carbon atoms.)

Description

technical field [0001] The present invention relates to a polyamic acid resin composition. In more detail, it relates to a surface protection film, an interlayer insulating film, an insulating layer of an organic electroluminescent element (organic EL element), a spacer layer, a flattening film of a thin film transistor substrate, and an insulating film of an organic transistor. polyamide layer, flexible printed substrate, substrate for flexible display, substrate for flexible electronic paper, substrate for flexible solar cell, substrate for flexible color filter, adhesive for electrode of lithium ion secondary battery, adhesive for semiconductor, etc. Acid resin composition. Background technique [0002] Polyimide is used in various fields including semiconductor applications due to its excellent electrical insulation, heat resistance, and mechanical properties. Polyimide is generally solvent-insoluble and heat-infusible, and it is difficult to directly mold it. Therefo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
CPCC08G73/10C08G73/1042C08G73/1053C08G73/1071Y10T428/31623C08G73/1035C08J5/18C08L79/08C08L2203/16C03C17/32C08G69/32C08G73/1067C09D179/08
Inventor 宫崎大地富川真佐夫
Owner TORAY IND INC
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